丝印：AC11032；Package：SOIC；QUADRUPLE 2-INPUT POSITIVE-OR GATE

Center-Pin VCC and GND Configurations Minimize High-Speed Switching Noise EPICE (Enhanced-Performance Implanted CMOS) 1-mm Process 500-mA Typical Latch-Up Immunity at 125°C Package Options Include Plastic Small-Outline (D) and Shrink Small-Outline (DB) Packages, and Standard Plastic 300-m

文件：1.23403 Mbytes 页数：28 Pages

TI

德州仪器

丝印：AC11032；Package：SOIC；QUADRUPLE 2-INPUT POSITIVE-OR GATE

Center-Pin VCC and GND Configurations Minimize High-Speed Switching Noise EPICE (Enhanced-Performance Implanted CMOS) 1-mm Process 500-mA Typical Latch-Up Immunity at 125°C Package Options Include Plastic Small-Outline (D) and Shrink Small-Outline (DB) Packages, and Standard Plastic 300-m

文件：1.23403 Mbytes 页数：28 Pages

TI

德州仪器

丝印：AC11032；Package：SOP；QUADRUPLE 2-INPUT POSITIVE-OR GATE

Center-Pin VCC and GND Configurations Minimize High-Speed Switching Noise EPICE (Enhanced-Performance Implanted CMOS) 1-mm Process 500-mA Typical Latch-Up Immunity at 125°C Package Options Include Plastic Small-Outline (D) and Shrink Small-Outline (DB) Packages, and Standard Plastic 300-m

文件：1.23403 Mbytes 页数：28 Pages

TI

德州仪器

丝印：AC11032；Package：SOP；QUADRUPLE 2-INPUT POSITIVE-OR GATE

Center-Pin VCC and GND Configurations Minimize High-Speed Switching Noise EPICE (Enhanced-Performance Implanted CMOS) 1-mm Process 500-mA Typical Latch-Up Immunity at 125°C Package Options Include Plastic Small-Outline (D) and Shrink Small-Outline (DB) Packages, and Standard Plastic 300-m

文件：1.23403 Mbytes 页数：28 Pages

TI

德州仪器