| 零件编号 | 下载 订购 | 功能描述/丝印 | 制造商 上传企业 | LOGO |
|---|---|---|---|---|
Marking：AC11074；Package：SOIC；DUAL POSITIVE-EDGE-TRIGGERED D-TYPE FLIP-FLOP WITH CLEAR AND PRESET Center-PinVCCandGNDConfigurations MinimizeHigh-SpeedSwitchingNoise EPIC(Enhanced-PerformanceImplanted CMOS)1-μmProcess 500-mATypicalLatch-UpImmunityat 125°C PackageOptionsIncludePlastic Small-Outline(D)andThinShrink Small-Outline(PW)Packages,and StandardPlastic3 | TI2Texas Instruments 德州仪器美国德州仪器公司 | TI2 | ||
Marking：AC11074；Package：SOIC；DUAL POSITIVE-EDGE-TRIGGERED D-TYPE FLIP-FLOP WITH CLEAR AND PRESET Center-PinVCCandGNDConfigurations MinimizeHigh-SpeedSwitchingNoise EPIC(Enhanced-PerformanceImplanted CMOS)1-μmProcess 500-mATypicalLatch-UpImmunityat 125°C PackageOptionsIncludePlastic Small-Outline(D)andThinShrink Small-Outline(PW)Packages,and StandardPlastic3 | TI2Texas Instruments 德州仪器美国德州仪器公司 | TI2 | ||
Marking：AC11074；Package：SOIC；DUAL POSITIVE-EDGE-TRIGGERED D-TYPE FLIP-FLOP WITH CLEAR AND PRESET Center-PinVCCandGNDConfigurations MinimizeHigh-SpeedSwitchingNoise EPIC(Enhanced-PerformanceImplanted CMOS)1-μmProcess 500-mATypicalLatch-UpImmunityat 125°C PackageOptionsIncludePlastic Small-Outline(D)andThinShrink Small-Outline(PW)Packages,and StandardPlastic3 | TI2Texas Instruments 德州仪器美国德州仪器公司 | TI2 |
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