High Frequency Multilayer Chip Inductors for Telecommunications Infrastructure and Industrial Equipment / Medical Devices (HK series)

Features - Item Summary 6.8nH±5, 0.3A, 0402/1005 (EIA/JIS) - Lifecycle Stage Mass Production - Standard packaging quantity (minimum) Taping paper 10000pcs

文件：276.97 Kbytes 页数：2 Pages

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High Frequency Multilayer Chip Inductors for Telecommunications Infrastructure and Industrial Equipment / Medical Devices (HK series)

Features - Item Summary 7.5nH±5, 0.3A, 0402/1005 (EIA/JIS) - Lifecycle Stage Mass Production - Standard packaging quantity (minimum) Taping paper 10000pcs

文件：276.97 Kbytes 页数：2 Pages

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High Frequency Multilayer Chip Inductors for Telecommunications Infrastructure and Industrial Equipment / Medical Devices (HK series)

Features - Item Summary 82nH±5, 0.15A, 0402/1005 (EIA/JIS) - Lifecycle Stage Mass Production - Standard packaging quantity (minimum) Taping paper 10000pcs

文件：276.97 Kbytes 页数：2 Pages

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文件：823.45 Kbytes 页数：8 Pages

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MULTILAYER CHIP INDUCTORS FOR HIGH FREQUENCY APPLICATIONS(HK SERIES)

文件：749.35 Kbytes 页数：31 Pages

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Multilayer Chip Inductors for High Frequency

文件：143.25 Kbytes 页数：1 Pages

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MULTILAYER CHIP INDUCTORS FOR HIGH FREQUENCY APPLICATIONS(HK SERIES)

文件：749.35 Kbytes 页数：31 Pages

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MULTILAYER CHIP INDUCTORS FOR HIGH FREQUENCY APPLICATIONS(HK SERIES)

文件：659.21 Kbytes 页数：32 Pages

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文件：749.35 Kbytes 页数：31 Pages

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Multilayer Chip Inductors for High Frequency Applications

文件：143.25 Kbytes 页数：1 Pages

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