CC2564数据手册RF/IF射频/中频RFID的射频收发器IC规格书PDF

描述 Description

The TI CC256x device is a complete Bluetooth BR/EDR/LE HCI solution that reduces design effort and enables fast time to market. Based on TI’s seventh-generation Bluetooth core, the CC256x device provides a product-proven solution that is Bluetooth 4.1 compliant. When coupled with a microcontroller unit (MCU), this HCI device offers best-in-class RF performance with a range of about 2X compared to other Bluetooth LE-only solutions. Furthermore, TI’s power-management hardware and software algorithms provide significant power savings in all commonly used Bluetooth BR/EDR/LE modes of operation.

The TI Dual-Mode Bluetooth Stack software is certified and provided royalty free for TI’s MSP430 and ARM Cortex-M3 and Cortex-M4 MCUs. Other MPUs can be supported through TI’s third party. iPod® (MFi) protocol is supported by add-on software packages. For more information, see TI Dual-Mode Bluetooth Stack. Some of the profiles supported include the following:

Serial port profile (SPP) Advanced audio distribution profile (A2DP) Audio/video remote control profile (AVRCP) Handsfree profile (HFP) Human interface device (HID) Generic attribute profile (GATT)Several Bluetooth LE profiles and servicesIn addition to software, this solution consists of multiple reference designs with a low BOM cost, including a new Bluetooth audio sink reference design for customers to create a variety of applications for low-end, low-power audio solutions.

特性 Features

• TI’s Single-Chip Bluetooth Solution With Bluetooth Basic Rate (BR), Enhanced Data Rate (EDR), and Low Energy (LE) Support; Available in Two Variants:
• Dual-Mode Bluetooth CC2564 Controller
• Bluetooth CC2560 Controller

• CC2564 Bluetooth 4.1 Controller Subsystem Qualified (QDID 58852); Compliant up to the HCI Layer
• Highly Optimized for Low-Cost Designs:
• Single-Ended 50-Ω RF Interface
• Package Footprint: 76 Terminals, 0.6-mm Pitch, 8-mm x 8-mm mrQFN

• BR/EDR Features Include:
• Up to 7 Active Devices
• Scatternet: Up to 3 Piconets Simultaneously, 1 as Master and 2 as Slaves
• Up to 2 SCO Links on the Same Piconet
• Support for All Voice Air-Coding – Continuously Variable Slope Delta (CVSD), A-Law, µ-Law, and Transparent (Uncoded)
• CC2560B/CC2564B Devices Provide an Assisted Mode for HFP 1.6 Wideband Speech (WBS) Profile or A2DP Profile to Reduce Host Processing and Power
• Support of Multiple Bluetooth Profiles With Enhanced QoS

• LE Features Include:
• Support of Up to 10 (CC2564B) Connections
• Multiple Sniff Instances Tightly Coupled to Achieve Minimum Power Consumption
• Independent Buffering for LE Allows Large Numbers of Multiple Connections Without Affecting BR/EDR Performance.
• Built-In Coexistence and Prioritization Handling for BR/EDR and LE

• Best-in-Class Bluetooth (RF) Performance (TX Power, RX Sensitivity, Blocking)
• Class 1 TX Power Up to +10 dBm
• –95 dbm Typical RX Sensitivity
• Internal Temperature Detection and Compensation to Ensure Minimal Variation in RF Performance Over Temperature, No External Calibration Required
• Improved Adaptive Frequency Hopping (AFH) Algorithm With Minimum Adaptation Time
• Provides Longer Range, Including 2x Range Over Other LE-Only Solutions

• Advanced Power Management for Extended Battery Life and Ease of Design
• On-Chip Power Management, Including Direct Connection to Battery
• Low Power Consumption for Active, Standby, and Scan Bluetooth Modes
• Shutdown and Sleep Modes to Minimize Power Consumption

• Physical Interfaces:
• UART Interface With Support for Maximum Bluetooth Data Rates
• UART Transport Layer (H4) With Maximum Rate of 4 Mbps
• Three-Wire UART Transport Layer (H5) With Maximum Rate of 4 Mbps (CC2560B and CC2564B Only)

• Fully Programmable Digital PCM-I2S Codec Interface

• Flexibility for Easy Stack Integration and Validation Into Various Microcontrollers, Such as MSP430™ and ARM® Cortex®-M3 and Cortex®-M4 MCUs
• CC256x Bluetooth Hardware Evaluation Tool: PC- Based Application to Evaluate RF Performance of the Device and Configure Service Pack
• Device Pin-to-Pin Compatible With Previous Devices or Modules