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CC2564CRF/IF射频/中频RFID的射频收发器IC规格书PDF中文资料

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厂商型号

CC2564C

参数属性

CC2564C 封装/外壳为76-VQFN 双排裸露焊盘;包装为托盘;类别为RF/IF射频/中频RFID的射频收发器IC;产品描述:IC RF TXRX+MCU BLE 4.2 76VQFN

功能描述

CC2564C Dual-Mode Bluetooth® Controller

封装外壳

76-VQFN 双排裸露焊盘

文件大小

788.93 Kbytes

页面数量

58

生产厂商

TI

中文名称

德州仪器

网址

网址

数据手册

下载地址一下载地址二到原厂下载

更新时间

2025-10-4 14:30:00

人工找货

CC2564C价格和库存,欢迎联系客服免费人工找货

CC2564C规格书详情

1.1 Features 1

• TI's Single-Chip Bluetooth® Solution With

Bluetooth Basic Rate (BR), Enhanced Data Rate

(EDR), and Low Energy (LE) Support

• Bluetooth 5.1 Delaration ID D049226

• Highly Optimized for Size-Constrained and Low-

Cost Designs:

– Single-Ended 50-Ω RF Interface

– VQFNP-MR Package Family, RVM Footprint: 76

Terminals, 0.6-mm Pitch, 8-mm × 8-mm

• BR and EDR Features Include:

– Up to Seven Active Devices

– Scatternet: Up to Three Piconets

Simultaneously, One as Master and Two as

Slaves

– Up to Two Synchronous Connection Oriented

(SCO) Links on the Same Piconet

– Support for All Voice Air-Coding—Continuously

Variable Slope Delta (CVSD), A-Law, μ-Law,

Modified Subband Coding (mSBC), and

Transparent (Uncoded)

– Provide an Assisted Mode for HFP 1.6

Wideband Speech (WBS) Profile or A2DP

Profile to Reduce Host Processing and Power

– Support of Multiple Bluetooth Profiles With

Enhanced QoS

• Low Energy Features Include:

– Multiple Sniff Instances Tightly Coupled to

Achieve Minimum Power Consumption

– Independent Buffering for Low Energy Allows

Large Numbers of Multiple Connections Without

Affecting BR or EDR Performance

– Built-In Coexistence and Prioritization Handling

for BR, EDR, and Low Energy

– Capabilities of Link Layer Topology

Scatternet—Can Act Concurrently as Peripheral

and Central

– Network Support for up to 10 Devices

– Time Line Optimization Algorithms to Achieve

Maximum Channel Utliization

• Best-in-Class Bluetooth (RF) Performance (TX

Power, RX Sensitivity, Blocking)

– Class 1 TX Power up to +12 dBm

– Internal Temperature Detection and

Compensation to Ensure Minimal Variation in

RF Performance Over Temperature, No

External Calibration Required

– Improved Adaptive Frequency Hopping (AFH)

Algorithm With Minimum Adaptation Time

– Longer Range, Including Twice the Range of

Other Low-Energy-Only Solutions

• Advanced Power Management for Extended

Battery Life and Ease of Design

– On-Chip Power Management, Including Direct

Connection to Battery

– Low Power Consumption for Active, Standby,

and Scan Bluetooth Modes

– Shutdown and Sleep Modes to Minimize Power

Consumption

• Physical Interfaces:

– UART Interface With Support for Maximum

Bluetooth Data Rates

– UART Transport Layer (H4) With Maximum

Rate of 4 Mbps

– Three-Wire UART Transport Layer (H5) With

Maximum Rate of 4 Mbps

– Fully Programmable Digital Pulse-Code

Modulation (PCM)–I2S Codec Interface

• Flexibility for Easy Stack Integration and Validation

Into MCUs and MPUs

• HCI Tester Tool to Evaluate RF Performance of

the Device and Configure Service Pack

1.2 Applications

• Wireless Audio Solutions

• mPOS

• Medical Devices

• Set-Top Boxes (STBs)

• Wearable Devices

• Sensor Hub, Sensor Gateway

– Home and Factory Automation

1.3 Description

The CC2564C device from Texas Instruments™ is a complete Bluetooth® BR/EDR, and low energy HCI

level solution, providing high performance and robust Bluetooth solution. Based on TI’s seventhgeneration

Bluetooth core, the CC2564C device provides a product-proven solution that is Bluetooth 5.1-

compliant, adding LE security and enhancing support for complex topologies (dual mode and link layer

topologies). This HCI device offers best-in-class RF performance with about twice the throughput of other

Bluetooth low-energy solutions, and includes a royalty-free software stack compatible with several host

MCUs and MPUs, for a complete Bluetooth solution. Furthermore, TI’s power-management hardware and

software algorithms provide significant power savings in all commonly used Bluetooth BR, EDR, and low

energy modes of operation.

The TI dual-mode Bluetooth stack software is certified and provided royalty free for MCUs and MPUs. The

iPod® (MFi) protocol is supported by add-on software packages. For more information, see TI Dual-Mode

Bluetooth Stack. Multiple profiles and sample applications, including the following, are supported:

Serial port profile (SPP)

Advanced audio distribution profile (A2DP)

Audio/video remote control profile (AVRCP)

Hands-free profile (HFP)

Human interface device (HID)

Generic attribute profile (GATT)

Several Bluetooth low energy profiles and services

产品属性

  • 产品编号:

    CC2564CRVMT

  • 制造商:

    Texas Instruments

  • 类别:

    RF/IF,射频/中频和 RFID > 射频收发器 IC

  • 包装:

    托盘

  • 类型:

    TxRx + MCU

  • 射频系列/标准:

    蓝牙

  • 协议:

    蓝牙 v4.2

  • 调制:

    4DQPSK,8DPSK,GFSK

  • 频率:

    2.4GHz

  • 功率 - 输出:

    12dBm

  • 灵敏度:

    -95dBm

  • 串行接口:

    UART

  • 电压 - 供电:

    1.7V ~ 4.8V

  • 电流 - 传输:

    112.5mA

  • 工作温度:

    -40°C ~ 85°C

  • 安装类型:

    表面贴装型

  • 封装/外壳:

    76-VQFN 双排裸露焊盘

  • 供应商器件封装:

    76-VQFNP-MR(8x8)

  • 描述:

    IC RF TXRX+MCU BLE 4.2 76VQFN

供应商 型号 品牌 批号 封装 库存 备注 价格
TI(德州仪器)
24+/25+
10000
原装正品现货库存价优
询价
TI/德州仪器
22+
CQFNP76
2500
原装正品
询价
TI
24+
SMD
8000
射频收发器
询价
TI
23+
N/A
7566
原厂原装
询价
TI/德州仪器
20+
NA
53650
TI原装主营-可开原型号增税票
询价
TI/德州仪器
22+
CQFNP76
8000
原装正品,支持实单!
询价
TI
17+
VQFN
5810
一级代理,专注军工、汽车、医疗、工业、新能源、电力
询价
TI
2023+
VFQFN76
6000
原装正品现货、支持第三方检验、终端BOM表可配单提供
询价
TI
25
VFQFN76
6000
原装正品
询价
TI
24+
SO|16
8230
免费送样原盒原包现货一手渠道联系
询价