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66AK2H12DAAWA2集成电路(IC)的DSP(数字信号处理器)规格书PDF中文资料

厂商型号 |
66AK2H12DAAWA2 |
参数属性 | 66AK2H12DAAWA2 封装/外壳为1517-BBGA,FCBGA;包装为托盘;类别为集成电路(IC)的DSP(数字信号处理器);产品描述:66AK2H12DAAWA2 |
功能描述 | 66AK2Hxx Multicore DSPARM® KeyStone™ II System-on-Chip (SoC) |
丝印标识 | |
封装外壳 | FCBGA / 1517-BBGA,FCBGA |
文件大小 |
2.92701 Mbytes |
页面数量 |
329 页 |
生产厂商 | Texas Instruments |
企业简称 |
TI2【德州仪器】 |
中文名称 | 美国德州仪器公司官网 |
原厂标识 | TI2 |
数据手册 | |
更新时间 | 2025-8-1 23:00:00 |
人工找货 | 66AK2H12DAAWA2价格和库存,欢迎联系客服免费人工找货 |
66AK2H12DAAWA2规格书详情
66AK2H12DAAWA2属于集成电路(IC)的DSP(数字信号处理器)。由美国德州仪器公司制造生产的66AK2H12DAAWA2DSP(数字信号处理器)数字信号处理器是类似于微处理器或微控制器的器件,但区别在于其内部架构经修改,适用于对连续数据流连续执行以乘法和加法运算为主的算法,而不是以条件逻辑或大量并发进程为主的算法。该器件通常用于诸如音频或视频信号处理等应用。
1.1 Features 1
• Eight TMS320C66x DSP Core Subsystems (C66x
CorePacs), Each With
– 1.0 GHz or 1.2 GHz C66x Fixed- and Floating-
Point DSP Core
– 38.4 GMacs/Core for Fixed Point @ 1.2 GHz
– 19.2 GFlops/Core for Floating Point @ 1.2
GHz
– Memory
– 32-KB L1P Per CorePac
– 32-KB L1D Per CorePac
– 1024-KB Local L2 Per CorePac
• ARM CorePac
– Four ARM® Cortex®-A15 MPCore™ Processors
at up to 1.4 GHz
– 4MB of L2 Cache Memory Shared by Four ARM
Cores
– Full Implementation of ARMv7-A Architecture
Instruction Set
– 32-KB L1 Instruction and Data Caches per Core
– AMBA 4.0 AXI Coherency Extension (ACE)
Master Port, Connected to MSMC for Low-
Latency Access to Shared MSMC SRAM
• Multicore Shared Memory Controller (MSMC)
– 6MB of MSM SRAM Memory Shared by Eight
DSP CorePacs and One ARM CorePac
– Memory Protection Unit (MPU) for Both MSM
SRAM and DDR3_EMIF
• Multicore Navigator
– 16k Multipurpose Hardware Queues With
Queue Manager
– Packet-Based DMA for Zero-Overhead
Transfers
• Network Coprocessor
– Packet Accelerator Enables Support for
– Transport Plane IPsec, GTP-U, SCTP, PDCP
– L2 User Plane PDCP (RoHC, Air Ciphering)
– 1-Gbps Wire Speed Throughput at 1.5
MPackets Per Second
– Security Accelerator Engine Enables Support for
– IPSec, SRTP, 3GPP, and WiMAX Air
Interface, and SSL/TLS Security
– ECB, CBC, CTR, F8, A5/3, CCM, GCM,
HMAC, CMAC, GMAC, AES, DES, 3DES,
Kasumi, SNOW 3G, SHA-1, SHA-2 (256-Bit
Hash), MD5
– Up to 2.4 Gbps IPSec and 2.4 Gbps Air
Ciphering
– Ethernet Subsystem
– Five-Port Switch (Four SGMII Ports)
• Peripherals
– Four Lanes of SRIO 2.1
– Supports up to 5 GBaud
– Supports Direct I/O, Message Passing
– Two Lanes PCIe Gen2
– Supports up to 5 GBaud
– Two HyperLinks
– Supports Connections to Other KeyStone™
Architecture Devices Providing Resource
Scalability
– Supports up to 50 GBaud
– 10-Gigabit Ethernet (10-GbE) Switch Subsystem
(66AK2H14 Only)
– Two XFI Ports
– IEEE 1588 Support
– Five Enhanced Direct Memory Access (EDMA)
Modules
– Two 72-Bit DDR3/DDR3L Interfaces With
Speeds up to 1600 MHz
– EMIF16 Interface
– USB 3.0
– Two UART Interfaces
– Three I2C Interfaces
– 32 GPIO Pins
– Three SPI Interfaces
– Semaphore Module
– 64-Bit Timers
– Twenty 64-Bit Timers for 66AK2H14 and
66AK2H12
– Fourteen 64-Bit Timers for 66AK2H06
– Five On-Chip PLLs
• Commercial Case Temperature:
– 0ºC to 85ºC
• Extended Case Temperature:
– –40ºC to 100ºC
1.2 Applications
• Mission Critical
• Computing
• Communications
• Audio
• Video Infrastructure.
