CDBER0230L-HF整流器件资料datasheet下载库存现货-114ic电子网

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CDBER0230R	文件：201.49 Kbytes Page：4 Pages	SMDSchottkyBarrierDiode Io=200mA VR=30Volts Features Lowreversecurrent. Designedformountingonsmallsurface. Extremelythin/leadlesspackage. Majoritycarrierconduction. Mechanicaldata Case:0503(1308)standardpackage,moldedplastic. Terminals:Goldplated,solderableperMIL-S	COMCHIPComchip Technology 典琦典琦科技股份有限公司	COMCHIP
CDBER0230R-HF	文件：201.77 Kbytes Page：4 Pages	SMDSchottkyBarrierDiode Io=200mA VR=30Volts RoHSDevice HalogenFree Features -Lowforwardvoltage. -Designedformountingonsmallsurface. -Extremelythin/leadlesspackage. -Majoritycarrierconduction. Mechanicaldata -Case:0503/SOD-723Fstandardpackage,moldedplastic. -Terminals:Goldplated	COMCHIPComchip Technology 典琦典琦科技股份有限公司	COMCHIP
CDBERT0230R	文件：130.84 Kbytes Page：4 Pages	SMDSchottkyBarrierDiode Io=200mA VR=30Volts Features Lowreversecurrent. Designedformountingonsmallsurface. Extremelythin/leadlesspackage. Majoritycarrierconduction. Mechanicaldata Case:0503(1308)standardpackage,moldedplastic. Terminals:Goldplated,solderableperMIL-S	COMCHIPComchip Technology 典琦典琦科技股份有限公司	COMCHIP
CDBF0230	文件：65.65 Kbytes Page：2 Pages	SMDSchottkyBarrierDiode Io=200mA VR=30Volts Features Designedformountingonsmallsurface. Extremelythin/leadlesspackage. Lowdrop-downvoltage. Majoritycarrierconduction. Mechanicaldata Case:1005(2512)Standardpackage,moldedplastic. Terminals:Goldplated,solderableperMIL	COMCHIPComchip Technology 典琦典琦科技股份有限公司	COMCHIP
CDBF0230-HF	文件：200.87 Kbytes Page：4 Pages	SMDSchottkyBarrierDiode Io=200mA RoHSDevice HalogenFree VR=30Volts Features -Designedformountingonsmallsurface. -Extremelythin/leadlesspackage. -Majoritycarrierconduction. -Lowdrop-downvoltage. Mechanicaldata -Case:1005/SOD-323Fstandardpackage,moldedplastic. -Terminals:Goldplat	COMCHIPComchip Technology 典琦典琦科技股份有限公司	COMCHIP
CDBF0230L	文件：124 Kbytes Page：2 Pages	SMDSchottkyBarrierDiode Io=200mA VR=30Volts Features LowforwardVoltage Designedformountingonsmallsurface. Extremelythin/leadlesspackage. Majoritycarrierconduction. Mechanicaldata Case:SOD-323F(2512)Standardpackage,moldedplastic. Terminals:Goldplated,solderableperMI	COMCHIPComchip Technology 典琦典琦科技股份有限公司	COMCHIP
CDBF0230L-HF	文件：152.4 Kbytes Page：4 Pages	SMDSchottkyBarrierDiode Io=200mA VR=30Volts Features Halogenfree. Lowforwardvoltage. Designedformountingonsmallsurface. Extremelythin/leadlesspackage. Majoritycarrierconduction. Mechanicaldata Case:1005(2512)standardpackagemoldedplastic. Terminals:Goldplated,sol	COMCHIPComchip Technology 典琦典琦科技股份有限公司	COMCHIP
CDBF0230R	文件：124.43 Kbytes Page：2 Pages	SMDSchottkyBarrierDiode Io=200mA VR=30Volts Features LowforwardVoltage Designedformountingonsmallsurface. Extremelythin/leadlesspackage. Majoritycarrierconduction. Mechanicaldata Case:SOD-323F(2512)Standardpackage,moldedplastic. Terminals:Goldplated,solderableperMI	COMCHIPComchip Technology 典琦典琦科技股份有限公司	COMCHIP
CDBF0230R-HF	文件：201.22 Kbytes Page：4 Pages	SMDSchottkyBarrierDiode Io=200mA VR=30Volts Features Halogenfree. Lowreversecurrent. Designedformountingonsmallsurface. Extremelythin/leadlesspackage. Majoritycarrierconduction. Mechanicaldata Case:1005(2512)standardpackage,moldedplastic. Terminals:Goldplated,solde	COMCHIPComchip Technology 典琦典琦科技股份有限公司	COMCHIP
CDBFR0230	文件：76.39 Kbytes Page：2 Pages	SMDSchottkyBarrierDiode Io=200mA VR=30Volts Features Designedformountingonsmallsurface. Extremelythin/leadlesspackage. Lowdrop-downvoltage. Majoritycarrierconduction. Mechanicaldata Case:1005(2512)standardpackage, moldedplastic. Terminals:Goldplated	COMCHIPComchip Technology 典琦典琦科技股份有限公司	COMCHIP
CDBFR0230-HF	文件：235.91 Kbytes Page：4 Pages	SMDSchottkyBarrierDiode Io=200mA VR=30Volts RoHSDevice HalogenFree Features -Designedformountingonsmallsurface. -Extremelythin/leadlesspackage. -Lowdrop-downvoltage. -Majoritycarrierconduction. Mechanicaldata -Case:1005/SOD-323Fstandardpackage, moldedplastic. -Terminals:Gold	COMCHIPComchip Technology 典琦典琦科技股份有限公司	COMCHIP
CDBFR0230L	文件：71.17 Kbytes Page：2 Pages	SMDSchottkyBarrierDiode Io=200mA VR=30Volts Features Lowforwardvoltage. Designedformountingonsmallsurface. Extremelythin/leadlesspackage. Majoritycarrierconduction. Mechanicaldata Case:1005(2512)standardpackage moldedplastic. Terminals:Goldplated,solde	COMCHIPComchip Technology 典琦典琦科技股份有限公司	COMCHIP
CDBFR0230L-HF	文件：129.949 Kbytes Page：4 Pages	SMDSchottkyBarrierDiode Io=200mA RoHSDevice HalogenFree VR=30Volts Features -Lowforwardvoltage. -Designedformountingonsmallsurface. -Extremelythin/leadlesspackage. -Majoritycarrierconduction. Mechanicaldata -Case:1005/SOD-323Fstandardpackage, moldedplastic. -Terminals:Gold	COMCHIPComchip Technology 典琦典琦科技股份有限公司	COMCHIP
CDBFR0230R-HF	文件：129.509 Kbytes Page：4 Pages	SMDSchottkyBarrierDiode Io=200mA VR=30Volts RoHSDevice HalogenFree Features -Lowreversecurrent. -Designedformountingonsmallsurface. -Extremelythin/leadlesspackage. -Majoritycarrierconduction. Mechanicaldata -Case:1005/SOD-323Fstandardpackage, moldedplastic. -Terminals:Gold	COMCHIPComchip Technology 典琦典琦科技股份有限公司	COMCHIP
CDBH0230-F-HF	文件：503.2 Kbytes Page：5 Pages	SMDSmallSignalSchottkyDiodes Features -Extremelyfastswitchingspeed. -Lowforwardvoltage.	COMCHIPComchip Technology 典琦典琦科技股份有限公司	COMCHIP
CDBH0230-G	文件：105.75 Kbytes Page：4 Pages	SMDSmallSignalSchottkyDiodes	COMCHIPComchip Technology 典琦典琦科技股份有限公司	COMCHIP
CDBH0230-G	文件：105.75 Kbytes Page：4 Pages	SMDSmallSignalSchottkyDiodes	COMCHIPComchip Technology 典琦典琦科技股份有限公司	COMCHIP
CDBH0230-HF	文件：503.2 Kbytes Page：5 Pages	SMDSmallSignalSchottkyDiodes Features -Extremelyfastswitchingspeed. -Lowforwardvoltage.	COMCHIPComchip Technology 典琦典琦科技股份有限公司	COMCHIP
CDBH0230-H-HF	文件：503.2 Kbytes Page：5 Pages	SMDSmallSignalSchottkyDiodes Features -Extremelyfastswitchingspeed. -Lowforwardvoltage.	COMCHIPComchip Technology 典琦典琦科技股份有限公司	COMCHIP
CDBN0230	文件：62.51 Kbytes Page：2 Pages	SMDSchottkyBarrierDiode Io=200mA VR=30Volts Features Designedformountingonsmallsurface Extremelythinpackage Lowstoredcharge Majoritycarrierconduction Mechanicaldata Case:1206(3216)Standardpackage,moldedplastic. Terminals:Solderplated,solderableperMIL-STD-750,method	COMCHIPComchip Technology 典琦典琦科技股份有限公司	COMCHIP

