| 型号 | 下载 订购 | 功能描述 | 制造商 上传企业 | LOGO |
|---|---|---|---|---|
T1 Dual Framer LIU DESCRIPTION The DS2196 T1 Dual Framer LIU is designed for T1 transmission equipment. The DS2196 combines dual optimized framers together with a line interface unit. This combination allows the DS2196 user to extract and insert Facility Data Link (FDL) messages in the receive and transmit paths, c 文件:734.11 Kbytes 页数:157 Pages | DALLAS | DALLAS | ||
T1 Dual Framer LIU DESCRIPTION The DS2196 T1 Dual Framer LIU is designed for T1 transmission equipment. The DS2196 combines dual optimized framers together with a line interface unit. This combination allows the DS2196 user to extract and insert Facility Data Link (FDL) messages in the receive and transmit paths, c 文件:734.11 Kbytes 页数:157 Pages | DALLAS | DALLAS | ||
4 X 3 Twelve Channel T1 Framer MULTI-CHIP MODULE (MCM) DESCRIPTION The Four x Four and Four x Three MCMs offer a high density packaging arrangement for the DS21Q42 T1 Enhanced Quad Framer. Either three (DS21FT42) or four (DS21FF42) silicon die of these devices is packaged in a Multi-Chip Module (MCM) with the electrical connec 文件:466.17 Kbytes 页数:145 Pages | DALLAS | DALLAS | ||
4x3 Twelve Channel E1 Framer, 4x4 Sixteen Channel E1 Framer MULTI-CHIP MODULE (MCM) DESCRIPTION The Four x Four and Four x Three MCMs offer a high density packaging arrangement for the DS21Q44 E1 Enhanced Quad Framer. Either three (DS21FT44) or four (DS21FF44) silicon die of these devices is packaged in a Multi-Chip Module (MCM) with the electrical connec 文件:678.12 Kbytes 页数:110 Pages | DALLAS | DALLAS | ||
Four x Three 12 Channel E1 Framer DESCRIPTION The DS21FT40 MCM offers a high density packaging arrangement for the DS21Q44 E1 Enhanced Quad Framer. Three DS21Q44 silicon die are packaged in a Multi-Chip Module (MCM) with the electrical connections as shown in Figure 1-1. The DS21FT40 is closely related to the DS21FT44. Most of th 文件:386.04 Kbytes 页数:87 Pages | DALLAS | DALLAS | ||
4 X 3 Twelve Channel T1 Framer MULTI-CHIP MODULE (MCM) DESCRIPTION The Four x Four and Four x Three MCMs offer a high density packaging arrangement for the DS21Q42 T1 Enhanced Quad Framer. Either three (DS21FT42) or four (DS21FF42) silicon die of these devices is packaged in a Multi-Chip Module (MCM) with the electrical connec 文件:466.17 Kbytes 页数:145 Pages | DALLAS | DALLAS | ||
4x3 Twelve Channel E1 Framer, 4x4 Sixteen Channel E1 Framer MULTI-CHIP MODULE (MCM) DESCRIPTION The Four x Four and Four x Three MCMs offer a high density packaging arrangement for the DS21Q44 E1 Enhanced Quad Framer. Either three (DS21FT44) or four (DS21FF44) silicon die of these devices is packaged in a Multi-Chip Module (MCM) with the electrical connec 文件:678.12 Kbytes 页数:110 Pages | DALLAS | DALLAS | ||
3.3V E1/T1/J1 Line Interface DESCRIPTION The DS21348 is a complete selectable E1 or T1 LIU for short-haul and long-haul applications. Throughout the data sheet, J1 is represented wherever T1 exists. Receive sensitivity adjusts automatically to the incoming signal and can be programmed for 0dB to 12 dB or 0dB to 43dB for E1 文件:551.83 Kbytes 页数:73 Pages | DALLAS | DALLAS | ||