• Imaging
• Analytics
• Networking
• Media Processing
1.3 Description
The 66AK2Hxx platform combines the quad ARM Cortex-A15 processor with up to eight TMS320C66x
high-performance DSPs using the KeyStone II architecture. The 66AK2H14/12/06 device provides up to
5.6 GHz of ARM and 9.6 GHz of DSP processing coupled with security, packet processing, and Ethernet
switching at lower power than multichip solutions. The 66AK2H14/12/06 device is optimal for embedded
infrastructure applications like cloud computing, media processing, high-performance computing,
transcoding, security, gaming, analytics, and virtual desktop.
The C66x core combines fixed-point and floating-point computational capability in the processor without
sacrificing speed, size, or power consumption. The raw computational performance is 38.4 GMACS/core
and 19.2 Gflops/core (@ 1.2 GHz operating frequency). The C66x is also 100% backward compatible with
software for C64x+ devices. The C66x core incorporates 90 new instructions targeted for floating point
(FPi) and vector math oriented (VPi) processing.
The 66AK2H14/12/06 device has a complete set of development tools that includes: a C compiler, an
assembly optimizer to simplify programming and scheduling, and a Windows® debugger interface for
visibility into source code execution.
产品属性
更多- 产品编号:
66AK2H12DAAWA2
- 制造商:
Texas Instruments
- 类别:
集成电路(IC) > DSP(数字信号处理器)
- 系列:
66AK2Hx KeyStone Multicore
- 包装:
托盘
- 类型:
DSP+ARM®
- 接口:
EBI/EMI,以太网,DMA,I²C,Serial RapidIO,SPI,UART/USART,USB 3.0
- 时钟速率:
1.2GHz
- 非易失性存储器:
ROM(384kB)
- 片载 RAM:
12.75MB
- 电压 - I/O:
0.85V,1.0V,1.35V,1.5V,1.8V,3.3V
- 电压 - 内核:
可变式
- 工作温度:
-40°C ~ 100°C(TC)
- 安装类型:
表面贴装型
- 封装/外壳:
1517-BBGA,FCBGA
- 供应商器件封装:
1517-FCBGA(40x40)
- 描述:
66AK2H12DAAWA2
供应商 | 型号 | 品牌 | 批号 | 封装 | 库存 | 备注 | 价格 |
---|---|---|---|---|---|---|---|
TI(德州仪器) |
24+ |
NA/ |
7350 |
现货供应,当天可交货!免费送样,原厂技术支持!!! |
询价 | ||
TI/德州仪器 |
24+ |
NA/ |
105 |
优势代理渠道,原装正品,可全系列订货开增值税票 |
询价 | ||
TI/德州仪器 |
25+ |
FCBGA-1517 |
860000 |
明嘉莱只做原装正品现货 |
询价 | ||
TI |
三年内 |
1983 |
只做原装正品 |
询价 | |||
TI(德州仪器) |
24+ |
N/A |
17600 |
原装正品现货支持实单 |
询价 | ||
TI(德州仪器) |
2450+ |
SMD |
9850 |
只做原装正品代理渠道!假一赔三! |
询价 | ||
TI(德州仪器) |
24+ |
N/A |
6000 |
原装,正品 |
询价 | ||
Texas |
25+ |
25000 |
原厂原包 深圳现货 主打品牌 假一赔百 可开票! |
询价 | |||
TI(德州仪器) |
2511 |
N/A |
6000 |
电子元器件采购降本 30%!盈慧通原厂直采,砍掉中间差价 |
询价 | ||
TI |
24+ |
N/A |
10000 |
只做原装,实单最低价支持 |
询价 |