丝印：D15；Package：SOT-23；SMD Zener

文件：195.91 Kbytes 页数：1 Pages

TAITRON

丝印：D1513；Package：TO-92；TO-92 Plastic-Encapsulate Transistors

FEATURES Low Collector Saturation High DC Current Gain Complementary to The 2SB1068 PNP Transistor

文件：1.46179 Mbytes 页数：4 Pages

DGNJDZ

南晶电子

丝印：D1513；Package：TO-92；TO-92 Plastic-Encapsulate Transistors

FEATURES Low Collector Saturation High DC Current Gain Complementary to The 2SB1068 PNP Transistor

文件：1.46179 Mbytes 页数：4 Pages

DGNJDZ

南晶电子

丝印：D15SAL；Package：TO-277B；SMD Schottky Barrier Rectifiers

Features - Metal silicon junction, majority carrier conduction. - High surge capability. - High temperature soldering guaranteed: 260°C/10 seconds. - High current capability, low forward voltage drop.

文件：475.15 Kbytes 页数：4 Pages

COMCHIP

典琦

丝印：D15SCL；Package：TO-277B；SMD Schottky Barrier Rectifiers

Features - Metal silicon junction, majority carrier conduction. - High surge capability. - High temperature soldering guaranteed: 260°C/10 seconds. - High current capability, low forward voltage drop.

文件：474.84 Kbytes 页数：4 Pages

COMCHIP

典琦

丝印：D15SDL；Package：TO-277B；SMD Schottky Barrier Rectifiers

Features - Metal silicon junction, majority carrier conduction. - High forward surge current capability. - High temperature soldering guaranteed: 260°C/10 seconds. - low forward voltage drop.

文件：477.31 Kbytes 页数：4 Pages

COMCHIP

典琦

丝印：D15S45L；Package：TO-277B；SMD Schottky Barrier Rectifiers

Features - Metal silicon junction, majority carrier conduction. - High surge capability. - High temperature soldering guaranteed: 260°C/10 seconds. - High current capability, low forward voltage drop.

文件：473.88 Kbytes 页数：4 Pages

COMCHIP

典琦

丝印：D15S60L；Package：TO-277B；SMD Schottky Barrier Rectifiers

Features - Metal silicon junction, majority carrier conduction. - High surge capability. - High temperature soldering guaranteed: 260°C/10 seconds. - High current capability, low forward voltage drop.

文件：473.38 Kbytes 页数：4 Pages

COMCHIP

典琦

丝印：D15JA05；Package：JA；Bridge Rectifiers

Features UL recognition, file #£230084 Glass passivated chip junction Thin single in-line package High surge current capability Solder dip 275 °C max. 7 s, per JESD 22-B106

文件：1.00206 Mbytes 页数：3 Pages

RFE

RFE international

丝印：D15JA10；Package：JA；Bridge Rectifiers

Features UL recognition, file #£230084 Glass passivated chip junction Thin single in-line package High surge current capability Solder dip 275 °C max. 7 s, per JESD 22-B106

文件：1.00206 Mbytes 页数：3 Pages

RFE

RFE international