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66AK2H06DAAWA2集成电路(IC)的DSP(数字信号处理器)规格书PDF中文资料

66AK2H06DAAWA2
厂商型号

66AK2H06DAAWA2

参数属性

66AK2H06DAAWA2 封装/外壳为1517-BBGA,FCBGA;包装为托盘;类别为集成电路(IC)的DSP(数字信号处理器);产品描述:66AK2H06DAAWA2

功能描述

66AK2Hxx Multicore DSPARM® KeyStone™ II System-on-Chip (SoC)
66AK2H06DAAWA2

丝印标识

66AK2H06AAW

封装外壳

FCBGA / 1517-BBGA,FCBGA

文件大小

2.92701 Mbytes

页面数量

329

生产厂商 Texas Instruments
企业简称

TI2德州仪器

中文名称

美国德州仪器公司官网

原厂标识
数据手册

原厂下载下载地址一下载地址二到原厂下载

更新时间

2025-8-1 11:08:00

人工找货

66AK2H06DAAWA2价格和库存,欢迎联系客服免费人工找货

66AK2H06DAAWA2规格书详情

66AK2H06DAAWA2属于集成电路(IC)的DSP(数字信号处理器)。由美国德州仪器公司制造生产的66AK2H06DAAWA2DSP(数字信号处理器)数字信号处理器是类似于微处理器或微控制器的器件,但区别在于其内部架构经修改,适用于对连续数据流连续执行以乘法和加法运算为主的算法,而不是以条件逻辑或大量并发进程为主的算法。该器件通常用于诸如音频或视频信号处理等应用。

1.1 Features 1

• Eight TMS320C66x DSP Core Subsystems (C66x

CorePacs), Each With

– 1.0 GHz or 1.2 GHz C66x Fixed- and Floating-

Point DSP Core

– 38.4 GMacs/Core for Fixed Point @ 1.2 GHz

– 19.2 GFlops/Core for Floating Point @ 1.2

GHz

– Memory

– 32-KB L1P Per CorePac

– 32-KB L1D Per CorePac

– 1024-KB Local L2 Per CorePac

• ARM CorePac

– Four ARM® Cortex®-A15 MPCore™ Processors

at up to 1.4 GHz

– 4MB of L2 Cache Memory Shared by Four ARM

Cores

– Full Implementation of ARMv7-A Architecture

Instruction Set

– 32-KB L1 Instruction and Data Caches per Core

– AMBA 4.0 AXI Coherency Extension (ACE)

Master Port, Connected to MSMC for Low-

Latency Access to Shared MSMC SRAM

• Multicore Shared Memory Controller (MSMC)

– 6MB of MSM SRAM Memory Shared by Eight

DSP CorePacs and One ARM CorePac

– Memory Protection Unit (MPU) for Both MSM

SRAM and DDR3_EMIF

• Multicore Navigator

– 16k Multipurpose Hardware Queues With

Queue Manager

– Packet-Based DMA for Zero-Overhead

Transfers

• Network Coprocessor

– Packet Accelerator Enables Support for

– Transport Plane IPsec, GTP-U, SCTP, PDCP

– L2 User Plane PDCP (RoHC, Air Ciphering)

– 1-Gbps Wire Speed Throughput at 1.5

MPackets Per Second

– Security Accelerator Engine Enables Support for

– IPSec, SRTP, 3GPP, and WiMAX Air

Interface, and SSL/TLS Security

– ECB, CBC, CTR, F8, A5/3, CCM, GCM,

HMAC, CMAC, GMAC, AES, DES, 3DES,

Kasumi, SNOW 3G, SHA-1, SHA-2 (256-Bit

Hash), MD5

– Up to 2.4 Gbps IPSec and 2.4 Gbps Air

Ciphering

– Ethernet Subsystem

– Five-Port Switch (Four SGMII Ports)

• Peripherals

– Four Lanes of SRIO 2.1

– Supports up to 5 GBaud

– Supports Direct I/O, Message Passing

– Two Lanes PCIe Gen2

– Supports up to 5 GBaud

– Two HyperLinks

– Supports Connections to Other KeyStone™

Architecture Devices Providing Resource

Scalability

– Supports up to 50 GBaud

– 10-Gigabit Ethernet (10-GbE) Switch Subsystem

(66AK2H14 Only)

