CC2564MODX中文资料德州仪器数据手册PDF规格书

1.1 Features 1

• Module Solution Based on TI's CC2564B Dual-

Mode Bluetooth®, Available in Two Variants:

– CC2564MODA With Integrated Antenna

– CC2564MODN With External Antenna

• Fully Certified Module for FCC, IC, CE, and

Bluetooth 4.1

– FCC (Z64-2564N), IC (451I-2564N) Modular

Grant (see Section 6.2.1.3, Section 7.1.1, and

Section 7.1.2)

– CE Certified as Summarized in the Declaration

of Conformity (see Section 7.1.3)

– Bluetooth 4.1 Controller Subsystem Qualified

(CC2564MODN: QDID 55257; CC2564MODA:

QDID 64631). Compliant up to the HCI Layer

• Highly Optimized for Design Into Small Form

Factor Systems and Flexibility:

– CC2564MODA

– Integrated Chip Antenna

– Module Footprint: 35 Terminals, 0.8-mm

Pitch, 7 mm × 14 mm × 1.4 mm (Typical)

– CC2564MODN

– Single-Ended 50-Ω RF Interface

– Module Footprint: 33 Terminals, 0.8-mm

Pitch, 7 mm × 7 mm × 1.4 mm (Typical)

• BR and EDR Features Include:

– Up to Seven Active Devices

– Scatternet: Up to Three Piconets

Simultaneously, One as Master and Two as

Slaves

– Up to Two Synchronous Connection Oriented

(SCO) Links on the Same Piconet

– Support for All Voice Air-Coding—Continuously

Variable Slope Delta (CVSD), A-Law, μ-Law,

and Transparent (Uncoded)

– Assisted Mode for HFP 1.6 Wideband Speech

(WBS) Profile or A2DP Profile to Reduce Host

Processing and Power

– Support of Multiple Bluetooth Profiles With

Enhanced QoS

• Low Energy Features Include:

– Support of up to 10 Simultaneous Connections

– Multiple Sniff Instances Tightly Coupled to

Achieve Minimum Power Consumption

– Independent Buffering for Low Energy Allows

Large Numbers of Multiple Connections Without

Affecting BR or EDR Performance

– Built-In Coexistence and Prioritization Handling

for BR, EDR, and Low Energy

• Best-in-Class Bluetooth (RF) Performance (TX

Power, RX Sensitivity, Blocking)

– Class 1.5 TX Power up to +10 dBm

– –93 dbm Typical RX Sensitivity

– Internal Temperature Detection and

Compensation to Ensure Minimal Variation in

RF Performance Over Temperature, No

External Calibration Required

– Improved Adaptive Frequency Hopping (AFH)

Algorithm With Minimum Adaptation Time

– Provides Longer Range, Including Twice the

Range of Other Low-Energy-Only Solutions

• Advanced Power Management for Extended

Battery Life and Ease of Design

– On-Chip Power Management, Including Direct

Connection to Battery

– Low Power Consumption for Active, Standby,

and Scan Bluetooth Modes

– Shutdown and Sleep Modes to Minimize Power

Consumption

• Physical Interfaces:

– UART Interface With Support for Maximum

Bluetooth Data Rates

– UART Transport Layer (H4) With Maximum

Rate of 4 Mbps

– Three-Wire UART Transport Layer (H5) With

Maximum Rate of 4 Mbps

– Fully Programmable Digital Pulse-Code

Modulation (PCM)–I2S Codec Interface

• CC256x Bluetooth Hardware Evaluation Tool:

PC-Based Application to Evaluate RF Performance

of the Device and Configure Service Pack

1.2 Applications

• Mobile Accessories

• Sports and Fitness Applications

• Wireless Audio Solutions

• Set-Top Boxes and Remote Controls

• Toys

• Test and Measurement

• Industrial: Cable Replacement

• Wireless Sensors

• Automotive Aftermarket

• Wellness and Health

1.3 Description

The CC2564MODx module from Texas Instruments™ is a complete Bluetooth® BR/EDR, and low energy

HCI solution that reduces design effort, cost, and time to market. The CC2564MODx module includes TI's

seventh-generation core and provides a versatile, product-proven solution that is Bluetooth 4.1-compliant.

The module is also certified for FCC, IC, and CE, requiring no prior RF experience to develop with this

device; and the device includes a royalty-free software stack compatible with several host MCUs and

MPUs. The CC2564MODx module provides best-in-class RF performance with transmit power and receive

sensitivity that provides twice the range and higher throughput than other Bluetooth-low-energy-only

solutions.

Furthermore, TI’s power-management hardware and software algorithms provide significant power savings

in all commonly used Bluetooth BR/EDR and low energy modes of operation.

The TI dual-mode Bluetooth stack software is certified and provided royalty free for TI's MSP430™ and

MSP432™ ARM® Cortex®-M3 and ARM® Cortex®-M4 MCUs, and Linux® based MPUs. Other processors

can be supported through TI's third party. The iPod® (MFi) protocol is supported by add-on software

packages. Multiple profiles and sample applications, including the following, are supported:

• Serial port profile (SPP)

• Advanced audio distribution profile (A2DP)

• Audio/video remote control profile (AVRCP)

• Hands-free profile (HFP)

• Human interface device (HID)

• Generic attribute profile (GATT)

• Several Bluetooth low energy profiles and services

For more information, see TI Dual-Mode Bluetooth Stack.

In addition to software, the BOOST-CC2564MODA and CC2564MODxEM evaluation boards are available

for each variant. For more information on TI’s wireless platform solutions for Bluetooth, see TI's wirelessconnectivity/

dual-mode-bluetooth page.