CC2564MODA中文资料具有基本速率、增强数据速率和带集成天线的低功耗 (LE) 模块的 Bluetooth® 4.1数据手册TI规格书

描述 Description

The CC2564MODx module from Texas Instruments™ is a complete Bluetooth® BR/EDR, and low energy HCI solution that reduces design effort, cost, and time to market. The CC2564MODx module includes TI's seventh-generation core and provides a versatile, product-proven solution that is Bluetooth 4.1-compliant. The module is also certified for FCC, IC, and CE, requiring no prior RF experience to develop with this device; and the device includes a royalty-free software stack compatible with several host MCUs and MPUs. The CC2564MODx module provides best-in-class RF performance with transmit power and receive sensitivity that provides twice the range and higher throughput than other Bluetooth-low-energy-only solutions. Furthermore, TI’s power-management hardware and software algorithms provide significant power savings in all commonly used Bluetooth BR/EDR and low energy modes of operation. The TI dual-mode Bluetooth stack software is certified and provided royalty free for TI's MSP430™ and MSP432™ ARM® Cortex®-M3 and ARM® Cortex®-M4 MCUs, and Linux® based MPUs. Other processors can be supported through TI's third party. The iPod® (MFi) protocol is supported by add-on software packages. Multiple profiles and sample applications, including the following, are supported: Serial port profile (SPP) Advanced audio distribution profile (A2DP) Audio/video remote control profile (AVRCP) Hands-free profile (HFP) Human interface device (HID) Generic attribute profile (GATT) Several Bluetooth low energy profiles and servicesFor more information, see TI Dual-Mode Bluetooth Stack. In addition to software, the BOOST-CC2564MODA and CC2564MODxEM evaluation boards are available for each variant. For more information on TI’s wireless platform solutions for Bluetooth, see TI's wireless-connectivity/dual-mode-bluetooth page.

特性 Features

• Module Solution Based on TI's CC2564B Dual-Mode Bluetooth®, Available in Two Variants:
• CC2564MODN With External Antenna
• Fully Certified Module for FCC, IC, CE, and Bluetooth 4.1
• CE Certified as Summarized in the Declaration of Conformity (see Section 7.1.3)
• Highly Optimized for Design Into Small Form Factor Systems and Flexibility:
• Integrated Chip Antenna
• CC2564MODN
• Module Footprint: 33 Terminals, 0.8-mm Pitch, 7 mm × 7 mm × 1.4 mm (Typical)
• BR and EDR Features Include:
• Scatternet: Up to Three Piconets Simultaneously, One as Master and Two as Slaves
• Support for All Voice Air-Coding—Continuously Variable Slope Delta (CVSD), A-Law, µ-Law, and Transparent (Uncoded)
• Support of Multiple Bluetooth Profiles With Enhanced QoS
• Low Energy Features Include:
• Multiple Sniff Instances Tightly Coupled to Achieve Minimum Power Consumption
• Built-In Coexistence and Prioritization Handling for BR, EDR, and Low Energy
• Best-in-Class Bluetooth (RF) Performance (TX Power, RX Sensitivity, Blocking)
• –93 dbm Typical RX Sensitivity
• Improved Adaptive Frequency Hopping (AFH) Algorithm With Minimum Adaptation Time
• Advanced Power Management for Extended Battery Life and Ease of Design
• Low Power Consumption for Active, Standby, and Scan Bluetooth Modes
• Physical Interfaces:
• UART Transport Layer (H4) With Maximum Rate of 4 Mbps
• Fully Programmable Digital Pulse-Code Modulation (PCM)–I2S Codec Interface
• CC256x Bluetooth Hardware Evaluation Tool: PC-Based Application to Evaluate RF Performance of the Device and Configure Service Pack