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DS2196L

T1 Dual Framer LIU

DESCRIPTION The DS2196 T1 Dual Framer LIU is designed for T1 transmission equipment. The DS2196 combines dual optimized framers together with a line interface unit. This combination allows the DS2196 user to extract and insert Facility Data Link (FDL) messages in the receive and transmit paths, c

文件:734.11 Kbytes 页数:157 Pages

DALLAS

DS2196LN

T1 Dual Framer LIU

DESCRIPTION The DS2196 T1 Dual Framer LIU is designed for T1 transmission equipment. The DS2196 combines dual optimized framers together with a line interface unit. This combination allows the DS2196 user to extract and insert Facility Data Link (FDL) messages in the receive and transmit paths, c

文件:734.11 Kbytes 页数:157 Pages

DALLAS

DS21FF42

4 X 3 Twelve Channel T1 Framer

MULTI-CHIP MODULE (MCM) DESCRIPTION The Four x Four and Four x Three MCMs offer a high density packaging arrangement for the DS21Q42 T1 Enhanced Quad Framer. Either three (DS21FT42) or four (DS21FF42) silicon die of these devices is packaged in a Multi-Chip Module (MCM) with the electrical connec

文件:466.17 Kbytes 页数:145 Pages

DALLAS

DS21FF44

4x3 Twelve Channel E1 Framer, 4x4 Sixteen Channel E1 Framer

MULTI-CHIP MODULE (MCM) DESCRIPTION The Four x Four and Four x Three MCMs offer a high density packaging arrangement for the DS21Q44 E1 Enhanced Quad Framer. Either three (DS21FT44) or four (DS21FF44) silicon die of these devices is packaged in a Multi-Chip Module (MCM) with the electrical connec

文件:678.12 Kbytes 页数:110 Pages

DALLAS

DS21FT40

Four x Three 12 Channel E1 Framer

DESCRIPTION The DS21FT40 MCM offers a high density packaging arrangement for the DS21Q44 E1 Enhanced Quad Framer. Three DS21Q44 silicon die are packaged in a Multi-Chip Module (MCM) with the electrical connections as shown in Figure 1-1. The DS21FT40 is closely related to the DS21FT44. Most of th

文件:386.04 Kbytes 页数:87 Pages

DALLAS

DS21FT42

4 X 3 Twelve Channel T1 Framer

MULTI-CHIP MODULE (MCM) DESCRIPTION The Four x Four and Four x Three MCMs offer a high density packaging arrangement for the DS21Q42 T1 Enhanced Quad Framer. Either three (DS21FT42) or four (DS21FF42) silicon die of these devices is packaged in a Multi-Chip Module (MCM) with the electrical connec

文件:466.17 Kbytes 页数:145 Pages

DALLAS

DS21FT44

4x3 Twelve Channel E1 Framer, 4x4 Sixteen Channel E1 Framer

MULTI-CHIP MODULE (MCM) DESCRIPTION The Four x Four and Four x Three MCMs offer a high density packaging arrangement for the DS21Q44 E1 Enhanced Quad Framer. Either three (DS21FT44) or four (DS21FF44) silicon die of these devices is packaged in a Multi-Chip Module (MCM) with the electrical connec

文件:678.12 Kbytes 页数:110 Pages

DALLAS

DS21Q348

3.3V E1/T1/J1 Line Interface

DESCRIPTION The DS21348 is a complete selectable E1 or T1 LIU for short-haul and long-haul applications. Throughout the data sheet, J1 is represented wherever T1 exists. Receive sensitivity adjusts automatically to the incoming signal and can be programmed for 0dB to 12 dB or 0dB to 43dB for E1

文件:551.83 Kbytes 页数:73 Pages

DALLAS

DS21Q348N

3.3V E1/T1/J1 Line Interface

DESCRIPTION The DS21348 is a complete selectable E1 or T1 LIU for short-haul and long-haul applications. Throughout the data sheet, J1 is represented wherever T1 exists. Receive sensitivity adjusts automatically to the incoming signal and can be programmed for 0dB to 12 dB or 0dB to 43dB for E1

文件:551.83 Kbytes 页数:73 Pages

DALLAS

DS21Q41B

Quad T1 Framer

DESCRIPTION The DS21Q41B combines four of the popular DS2141A T1 Controllers onto a single monolithic die. The “B” designation denotes that some new features are available in the Quad version that were not available in the single T1 device. The added features in the DS21Q41B are listed in Section

文件:714.47 Kbytes 页数:61 Pages

DALLAS

晶体管资料

  • 型号:

    DS21

  • 别名:

    三极管、晶体管、晶体三极管

  • 生产厂家:

  • 制作材料:

  • 性质:

    低频或音频放大 (LF)_功率放大 (PA)

  • 封装形式:

    直插封装

  • 极限工作电压:

    80V

  • 最大电流允许值:

    2A

  • 最大工作频率:

    <1MHZ或未知

  • 引脚数:

    3

  • 可代换的型号:

  • 最大耗散功率:

    20W

  • 放大倍数:

  • 图片代号:

    B-91

  • vtest:

    80

  • htest:

    999900

  • atest:

    2

  • wtest:

    20

技术参数

  • VRRS V:

    70

  • VDC V:

    100

  • IF(AV) A:

    2

  • IFSM A:

    50

  • VF * V:

    0.85

  • IR(MA)25℃:

    0.3

  • IR(MA)100℃:

    3

  • RθJL* ℃/W:

    80

  • Tj℃:

    85

  • Tstg℃:

    -55℃~﹢125℃

供应商型号品牌批号封装库存备注价格
DALLAS
2015+
SOP/DIP
19889
一级代理原装现货,特价热卖!
询价
NS
23+
原厂标准封装
7000
询价
DS
24+
QFP
25000
一级专营品牌全新原装热卖
询价
MAXIM/美信
2022+
5000
只做原装,价格优惠,长期供货。
询价
DALLAS
1
全新原装 货期两周
询价
DALLAS
23+
BGA
65480
询价
MAX
13+
TSSOP28P
4630
原装分销
询价
DALLAS
24+
TQFP44
1313
大批量供应优势库存热卖
询价
DALLAS
25+
TQFP
12000
全新进口原装正品假一罚十
询价
DALLAS
23+
PLCC-28
120000
十七年VIP会员,诚信经营,一手货源,原装正品可零售!
询价
更多DS21供应商 更新时间2026-1-17 16:38:00