– Two XFI Ports

– IEEE 1588 Support

– Five Enhanced Direct Memory Access (EDMA)

Modules

– Two 72-Bit DDR3/DDR3L Interfaces With

Speeds up to 1600 MHz

– EMIF16 Interface

– USB 3.0

– Two UART Interfaces

– Three I2C Interfaces

– 32 GPIO Pins

– Three SPI Interfaces

– Semaphore Module

– 64-Bit Timers

– Twenty 64-Bit Timers for 66AK2H14 and

66AK2H12

– Fourteen 64-Bit Timers for 66AK2H06

– Five On-Chip PLLs

• Commercial Case Temperature:

– 0ºC to 85ºC

• Extended Case Temperature:

– –40ºC to 100ºC

1.2 Applications

• Mission Critical

• Computing

• Communications

• Audio

• Video Infrastructure.

• Imaging

• Analytics

• Networking

• Media Processing

1.3 Description

The 66AK2Hxx platform combines the quad ARM Cortex-A15 processor with up to eight TMS320C66x

high-performance DSPs using the KeyStone II architecture. The 66AK2H14/12/06 device provides up to

5.6 GHz of ARM and 9.6 GHz of DSP processing coupled with security, packet processing, and Ethernet

switching at lower power than multichip solutions. The 66AK2H14/12/06 device is optimal for embedded

infrastructure applications like cloud computing, media processing, high-performance computing,

transcoding, security, gaming, analytics, and virtual desktop.

The C66x core combines fixed-point and floating-point computational capability in the processor without

sacrificing speed, size, or power consumption. The raw computational performance is 38.4 GMACS/core

and 19.2 Gflops/core (@ 1.2 GHz operating frequency). The C66x is also 100% backward compatible with

software for C64x+ devices. The C66x core incorporates 90 new instructions targeted for floating point

(FPi) and vector math oriented (VPi) processing.

The 66AK2H14/12/06 device has a complete set of development tools that includes: a C compiler, an

assembly optimizer to simplify programming and scheduling, and a Windows® debugger interface for

visibility into source code execution.

产品属性

更多
  • 产品编号:

    66AK2H06DAAWA2

  • 制造商:

    Texas Instruments

  • 类别:

    集成电路(IC) > DSP(数字信号处理器)

  • 系列:

    66AK2Hx KeyStone Multicore

  • 包装:

    托盘

  • 类型:

    DSP+ARM®

  • 接口:

    EBI/EMI,以太网,DMA,I²C,Serial RapidIO,SPI,UART/USART,USB 3.0

  • 时钟速率:

    1.2GHz

  • 非易失性存储器:

    ROM(384kB)

  • 片载 RAM:

    8.375MB

  • 电压 - I/O:

    0.85V,1.0V,1.35V,1.5V,1.8V,3.3V

  • 电压 - 内核:

    可变式

  • 工作温度:

    -40°C ~ 100°C(TC)

  • 安装类型:

    表面贴装型

  • 封装/外壳:

    1517-BBGA,FCBGA

  • 供应商器件封装:

    1517-FCBGA(40x40)

  • 描述:

    66AK2H06DAAWA2

供应商 型号 品牌 批号 封装 库存 备注 价格
TI
三年内
1983
只做原装正品
询价
TI
专业军工
NA
1000
只做原装正品军工级部分订货
询价
TI(德州仪器)
2447
FCBGA-1517(40x40)
31500
21个/托盘一级代理专营品牌!原装正品,优势现货,长
询价
Texas
25+
25000
原厂原包 深圳现货 主打品牌 假一赔百 可开票!
询价
TI(德州仪器)
2021+
FCBGA-1517(40x40)
499
询价
TI
24+
N/A
90000
一级代理商进口原装现货、价格合理
询价
TI
24+
SMD
21
“芯达集团”专营军工百分之百原装进口
询价
TI
22+
1517FCBGA (40x40)
9000
原厂渠道,现货配单
询价
TI/德州仪器
25+
FCBGA-1517
860000
明嘉莱只做原装正品现货
询价
Texas Instruments
24+
-
56300
一级代理/放心采购
询价