丝印：95377M；Package：VSON-CLIP；CSD95377Q4M Synchronous Buck NexFET™ Power Stage

1 Features 1• Above 94% System Efficiency at 15 A • Max Rated Continuous Current 35 A • High-Frequency Operation (up to 2 MHz) • High-Density SON 3.5-mm × 4.5-mm Footprint • Ultra-Low Inductance Package • System-Optimized PCB Footprint • 3.3-V and 5-V PWM Signal Compatible • Diode Emul

文件：607.04 Kbytes 页数：21 Pages

TI

德州仪器

丝印：95377M；Package：VSON-CLIP；CSD95377Q4M Synchronous Buck NexFET™ Power Stage

1 Features 1• Above 94% System Efficiency at 15 A • Max Rated Continuous Current 35 A • High-Frequency Operation (up to 2 MHz) • High-Density SON 3.5-mm × 4.5-mm Footprint • Ultra-Low Inductance Package • System-Optimized PCB Footprint • 3.3-V and 5-V PWM Signal Compatible • Diode Emul

文件：607.04 Kbytes 页数：21 Pages

TI

德州仪器

丝印：95377M；Package：VSON-CLIP；CSD95377Q4M Synchronous Buck NexFET™ Power Stage

1 Features 1• Above 94% System Efficiency at 15 A • Max Rated Continuous Current 35 A • High-Frequency Operation (up to 2 MHz) • High-Density SON 3.5-mm × 4.5-mm Footprint • Ultra-Low Inductance Package • System-Optimized PCB Footprint • 3.3-V and 5-V PWM Signal Compatible • Diode Emul

文件：607.04 Kbytes 页数：21 Pages

TI

德州仪器

丝印：95377M；Package：VSON-CLIP；CSD95377Q4M Synchronous Buck NexFET™ Power Stage

1 Features 1• Above 94% System Efficiency at 15 A • Max Rated Continuous Current 35 A • High-Frequency Operation (up to 2 MHz) • High-Density SON 3.5-mm × 4.5-mm Footprint • Ultra-Low Inductance Package • System-Optimized PCB Footprint • 3.3-V and 5-V PWM Signal Compatible • Diode Emul

文件：607.04 Kbytes 页数：21 Pages

TI

德州仪器