丝印：95372AM；Package：LSON-CLIP；CSD95372AQ5M Synchronous Buck NexFET™ Power Stage

1 Features 1• 60 A Continuous Operating Current Capability • 92.4% System Efficiency at 30 A • Ultra-Low Power Loss of 3.3 W at 30 A • High Frequency Operation (up to 2 MHz) • High Density - SON 5 x 6 mm Footprint • Ultra-Low Inductance Package • System Optimized PCB Footprint • 3.3 V

文件：712.42 Kbytes 页数：25 Pages

TI

德州仪器

丝印：95372AM；Package：LSON-CLIP；CSD95372AQ5M Synchronous Buck NexFET™ Power Stage

1 Features 1• 60 A Continuous Operating Current Capability • 92.4% System Efficiency at 30 A • Ultra-Low Power Loss of 3.3 W at 30 A • High Frequency Operation (up to 2 MHz) • High Density - SON 5 x 6 mm Footprint • Ultra-Low Inductance Package • System Optimized PCB Footprint • 3.3 V

文件：712.42 Kbytes 页数：25 Pages

TI

德州仪器

丝印：95372AM；Package：LSON-CLIP；CSD95372AQ5M Synchronous Buck NexFET™ Power Stage

1 Features 1• 60 A Continuous Operating Current Capability • 92.4% System Efficiency at 30 A • Ultra-Low Power Loss of 3.3 W at 30 A • High Frequency Operation (up to 2 MHz) • High Density - SON 5 x 6 mm Footprint • Ultra-Low Inductance Package • System Optimized PCB Footprint • 3.3 V

文件：712.42 Kbytes 页数：25 Pages

TI

德州仪器