3.3V E1/T1/J1 Line Interface DESCRIPTION The DS21348 is a complete selectable E1 or T1 LIU for short-haul and long-haul applications. Throughout the data sheet, J1 is represented wherever T1 exists. Receive sensitivity adjusts automatically to the incoming signal and can be programmed for 0dB to 12 dB or 0dB to 43dB for E1 文件:551.83 Kbytes 页数:73 Pages | DALLAS | DALLAS | ||
Quad T1 Framer DESCRIPTION The DS21Q41B combines four of the popular DS2141A T1 Controllers onto a single monolithic die. The “B” designation denotes that some new features are available in the Quad version that were not available in the single T1 device. The added features in the DS21Q41B are listed in Section 文件:714.47 Kbytes 页数:61 Pages | DALLAS | DALLAS |
晶体管资料
- 型号:
- 别名:
三极管、晶体管、晶体三极管
- 生产厂家:
- 制作材料:
- 性质:
低频或音频放大 (LF)_功率放大 (PA)
- 封装形式:
直插封装
- 极限工作电压:
80V
- 最大电流允许值:
2A
- 最大工作频率:
<1MHZ或未知
- 引脚数:
3
- 可代换的型号:
- 最大耗散功率:
20W
- 放大倍数:
- 图片代号:
B-91
- vtest:
80
- htest:
999900
- atest:
2
- wtest:
20
技术参数
- VRRS V:
70
- VDC V:
100
- IF(AV) A:
2
- IFSM A:
50
- VF * V:
0.85
- IR(MA)25℃:
0.3
- IR(MA)100℃:
3
- RθJL* ℃/W:
80
- Tj℃:
85
- Tstg℃:
-55℃~﹢125℃
| 供应商 | 型号 | 品牌 | 批号 | 封装 | 库存 | 备注 | 价格 |
|---|---|---|---|---|---|---|---|
NS |
23+ |
原厂标准封装 |
7000 |
询价 | |||
DALLAS |
QFP |
6688 |
1231 |
现货库存 |
询价 | ||
DALLS |
19+ |
QFP |
32000 |
原装正品,现货特价 |
询价 | ||
MAXIM/美信 |
24+ |
QFP44 |
30000 |
房间原装现货特价热卖,有单详谈 |
询价 | ||
Maxim/美信 |
24+ |
LQFP-100 |
6000 |
全新原装深圳仓库现货有单必成 |
询价 | ||
MAXIM(美信) |
25+ |
TSOP28 |
65485 |
百分百原装正品 真实公司现货库存 本公司只做原装 可 |
询价 | ||
DALLAS |
21+ |
SOP16 |
2700 |
百域芯优势 实单必成 可开13点增值税发票 |
询价 | ||
MAXIM |
2013+ |
10000 |
全新原装,正品热卖,大量现货供应。 |
询价 | |||
Maxim(美信) |
23+ |
15000 |
专业帮助客户找货 配单,诚信可靠! |
询价 | |||
MAXIM/美信 |
2450+ |
TSSOP |
8850 |
只做原装正品假一赔十为客户做到零风险!! |
询价 |
相关规格书
更多- NE5532
- NE5532
- NE5532
- NE5532
- NE5532
- NE5532A
- NE5532A
- UNE5532
- MAX232
- MAX232
- MAX232E
- MAX2325
- MAX2324
- MAX2321
- MAX2322
- MAX2320
- MAX232E-TD
- MAX232CPE
- SI7964DP
- SI7909DN
- SI7941DP
- SI7901EDN
- SI7940DP
- SI7956DP
- SI7980DP
- SI7902EDN
- SI7998DP
- SI7960DP
- SI7943DP
- SI7991DP
- SI7923DN
- SI7983DP
- SI7973DP
- SI7949DP
- SPC5605BF1MLQ6
- PI7C8150A
- PI7C8150DMAE
- XRCGB25M000F3N00R0
- WNS40H100CG
- MPC8540PX833LC
- TD62308BFG
- TD62308BP1G
- TD62308BF
- TL074
- TL074
相关库存
更多- NE5532
- NE5532
- NE5532
- NE5532
- NE5532A
- NE5532-TD
- NE5532NB
- MAX232
- MAX232
- MAX232
- MAX232A
- MAX2323
- MAX2326
- MAX2327
- MAX232E
- MAX232E
- MAX232ESE
- NE5533
- SI7970DP
- SI7958DP
- SI7913DN
- SI7942DP
- SI7911DN
- SI7900EDN
- SI7922DN
- SI7946DP
- SI7945DP
- SI7921DN
- SI7905DN
- SI7938DP
- SI7925DN
- SI7948DP
- SI7946ADP
- SE1
- PI7C8150B
- PI7C8150DNDE
- PERICOMPI7C8150
- WNS40H100C
- WNS40H100CB
- TD62308
- TD62308APG
- TD62308AFG
- GRM21BR71H104JA11#
- TL074
- TL074

