CC2564MODA数据手册开发板套件编程器的射频评估开发套件开发板规格书PDF

描述 Description

The CC2564MODx module from Texas Instruments™ is a complete Bluetooth® BR/EDR, and low energy HCI solution that reduces design effort, cost, and time to market. The CC2564MODx module includes TI's seventh-generation core and provides a versatile, product-proven solution that is Bluetooth 4.1-compliant. The module is also certified for FCC, IC, and CE, requiring no prior RF experience to develop with this device; and the device includes a royalty-free software stack compatible with several host MCUs and MPUs. The CC2564MODx module provides best-in-class RF performance with transmit power and receive sensitivity that provides twice the range and higher throughput than other Bluetooth-low-energy-only solutions. Furthermore, TI’s power-management hardware and software algorithms provide significant power savings in all commonly used Bluetooth BR/EDR and low energy modes of operation. The TI dual-mode Bluetooth stack software is certified and provided royalty free for TI's MSP430™ and MSP432™ ARM® Cortex®-M3 and ARM® Cortex®-M4 MCUs, and Linux® based MPUs. Other processors can be supported through TI's third party. The iPod® (MFi) protocol is supported by add-on software packages. Multiple profiles and sample applications, including the following, are supported: Serial port profile (SPP) Advanced audio distribution profile (A2DP) Audio/video remote control profile (AVRCP) Hands-free profile (HFP) Human interface device (HID) Generic attribute profile (GATT) Several Bluetooth low energy profiles and servicesFor more information, see TI Dual-Mode Bluetooth Stack. In addition to software, the BOOST-CC2564MODA and CC2564MODxEM evaluation boards are available for each variant. For more information on TI’s wireless platform solutions for Bluetooth, see TI's wireless-connectivity/dual-mode-bluetooth page.

特性 Features

• Module Solution Based on TI's CC2564B Dual-Mode Bluetooth®, Available in Two Variants:
• CC2564MODA With Integrated Antenna
• CC2564MODN With External Antenna

• Fully Certified Module for FCC, IC, CE, and Bluetooth 4.1
• FCC (Z64-2564N), IC (451I-2564N) Modular Grant (see Section 6.2.1.3, Section 7.1.1, and Section 7.1.2)
• CE Certified as Summarized in the Declaration of Conformity (see Section 7.1.3)
• Bluetooth 4.1 Controller Subsystem Qualified (CC2564MODN: QDID 55257; CC2564MODA: QDID 64631). Compliant up to the HCI Layer

• Highly Optimized for Design Into Small Form Factor Systems and Flexibility:
• CC2564MODA
• Integrated Chip Antenna
• Module Footprint: 35 Terminals, 0.8-mm Pitch, 7 mm × 14 mm × 1.4 mm (Typical)

• CC2564MODN
• Single-Ended 50-Ω RF Interface
• Module Footprint: 33 Terminals, 0.8-mm Pitch, 7 mm × 7 mm × 1.4 mm (Typical)


• BR and EDR Features Include:
• Up to Seven Active Devices
• Scatternet: Up to Three Piconets Simultaneously, One as Master and Two as Slaves
• Up to Two Synchronous Connection Oriented (SCO) Links on the Same Piconet
• Support for All Voice Air-Coding—Continuously Variable Slope Delta (CVSD), A-Law, µ-Law, and Transparent (Uncoded)
• Assisted Mode for HFP 1.6 Wideband Speech (WBS) Profile or A2DP Profile to Reduce Host Processing and Power
• Support of Multiple Bluetooth Profiles With Enhanced QoS

• Low Energy Features Include:
• Support of up to 10 Simultaneous Connections
• Multiple Sniff Instances Tightly Coupled to Achieve Minimum Power Consumption
• Independent Buffering for Low Energy Allows Large Numbers of Multiple Connections Without Affecting BR or EDR Performance
• Built-In Coexistence and Prioritization Handling for BR, EDR, and Low Energy

• Best-in-Class Bluetooth (RF) Performance (TX Power, RX Sensitivity, Blocking)
• Class 1.5 TX Power up to +10 dBm
• –93 dbm Typical RX Sensitivity
• Internal Temperature Detection and Compensation to Ensure Minimal Variation in RF Performance Over Temperature, No External Calibration Required
• Improved Adaptive Frequency Hopping (AFH) Algorithm With Minimum Adaptation Time
• Provides Longer Range, Including Twice the Range of Other Low-Energy-Only Solutions

• Advanced Power Management for Extended Battery Life and Ease of Design
• On-Chip Power Management, Including Direct Connection to Battery
• Low Power Consumption for Active, Standby, and Scan Bluetooth Modes
• Shutdown and Sleep Modes to Minimize Power Consumption

• Physical Interfaces:
• UART Interface With Support for Maximum Bluetooth Data Rates
• UART Transport Layer (H4) With Maximum Rate of 4 Mbps
• Three-Wire UART Transport Layer (H5) With Maximum Rate of 4 Mbps

• Fully Programmable Digital Pulse-Code Modulation (PCM)–I2S Codec Interface

• CC256x Bluetooth Hardware Evaluation Tool: PC-Based Application to Evaluate RF Performance of the Device and Configure Service Pack