丝印：C17；Package：DO-214AA；Transient Voltage Suppressors (TVS) Data Sheet

Features For surface mounted applications in order to optimize board space Low profile package Built in strain relief Glass p assivated j unction Low inductance Excellent clamping capability 1000W peak pulse power capability at 10/1000 μ s waveform, r epetition r ate (duty cycle): 0.01

文件：1.58341 Mbytes 页数：7 Pages

SY

顺烨电子

丝印：C17；Package：DO-214AA；5.0 To 200V 1000W Surface Mount Transient Voltage Suppressors

Features Glass passivated chip 1000W peak pulse power capability with a 10/1000μs waveform Repetitive rate (duty cycle) : 0.01 Typical IR less than 1μA above 10V Excellent clamping capability Very fast response time High temperature soldering: 260℃/10s at terminals. RoHS compliant

文件：3.35517 Mbytes 页数：6 Pages

UNSEMI

优恩半导体

丝印：c17；Package：SC-74A；Single Schmitt trigger buffer

General description The 74AHC1G17 and 74AHCT1G17 are single buffers with Schmitt-trigger inputs. Inputs are overvoltage tolerant. This feature allows the use of these devices as translators in mixed voltage environments. The AHC device has CMOS input switching levels and supply voltage range 2 V

文件：801.25 Kbytes 页数：17 Pages

NEXPERIA

安世

丝印：C17；COMPLEMENTARY NPN/PNP PRE-BIASED SMALL SIGNAL TRANSISTORS in SOT563

Features - Epitaxial Planar Die Construction - Built-In Biasing Resistors - Totally Lead-Free & Fully RoHS Compliant (Notes 1 & 2) - Halogen and Antimony Free. “Green” Device (Note 3)

文件：311.1 Kbytes 页数：8 Pages

DIODES

美台半导体

丝印：C17；Package：SOT26；DUAL COMPLEMENTARY PRE-BIASED TRANSISTOR IN SOT26

Features • Epitaxial Planar Die Construction • Built-In Biasing Resistors • Totally Lead-Free & Fully RoHS Compliant (Notes 1 & 2) • Halogen and Antimony Free. “Green” Device (Note 3) • For automotive applications requiring specific change control

文件：593.96 Kbytes 页数：13 Pages

DIODES

美台半导体

丝印：C17；Package：SOT363；SMALL SIGNAL COMPLEMENTARY PRE-BIASED DUAL TRANSISTOR

Features Epitaxial Planar Die Construction  Built-In Biasing Resistors  Surface Mount Package Suited for Automated Assembly  Totally Lead-Free & Fully RoHS Compliant (Notes 1 & 2)  Halogen and Antimony-Free. “Green” Device (Note 3)  For automotive applications requiring specific change

文件：2.02071 Mbytes 页数：14 Pages

DIODES

美台半导体

丝印：C17；Package：SOT363；SMALL SIGNAL COMPLEMENTARY PRE-BIASED DUAL TRANSISTOR

Features Epitaxial Planar Die Construction  Built-In Biasing Resistors  Surface Mount Package Suited for Automated Assembly  Totally Lead-Free & Fully RoHS Compliant (Notes 1 & 2)  Halogen and Antimony-Free. “Green” Device (Note 3)  For automotive applications requiring specific change

文件：2.02071 Mbytes 页数：14 Pages

DIODES

美台半导体

丝印：C17；Package：SOT363；SMALL SIGNAL COMPLEMENTARY PRE-BIASED DUAL TRANSISTOR

Features Epitaxial Planar Die Construction  Built-In Biasing Resistors  Surface Mount Package Suited for Automated Assembly  Totally Lead-Free & Fully RoHS Compliant (Notes 1 & 2)  Halogen and Antimony-Free. “Green” Device (Note 3)  For automotive applications requiring specific change

文件：2.02071 Mbytes 页数：14 Pages

DIODES

美台半导体

丝印：C17；Package：SOT363；SMALL SIGNAL COMPLEMENTARY PRE-BIASED DUAL TRANSISTOR

Features Epitaxial Planar Die Construction  Built-In Biasing Resistors  Surface Mount Package Suited for Automated Assembly  Totally Lead-Free & Fully RoHS Compliant (Notes 1 & 2)  Halogen and Antimony-Free. “Green” Device (Note 3)  For automotive applications requiring specific change

文件：2.02071 Mbytes 页数：14 Pages

DIODES

美台半导体

丝印：C17；Package：SSOP；SN74LVC3G17 Triple Schmitt-Trigger Buffer

1 Features 1• Available in the Texas Instruments NanoFree™ Package • Supports 5-V VCC Operation • Inputs Accept Voltages to 5.5 V • Maximum tpd of 5.4 ns at 3.3 V • Low Power Consumption, 10-μA Maximum ICC • ±24-mA Output Drive at 3.3 V • Typical VOLP (Output Ground Bounce)

文件：797.52 Kbytes 页数：27 Pages

TI

德州仪器