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CC2564CRVMTRF/IF射频/中频RFID的射频收发器IC规格书PDF中文资料

厂商型号 |
CC2564CRVMT |
参数属性 | CC2564CRVMT 封装/外壳为76-VQFN 双排裸露焊盘;包装为托盘;类别为RF/IF射频/中频RFID的射频收发器IC;产品描述:IC RF TXRX+MCU BLE 4.2 76VQFN |
功能描述 | CC2564C Dual-Mode Bluetooth® Controller |
丝印标识 | |
封装外壳 | VQFNP-MR / 76-VQFN 双排裸露焊盘 |
文件大小 |
788.93 Kbytes |
页面数量 |
58 页 |
生产厂商 | TI |
中文名称 | 德州仪器 |
网址 | |
数据手册 | |
更新时间 | 2025-10-4 15:09:00 |
人工找货 | CC2564CRVMT价格和库存,欢迎联系客服免费人工找货 |
CC2564CRVMT规格书详情
1.1 Features 1
• TI's Single-Chip Bluetooth® Solution With
Bluetooth Basic Rate (BR), Enhanced Data Rate
(EDR), and Low Energy (LE) Support
• Bluetooth 5.1 Delaration ID D049226
• Highly Optimized for Size-Constrained and Low-
Cost Designs:
– Single-Ended 50-Ω RF Interface
– VQFNP-MR Package Family, RVM Footprint: 76
Terminals, 0.6-mm Pitch, 8-mm × 8-mm
• BR and EDR Features Include:
– Up to Seven Active Devices
– Scatternet: Up to Three Piconets
Simultaneously, One as Master and Two as
Slaves
– Up to Two Synchronous Connection Oriented
(SCO) Links on the Same Piconet
– Support for All Voice Air-Coding—Continuously
Variable Slope Delta (CVSD), A-Law, μ-Law,
Modified Subband Coding (mSBC), and
Transparent (Uncoded)
– Provide an Assisted Mode for HFP 1.6
Wideband Speech (WBS) Profile or A2DP
Profile to Reduce Host Processing and Power
– Support of Multiple Bluetooth Profiles With
Enhanced QoS
• Low Energy Features Include:
– Multiple Sniff Instances Tightly Coupled to
Achieve Minimum Power Consumption
– Independent Buffering for Low Energy Allows
Large Numbers of Multiple Connections Without
Affecting BR or EDR Performance
– Built-In Coexistence and Prioritization Handling
for BR, EDR, and Low Energy
– Capabilities of Link Layer Topology
Scatternet—Can Act Concurrently as Peripheral
and Central
– Network Support for up to 10 Devices
– Time Line Optimization Algorithms to Achieve
Maximum Channel Utliization
• Best-in-Class Bluetooth (RF) Performance (TX
Power, RX Sensitivity, Blocking)
– Class 1 TX Power up to +12 dBm
– Internal Temperature Detection and
Compensation to Ensure Minimal Variation in
RF Performance Over Temperature, No
External Calibration Required
– Improved Adaptive Frequency Hopping (AFH)
Algorithm With Minimum Adaptation Time
– Longer Range, Including Twice the Range of
Other Low-Energy-Only Solutions
• Advanced Power Management for Extended
Battery Life and Ease of Design
– On-Chip Power Management, Including Direct
Connection to Battery
– Low Power Consumption for Active, Standby,
and Scan Bluetooth Modes
– Shutdown and Sleep Modes to Minimize Power
Consumption
• Physical Interfaces:
– UART Interface With Support for Maximum
Bluetooth Data Rates
– UART Transport Layer (H4) With Maximum
Rate of 4 Mbps
– Three-Wire UART Transport Layer (H5) With
Maximum Rate of 4 Mbps
– Fully Programmable Digital Pulse-Code
Modulation (PCM)–I2S Codec Interface
• Flexibility for Easy Stack Integration and Validation
Into MCUs and MPUs
• HCI Tester Tool to Evaluate RF Performance of
the Device and Configure Service Pack
1.2 Applications
• Wireless Audio Solutions
• mPOS
• Medical Devices
• Set-Top Boxes (STBs)
• Wearable Devices
• Sensor Hub, Sensor Gateway
– Home and Factory Automation
1.3 Description
The CC2564C device from Texas Instruments™ is a complete Bluetooth® BR/EDR, and low energy HCI
level solution, providing high performance and robust Bluetooth solution. Based on TI’s seventhgeneration
Bluetooth core, the CC2564C device provides a product-proven solution that is Bluetooth 5.1-
compliant, adding LE security and enhancing support for complex topologies (dual mode and link layer
topologies). This HCI device offers best-in-class RF performance with about twice the throughput of other
Bluetooth low-energy solutions, and includes a royalty-free software stack compatible with several host
MCUs and MPUs, for a complete Bluetooth solution. Furthermore, TI’s power-management hardware and
software algorithms provide significant power savings in all commonly used Bluetooth BR, EDR, and low
energy modes of operation.