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供应商	型号	品牌	批号	封装	库存	备注	价格
深圳市河锋鑫科技有限公司	CDBER0230L-HF整流器件	COMCHIP/典琦科技	2010	SOD	36000	原装正品可含税交易	询价
深圳市大联智电子有限公司	CDBER0230L-HF整流器件	COMCHIP/典琦科技	22+	SOD	354000		询价
深圳市广弘电子有限公司	CDBER0230L-HF整流器件	CDBER0230L-HF 整流器件	2010	SOD	36000		询价
深圳市联成美业电子有限公司	CDBER0230L-HF整流器件	COMCHIP/典琦科技	22+		36000		询价
深圳市一线半导体有限公司	CDBER0230R	Comchip	07+/08+		7500	0503(1308metric)	询价
深圳市博浩通科技有限公司	CDBER0230R	COMCHIP	23+	503	7750	全新原装优势	询价
深圳市科雨电子有限公司	CDBER0230R	COMCHIP	1809+	SOD-723	16750	就找我吧!--邀您体验愉快问购元件!	询价
深圳市易讯博科技有限公司	CDBER0230R	Comchip	22+	NA	75	加我QQ或微信咨询更多详细信息,	询价
深圳市宏捷佳电子科技有限公司	CDBER0230R	Comchip Technology	24+	0503/SOD-723F	9350	独立分销商,公司只做原装,诚心经营,免费试样正品保证	询价
现代芯城（深圳）科技有限公司	CDBER0230R		24+	N/A	56000	一级代理-主营优势-实惠价格-不悔选择	询价

更多CDBER0230L-HF整流器件供应商更新时间2024-9-24 14:00:00

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