首页 >CSD95372AQ5M>规格书列表
| 型号 | 下载 订购 | 功能描述 | 制造商 上传企业 | LOGO |
|---|---|---|---|---|
CSD95372AQ5M | 丝印：95372AM；Package：LSON-CLIP；CSD95372AQ5M Synchronous Buck NexFET™ Power Stage 1 Features 1• 60 A Continuous Operating Current Capability • 92.4% System Efficiency at 30 A • Ultra-Low Power Loss of 3.3 W at 30 A • High Frequency Operation (up to 2 MHz) • High Density - SON 5 x 6 mm Footprint • Ultra-Low Inductance Package • System Optimized PCB Footprint • 3.3 V 文件：712.42 Kbytes 页数：25 Pages | TI 德州仪器 | TI | |
CSD95372AQ5M | 丝印：95372AM；Package：LSON-CLIP(DQP)；CSD95372AQ5M Synchronous Buck NexFET™ Power Stage 1 Features 1• 60 A Continuous Operating Current Capability • 92.4% System Efficiency at 30 A • Ultra-Low Power Loss of 3.3 W at 30 A • High Frequency Operation (up to 2 MHz) • High Density - SON 5 x 6 mm Footprint • Ultra-Low Inductance Package • System Optimized PCB Footprint • 3.3 V 文件：712.88 Kbytes 页数：25 Pages | TI 德州仪器 | TI | |
CSD95372AQ5M | Synchronous Buck NexFET??Power Stage 文件：1.13811 Mbytes 页数：24 Pages | TI 德州仪器 | TI | |
丝印：95372AM；Package：LSON-CLIP；CSD95372AQ5M Synchronous Buck NexFET™ Power Stage 1 Features 1• 60 A Continuous Operating Current Capability • 92.4% System Efficiency at 30 A • Ultra-Low Power Loss of 3.3 W at 30 A • High Frequency Operation (up to 2 MHz) • High Density - SON 5 x 6 mm Footprint • Ultra-Low Inductance Package • System Optimized PCB Footprint • 3.3 V 文件：712.42 Kbytes 页数：25 Pages | TI 德州仪器 | TI | ||
CSD95372AQ5M Synchronous Buck NexFET™ Power Stage 1 Features 1• 60 A Continuous Operating Current Capability • 92.4% System Efficiency at 30 A • Ultra-Low Power Loss of 3.3 W at 30 A • High Frequency Operation (up to 2 MHz) • High Density - SON 5 x 6 mm Footprint • Ultra-Low Inductance Package • System Optimized PCB Footprint • 3.3 V 文件：712.88 Kbytes 页数：25 Pages | TI 德州仪器 | TI | ||
CSD95372AQ5M Synchronous Buck NexFET™ Power Stage 1 Features 1• 60 A Continuous Operating Current Capability • 92.4% System Efficiency at 30 A • Ultra-Low Power Loss of 3.3 W at 30 A • High Frequency Operation (up to 2 MHz) • High Density - SON 5 x 6 mm Footprint • Ultra-Low Inductance Package • System Optimized PCB Footprint • 3.3 V 文件：712.88 Kbytes 页数：25 Pages | TI 德州仪器 | TI | ||
丝印：95372AM；Package：LSON-CLIP(DQP)；CSD95372AQ5M Synchronous Buck NexFET™ Power Stage 1 Features 1• 60 A Continuous Operating Current Capability • 92.4% System Efficiency at 30 A • Ultra-Low Power Loss of 3.3 W at 30 A • High Frequency Operation (up to 2 MHz) • High Density - SON 5 x 6 mm Footprint • Ultra-Low Inductance Package • System Optimized PCB Footprint • 3.3 V 文件：712.88 Kbytes 页数：25 Pages | TI 德州仪器 | TI | ||
