12, 15, 25, 35 Ampere Glass Passivated Bridge Rectifiers

Features • Integrally molded heatsink provided very low thermal resistance for maximum heat dissipation. • Surge Overload Ratings from 300 amperes to 400 amperes. • Isolated voltage from case to lead over 2500 volts. • UL certified, UL #E326243 • Terminals Finish Material - Silver (solder

文件：41.97 Kbytes 页数：3 Pages

Fairchild

仙童半导体

Bridge Rectifiers (Glass Passivated)

Features • Integrally Molded Heat−Sink Provided Very Low Thermal Resistance for Maximum Heat Dissipation • Surge Overload Ratings from 300 A to 400 A • Isolated Voltage from Case to Lead over 2500 V • UL Certified, UL #E258596 • Terminals Finish Material ♦ Silver (Solderable per MIL−STD−202

文件：329.32 Kbytes 页数：7 Pages

ONSEMI

安森美半导体

Bridge Rectifiers (Glass Passivated)

Features  Integrally Molded Heat−Sink Provided Very Low Thermal Resistance for Maximum Heat Dissipation  Surge Overload Ratings from 300 A to 400 A  Isolated Voltage from Case to Lead over 2500 V  UL Certified, UL #E258596  Terminals Finish Material  Silver (Solderable per MIL−STD−202

文件：244.58 Kbytes 页数：8 Pages

ONSEMI

安森美半导体

Bridge Rectifier GBPC Series

Features: •Plastic material •Integrally moulded heatsink provide very low thermal resistance for maximum heat dissipation •Surge overload ratings from 300 to 400A •Terminals solderable per MIL-STD-202, method 208 (for wire type) •Typical Ir less than 0.2μA •High temperature soldering guarant

文件：590.48 Kbytes 页数：3 Pages

MULTICOMP

易络盟

SINGLE PHASE BRIDGE

Description A range of extremely compact, encapsulated single phase bridge rectifiers offering efficient and reliable operation. They are intended for use in general purpose and instrumentation applications. Features ■ Universal, 3 way terminals: push-on, wrap around or solder ■ High thermal c

文件：131.29 Kbytes 页数：6 Pages

IRF

Glass Passivated Bridge Rectifiers

文件：272.95 Kbytes 页数：4 Pages

TSC

台湾半导体

丝印：GBPC12005；Package：GBPC4L；Bridge Rectifiers (Glass Passivated)

Features • Integrally Molded Heat−Sink Provided Very Low Thermal Resistance for Maximum Heat Dissipation • Surge Overload Ratings from 300 A to 400 A • Isolated Voltage from Case to Lead over 2500 V • UL Certified, UL #E258596 • Terminals Finish Material ♦ Silver (Solderable per MIL−STD−202

文件：329.32 Kbytes 页数：7 Pages

ONSEMI

安森美半导体

丝印：GBPC12005；Package：GBPC-4L；Bridge Rectifiers (Glass Passivated)

Features  Integrally Molded Heat−Sink Provided Very Low Thermal Resistance for Maximum Heat Dissipation  Surge Overload Ratings from 300 A to 400 A  Isolated Voltage from Case to Lead over 2500 V  UL Certified, UL #E258596  Terminals Finish Material  Silver (Solderable per MIL−STD−202

文件：244.58 Kbytes 页数：8 Pages

ONSEMI

安森美半导体

丝印：GBPC1201；Package：GBPC-4L；Bridge Rectifiers (Glass Passivated)

Features  Integrally Molded Heat−Sink Provided Very Low Thermal Resistance for Maximum Heat Dissipation  Surge Overload Ratings from 300 A to 400 A  Isolated Voltage from Case to Lead over 2500 V  UL Certified, UL #E258596  Terminals Finish Material  Silver (Solderable per MIL−STD−202

文件：244.58 Kbytes 页数：8 Pages

ONSEMI

安森美半导体

丝印：GBPC1201；Package：GBPC4L；Bridge Rectifiers (Glass Passivated)

Features • Integrally Molded Heat−Sink Provided Very Low Thermal Resistance for Maximum Heat Dissipation • Surge Overload Ratings from 300 A to 400 A • Isolated Voltage from Case to Lead over 2500 V • UL Certified, UL #E258596 • Terminals Finish Material ♦ Silver (Solderable per MIL−STD−202

文件：329.32 Kbytes 页数：7 Pages

ONSEMI

安森美半导体