100 Amp Current Transformer

文件：63.5 Kbytes 页数：1 Pages

TALEMA

Talema Group LLC

包装：卷带（TR）剪切带（CT）Digi-Reel® 得捷定制卷带 类别：变压器 电流互感器 描述：CURR SENSE XFMR 100A T/H

TALEMA

Talema Group LLC

包装：卷带（TR）剪切带（CT）Digi-Reel® 得捷定制卷带 类别：变压器 电流互感器 描述：CURR SENSE XFMR 100A T/H

TALEMA

Talema Group LLC

Wireless Technology to Control and Monitor Anything from Anywhere

文件：554.64 Kbytes 页数：2 Pages

etc2List of Unclassifed Manufacturers

etc未分类制造商etc2未分类制造商

丝印：AC11000；Package：SOIC；QUADRUPLE 2-INPUT POSITIVE-NAND GATE

FEATURES · Center-Pin VCC and GND Configurations Minimize High-Speed Switching Noise · EPIC™ (Enhanced-Performance Implanted CMOS) 1-mm Process · 500-mA Typ Latch-Up Immunity at 125°C · Package Options Include Plastic Small-Outline (D) Packages and Standard Plastic 300-mil DIPs (N) DESC

文件：309.96 Kbytes 页数：11 Pages

TI

德州仪器

丝印：AC11000；Package：SOIC；QUADRUPLE 2-INPUT POSITIVE-NAND GATE

FEATURES · Center-Pin VCC and GND Configurations Minimize High-Speed Switching Noise · EPIC™ (Enhanced-Performance Implanted CMOS) 1-mm Process · 500-mA Typ Latch-Up Immunity at 125°C · Package Options Include Plastic Small-Outline (D) Packages and Standard Plastic 300-mil DIPs (N) DESC

文件：309.96 Kbytes 页数：11 Pages

TI

德州仪器

丝印：AC11000；Package：SOIC；QUADRUPLE 2-INPUT POSITIVE-NAND GATE

FEATURES · Center-Pin VCC and GND Configurations Minimize High-Speed Switching Noise · EPIC™ (Enhanced-Performance Implanted CMOS) 1-mm Process · 500-mA Typ Latch-Up Immunity at 125°C · Package Options Include Plastic Small-Outline (D) Packages and Standard Plastic 300-mil DIPs (N) DESC

文件：309.96 Kbytes 页数：11 Pages

TI

德州仪器

丝印：AC11004；Package：SOIC；HEX INVERTER

Flow-Through Architecture Optimizes PCB Layout Center-Pin VCC and GND Configuration Minimizes High-Speed Switching Noise EPIC ™ (Enhanced-Performance Implanted CMOS) 1-μm Process 500-mA Typical Latch-Up Immunity at 125°C Package Options Include Plastic Small-Outline (DW) and Shrink Small

文件：595.61 Kbytes 页数：13 Pages

TI

德州仪器

丝印：AC11004；Package：SOIC；HEX INVERTER

Flow-Through Architecture Optimizes PCB Layout Center-Pin VCC and GND Configuration Minimizes High-Speed Switching Noise EPIC ™ (Enhanced-Performance Implanted CMOS) 1-μm Process 500-mA Typical Latch-Up Immunity at 125°C Package Options Include Plastic Small-Outline (DW) and Shrink Small

文件：595.61 Kbytes 页数：13 Pages

TI

德州仪器

丝印：AC11004；Package：SOIC；HEX INVERTER

Flow-Through Architecture Optimizes PCB Layout Center-Pin VCC and GND Configuration Minimizes High-Speed Switching Noise EPIC ™ (Enhanced-Performance Implanted CMOS) 1-μm Process 500-mA Typical Latch-Up Immunity at 125°C Package Options Include Plastic Small-Outline (DW) and Shrink Small

文件：595.61 Kbytes 页数：13 Pages

TI

德州仪器