丝印：95372AM；Package：LSON-CLIP；CSD95372AQ5M Synchronous Buck NexFET™ Power Stage 1 Features 1• 60 A Continuous Operating Current Capability • 92.4% System Efficiency at 30 A • Ultra-Low Power Loss of 3.3 W at 30 A • High Frequency Operation (up to 2 MHz) • High Density - SON 5 x 6 mm Footprint • Ultra-Low Inductance Package • System Optimized PCB Footprint • 3.3 V 文件：712.42 Kbytes 页数：25 Pages | TI 德州仪器 | TI | ||
CSD95372AQ5M Synchronous Buck NexFET™ Power Stage 1 Features 1• 60 A Continuous Operating Current Capability • 92.4% System Efficiency at 30 A • Ultra-Low Power Loss of 3.3 W at 30 A • High Frequency Operation (up to 2 MHz) • High Density - SON 5 x 6 mm Footprint • Ultra-Low Inductance Package • System Optimized PCB Footprint • 3.3 V 文件：712.88 Kbytes 页数：25 Pages | TI 德州仪器 | TI | ||
CSD95372AQ5M Synchronous Buck NexFET™ Power Stage 1 Features 1• 60 A Continuous Operating Current Capability • 92.4% System Efficiency at 30 A • Ultra-Low Power Loss of 3.3 W at 30 A • High Frequency Operation (up to 2 MHz) • High Density - SON 5 x 6 mm Footprint • Ultra-Low Inductance Package • System Optimized PCB Footprint • 3.3 V 文件：712.88 Kbytes 页数：25 Pages | TI 德州仪器 | TI |
产品属性
- 产品编号：
CSD95372AQ5M
- 制造商：
Texas Instruments
- 类别：
集成电路（IC） > 全半桥驱动器
- 系列：
NexFET™
- 包装：
卷带（TR）剪切带（CT）Digi-Reel® 得捷定制卷带
- 输出配置：
半桥
- 应用：
同步降压转换器
- 接口：
PWM
- 负载类型：
电感
- 技术：
功率 MOSFET
- 电流 - 输出/通道：
60A
- 电流 - 峰值输出：
90A
- 电压 - 供电：
4.5V ~ 5.5V
- 电压 - 负载：
4.5V ~ 16V
- 工作温度：
-55°C ~ 150°C（TJ）
- 特性：
自举电路，状态标志
- 故障保护：
超温，击穿，UVLO
- 安装类型：
表面贴装型
- 封装/外壳：
12-PowerLFDFN
- 供应商器件封装：
12-LSON-CLIP（5x6）
- 描述：
IC SYNC BUCK NEXFET 12SON
| 供应商 | 型号 | 品牌 | 批号 | 封装 | 库存 | 备注 | 价格 |
|---|---|---|---|---|---|---|---|
22+ |
VQFN-CLIP-28 |
2400 |
原装正品,假一罚十! |
询价 | |||
TI/德州仪器 |
25+ |
SON12 |
32360 |
TI/德州仪器全新特价CSD95372AQ5M即刻询购立享优惠#长期有货 |
询价 | ||
TI |
24+ |
LSON12 |
5630 |
TI一级代理原厂授权渠道实单支持 |
询价 | ||
TI |
16+ |
LSON12 |
32500 |
全新原装现货供应2 |
询价 | ||
TI/德州仪器 |
23+ |
LSON12 |
18204 |
原装正品代理渠道价格优势 |
询价 | ||
TI |
21+ |
LSON-12 |
6600 |
全新原装公司现货
|
询价 | ||
2202 |
60000 |
询价 | |||||
TI |
23+ |
LSON-CLIP-12 |
30000 |
全新原装正品 |
询价 | ||
TI/德州仪器 |
22+ |
QFN |
9854 |
原装正品现货假一罚十 |
询价 | ||
Texas Instruments |
25+ |
LSON12 |
18000 |
TI优势渠道,大量原装库存现货,交期快,欢迎询价。 |
询价 |
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