丝印：66AK2H06AAW；Package：FCBGA；66AK2Hxx Multicore DSPARM® KeyStone™ II System-on-Chip (SoC)

1.1 Features 1 • Eight TMS320C66x DSP Core Subsystems (C66x CorePacs), Each With – 1.0 GHz or 1.2 GHz C66x Fixed- and Floating- Point DSP Core – 38.4 GMacs/Core for Fixed Point @ 1.2 GHz – 19.2 GFlops/Core for Floating Point @ 1.2 GHz – Memory – 32-KB L1P Per CorePac – 32-KB L1D Per Core

文件：2.92701 Mbytes 页数：329 Pages

TI

德州仪器

丝印：66AK2H06AAW；Package：FCBGA；66AK2Hxx Multicore DSPARM® KeyStone™ II System-on-Chip (SoC)

1.1 Features 1 • Eight TMS320C66x DSP Core Subsystems (C66x CorePacs), Each With – 1.0 GHz or 1.2 GHz C66x Fixed- and Floating- Point DSP Core – 38.4 GMacs/Core for Fixed Point @ 1.2 GHz – 19.2 GFlops/Core for Floating Point @ 1.2 GHz – Memory – 32-KB L1P Per CorePac – 32-KB L1D Per Core

文件：2.92701 Mbytes 页数：329 Pages

TI

德州仪器

丝印：66AK2H06AAW；Package：FCBGA；66AK2Hxx Multicore DSPARM® KeyStone™ II System-on-Chip (SoC)

1.1 Features 1 • Eight TMS320C66x DSP Core Subsystems (C66x CorePacs), Each With – 1.0 GHz or 1.2 GHz C66x Fixed- and Floating- Point DSP Core – 38.4 GMacs/Core for Fixed Point @ 1.2 GHz – 19.2 GFlops/Core for Floating Point @ 1.2 GHz – Memory – 32-KB L1P Per CorePac – 32-KB L1D Per Core

文件：2.92701 Mbytes 页数：329 Pages

TI

德州仪器

丝印：66AK2H06AAW；Package：FCBGA；66AK2Hxx Multicore DSPARM® KeyStone™ II System-on-Chip (SoC)

1.1 Features 1 • Eight TMS320C66x DSP Core Subsystems (C66x CorePacs), Each With – 1.0 GHz or 1.2 GHz C66x Fixed- and Floating- Point DSP Core – 38.4 GMacs/Core for Fixed Point @ 1.2 GHz – 19.2 GFlops/Core for Floating Point @ 1.2 GHz – Memory – 32-KB L1P Per CorePac – 32-KB L1D Per Core

文件：2.92701 Mbytes 页数：329 Pages

TI

德州仪器