| 型号 | 下载 订购 | 功能描述 | 制造商 上传企业 | LOGO |
|---|---|---|---|---|
PELTIER MODULE DESCRIPTION: PELTIER MODULE FEATURES • solid state device • 2-stage cooler • precise temperature control • quiet operation 文件:377.75 Kbytes 页数:4 Pages | CUI | CUI | ||
Power Transistor NPN - Silicon Power Transistor Chip PROCESS DETAILS Die Size 68 x 68 MILS Die Thickness 9.5 MILS Base Bonding Pad Area 18 x 11 MILS Emitter Bonding Pad Area 18 x 12 MILS Top Side Metalization Al - 45,000Å Back Side Metalization Ti/Ni/Ag - (3000Å, 10,000Å, 10,000Å) 文件:34.76 Kbytes 页数:1 Pages | CENTRAL | CENTRAL | ||
PELTIER MODULE DESCRIPTION: PELTIER MODULE FEATURES • solid state device • 2-stage cooler • precise temperature control • quiet operation 文件:377.75 Kbytes 页数:4 Pages | CUI | CUI | ||
Power Transistor 4.0 Amp NPN Silicon Power Transistor Chip PROCESS DETAILS Die Size 105 x 105 MILS Die Thickness 9.5 MILS Base Bonding Pad Area 32 x 22 MILS Emitter Bonding Pad Area 33 x 24 MILS Top Side Metalization Al - 45,000Å Back Side Metalization Ti/Ni/Ag - (3000Å, 10,000Å, 10,000Å) 文件:37.2 Kbytes 页数:1 Pages | CENTRAL | CENTRAL | ||
Power Transistor 8.0 Amp NPN Silicon Power Transistor Chip PROCESS DETAILS Die Size 130 x 130 MILS Die Thickness 9.5 MILS Base Bonding Pad Area 37 x 20 MILS Emitter Bonding Pad Area 38 x 20 MILS Top Side Metalization Al - 45,000Å Back Side Metalization Ti/Ni/Ag - (3000Å, 10,000Å, 10,000Å) 文件:44.6 Kbytes 页数:1 Pages | CENTRAL | CENTRAL | ||
Power Transistors 8.0 Amp NPN - High Voltage Transistor Chip PROCESS DETAILS Die Size 167 x 167 MILS Die Thickness 9.5 MILS Base Bonding Pad Area 59 x 29 MILS Emitter Bonding Pad Area 64 x 28 MILS Top Side Metalization Al - 45,000Å Back Side Metalization Ti/Ni/Ag - 3,000Å, 10,000Å, 10,000Å 文件:40.17 Kbytes 页数:1 Pages | CENTRAL | CENTRAL | ||
NPN - Power Transistor Die 1.5 Amp, 400 Volt 文件:400.08 Kbytes 页数:4 Pages | CENTRAL | CENTRAL | ||
NPN - Darlington Transistor Die 20 Amp, 120 Volt 文件:544.72 Kbytes 页数:5 Pages | CENTRAL | CENTRAL | ||
CP28 | 包装:散装 类别:工具 螺丝和螺母起子 描述:SCREWDRIVER,#2X8\ | ATG | ATG | |
电容触摸按键 / 可编程,PWM控制器,SOC,UART | Chiphomer 启攀微电子 | Chiphomer |
技术参数
- Case:
Chip_Packaging
- Configuration/ Description:
Bare die 67.953 X 67.953
- Polarity:
NPN
- IC MAX:
1.5A
- PD MAX:
40W
- VCEO MAX:
400V
- hFE MIN:
5
- hFE MAX:
25
- @VCE:
2V
- VCE(SAT) MAX:
1V
- @IC:
1A
- @IB:
250mA
- Cob TYP:
40pF
- fT MIN:
4MHz
| 供应商 | 型号 | 品牌 | 批号 | 封装 | 库存 | 备注 | 价格 |
|---|---|---|---|---|---|---|---|
CUI |
22+ |
NA |
65 |
加我QQ或微信咨询更多详细信息, |
询价 | ||
25+ |
SOP |
2987 |
只售原装自家现货!诚信经营!欢迎来电! |
询价 | |||
PHI |
23+ |
PLCC44 |
3600 |
绝对全新原装!现货!特价!请放心订购! |
询价 | ||
A |
24+ |
b |
6 |
询价 | |||
CAT |
23+ |
SOP8 |
50000 |
全新原装正品现货,支持订货 |
询价 | ||
CAT |
2026+ |
SOP8 |
1498 |
原装正品,假一罚十! |
询价 | ||
MX-COM |
24+ |
SOP |
6618 |
公司现货库存,支持实单 |
询价 | ||
CAT |
2016+ |
SOP8 |
3000 |
只做原装,假一罚十,公司可开17%增值税发票! |
询价 | ||
CAT |
23+ |
SOP8 |
5000 |
原装正品,假一罚十 |
询价 | ||
CAT |
24+ |
原厂原封 |
6000 |
原装进口香港现货价优 |
询价 |
相关规格书
更多- NE5532
- NE5532
- NE5532
- NE5532
- NE5532
- NE5532A
- NE5532A
- UNE5532
- MAX232
- MAX232
- MAX232E
- MAX2325
- MAX2324
- MAX2321
- MAX2322
- MAX2320
- MAX232E-TD
- MAX232CPE
- SI7964DP
- SI7909DN
- SI7941DP
- SI7901EDN
- SI7940DP
- SI7956DP
- SI7980DP
- SI7902EDN
- SI7998DP
- SI7960DP
- SI7943DP
- SI7991DP
- SI7923DN
- SI7983DP
- SI7973DP
- SI7949DP
- SPC5605BF1MLQ6
- PI7C8150A
- PI7C8150DMAE
- XRCGB25M000F3N00R0
- WNS40H100CG
- MPC8540PX833LC
- TD62308BFG
- TD62308BP1G
- TD62308BF
- TL074
- TL074
相关库存
更多- NE5532
- NE5532
- NE5532
- NE5532
- NE5532A
- NE5532-TD
- NE5532NB
- MAX232
- MAX232
- MAX232
- MAX232A
- MAX2323
- MAX2326
- MAX2327
- MAX232E
- MAX232E
- MAX232ESE
- NE5533
- SI7970DP
- SI7958DP
- SI7913DN
- SI7942DP
- SI7911DN
- SI7900EDN
- SI7922DN
- SI7946DP
- SI7945DP
- SI7921DN
- SI7905DN
- SI7938DP
- SI7925DN
- SI7948DP
- SI7946ADP
- SE1
- PI7C8150B
- PI7C8150DNDE
- PERICOMPI7C8150
- WNS40H100C
- WNS40H100CB
- TD62308
- TD62308APG
- TD62308AFG
- GRM21BR71H104JA11#
- TL074
- TL074

