DUAL 4 INPUT NAND SCHMITT TRIGGER

DESCRIPTION The 74AC/ACT11013 high-performance CMOS devices combine very high speed and high output drive comparable to the most advanced TTL families.

文件：132.2 Kbytes 页数：5 Pages

PHI

飞利浦

SIGNETICS

DESCRIPTION The 74AC/ACT11014 high-performance CMOS devices combine very high speed and high output drive comparable to the most advanced TTL families.

文件：337.07 Kbytes 页数：12 Pages

PHI

飞利浦

100 Amp Current Transformer

文件：63.5 Kbytes 页数：1 Pages

TALEMA

Wireless Technology to Control and Monitor Anything from Anywhere

文件：554.64 Kbytes 页数：2 Pages

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Crescent 10 Chrome Finish Adjustable Wrench, Carded

文件：47.63 Kbytes 页数：1 Pages

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丝印：AC11000；Package：SOIC；QUADRUPLE 2-INPUT POSITIVE-NAND GATE

FEATURES · Center-Pin VCC and GND Configurations Minimize High-Speed Switching Noise · EPIC™ (Enhanced-Performance Implanted CMOS) 1-mm Process · 500-mA Typ Latch-Up Immunity at 125°C · Package Options Include Plastic Small-Outline (D) Packages and Standard Plastic 300-mil DIPs (N) DESC

文件：309.96 Kbytes 页数：11 Pages

TI

德州仪器

丝印：AC11000；Package：SOIC；QUADRUPLE 2-INPUT POSITIVE-NAND GATE

FEATURES · Center-Pin VCC and GND Configurations Minimize High-Speed Switching Noise · EPIC™ (Enhanced-Performance Implanted CMOS) 1-mm Process · 500-mA Typ Latch-Up Immunity at 125°C · Package Options Include Plastic Small-Outline (D) Packages and Standard Plastic 300-mil DIPs (N) DESC

文件：309.96 Kbytes 页数：11 Pages

TI

德州仪器

丝印：AC11000；Package：SOIC；QUADRUPLE 2-INPUT POSITIVE-NAND GATE

FEATURES · Center-Pin VCC and GND Configurations Minimize High-Speed Switching Noise · EPIC™ (Enhanced-Performance Implanted CMOS) 1-mm Process · 500-mA Typ Latch-Up Immunity at 125°C · Package Options Include Plastic Small-Outline (D) Packages and Standard Plastic 300-mil DIPs (N) DESC

文件：309.96 Kbytes 页数：11 Pages

TI

德州仪器

丝印：AC11004；Package：SOIC；HEX INVERTER

Flow-Through Architecture Optimizes PCB Layout Center-Pin VCC and GND Configuration Minimizes High-Speed Switching Noise EPIC ™ (Enhanced-Performance Implanted CMOS) 1-μm Process 500-mA Typical Latch-Up Immunity at 125°C Package Options Include Plastic Small-Outline (DW) and Shrink Small

文件：595.61 Kbytes 页数：13 Pages

TI

德州仪器

丝印：AC11004；Package：SOIC；HEX INVERTER

Flow-Through Architecture Optimizes PCB Layout Center-Pin VCC and GND Configuration Minimizes High-Speed Switching Noise EPIC ™ (Enhanced-Performance Implanted CMOS) 1-μm Process 500-mA Typical Latch-Up Immunity at 125°C Package Options Include Plastic Small-Outline (DW) and Shrink Small

文件：595.61 Kbytes 页数：13 Pages

TI

德州仪器