The TI dual-mode Bluetooth stack software is certified and provided royalty free for MCUs and MPUs. The
iPod® (MFi) protocol is supported by add-on software packages. For more information, see TI Dual-Mode
Bluetooth Stack. Multiple profiles and sample applications, including the following, are supported:
Serial port profile (SPP)
Advanced audio distribution profile (A2DP)
Audio/video remote control profile (AVRCP)
Hands-free profile (HFP)
Human interface device (HID)
Generic attribute profile (GATT)
Several Bluetooth low energy profiles and services
产品属性
- 产品编号:
CC2564CRVMT
- 制造商:
Texas Instruments
- 类别:
RF/IF,射频/中频和 RFID > 射频收发器 IC
- 包装:
托盘
- 类型:
TxRx + MCU
- 射频系列/标准:
蓝牙
- 协议:
蓝牙 v4.2
- 调制:
4DQPSK,8DPSK,GFSK
- 频率:
2.4GHz
- 功率 - 输出:
12dBm
- 灵敏度:
-95dBm
- 串行接口:
UART
- 电压 - 供电:
1.7V ~ 4.8V
- 电流 - 传输:
112.5mA
- 工作温度:
-40°C ~ 85°C
- 安装类型:
表面贴装型
- 封装/外壳:
76-VQFN 双排裸露焊盘
- 供应商器件封装:
76-VQFNP-MR(8x8)
- 描述:
IC RF TXRX+MCU BLE 4.2 76VQFN
供应商 | 型号 | 品牌 | 批号 | 封装 | 库存 | 备注 | 价格 |
---|---|---|---|---|---|---|---|
TI |
23+ |
76-VQFN |
25000 |
TI现货商!原装正品! |
询价 | ||
TI(德州仪器) |
24+ |
N/A |
6000 |
原厂原装现货订货价格优势终端BOM表可配单提供样品 |
询价 | ||
TI(德州仪器) |
23+ |
N/A |
6000 |
公司只做原装,可来电咨询 |
询价 | ||
TI |
23+ |
76VQFN Dual Rows |
9000 |
原装正品,支持实单 |
询价 | ||
TI(德州仪器) |
24+ |
N/A |
17600 |
原装正品现货支持实单 |
询价 | ||
TI |
24+ |
SMD |
8000 |
射频收发器 |
询价 | ||
TI/德州仪器 |
20+ |
NA |
53650 |
TI原装主营-可开原型号增税票 |
询价 | ||
TI(德州仪器) |
2511 |
N/A |
6000 |
电子元器件采购降本 30%!盈慧通原厂直采,砍掉中间差价 |
询价 | ||
TI(德州仪器) |
24+ |
N/A |
20000 |
现货 |
询价 | ||
TI(德州仪器) |
25+ |
N/A |
6000 |
原装,请咨询 |
询价 |