74AC11004DWR芯片代码丝印对应型号-114ic电子网

型号	下载订购	功能描述	制造商上传企业	LOGO
74AC11004DW	文件：595.61 Kbytes Page：13 Pages	丝印：AC11004；Package：SOIC；HEX INVERTER Flow-Through Architecture Optimizes PCB Layout Center-Pin VCC and GND Configuration Minimizes High-Speed Switching Noise EPIC ™ (Enhanced-Performance Implanted CMOS) 1-μm Process 500-mA Typical Latch-Up Immunity at 125°C Package Options Include Plastic Small-Outline (DW) and Shrink Small 文件：595.61 Kbytes 页数：13 Pages	TI 德州仪器	TI
74AC11004DWR	文件：595.61 Kbytes Page：13 Pages	丝印：AC11004；Package：SOIC；HEX INVERTER Flow-Through Architecture Optimizes PCB Layout Center-Pin VCC and GND Configuration Minimizes High-Speed Switching Noise EPIC ™ (Enhanced-Performance Implanted CMOS) 1-μm Process 500-mA Typical Latch-Up Immunity at 125°C Package Options Include Plastic Small-Outline (DW) and Shrink Small 文件：595.61 Kbytes 页数：13 Pages	TI 德州仪器	TI
74AC11004DWR.A	文件：595.61 Kbytes Page：13 Pages	丝印：AC11004；Package：SOIC；HEX INVERTER Flow-Through Architecture Optimizes PCB Layout Center-Pin VCC and GND Configuration Minimizes High-Speed Switching Noise EPIC ™ (Enhanced-Performance Implanted CMOS) 1-μm Process 500-mA Typical Latch-Up Immunity at 125°C Package Options Include Plastic Small-Outline (DW) and Shrink Small 文件：595.61 Kbytes 页数：13 Pages	TI 德州仪器	TI

更多AC11004供应商更新时间2025-9-21 22:59:00