SURFACE MOUNT (PNP) GENERAL PURPOSE TRANSISTOR

DESCRIPTION The 61083 is a hermetically sealed ceramic surface mount general purpose switching transistor. This miniature ceramic package is ideal for designs where board space and device weight are important requirements. This device is available custom binned to customer specifications or scree

文件：83.68 Kbytes 页数：2 Pages

MICROPAC

0.8mM BOARD TO BOARD PLUG ASSY

文件：461.27 Kbytes 页数：6 Pages

FCI-CONNECTOR

SURFACE MOUNT (PNP) GENERAL PURPOSE TRANSISTOR

Micropac

包装：散装 类别：工具 专用工具 描述：PUNCH ASSY D

GREENLEE

SURFACE MOUNT (PNP) GENERAL PURPOSE TRANSISTOR

DESCRIPTION The 61083 is a hermetically sealed ceramic surface mount general purpose switching transistor. This miniature ceramic package is ideal for designs where board space and device weight are important requirements. This device is available custom binned to customer specifications or scree

文件：83.68 Kbytes 页数：2 Pages

MICROPAC

SURFACE MOUNT (PNP) GENERAL PURPOSE TRANSISTOR

DESCRIPTION The 61083 is a hermetically sealed ceramic surface mount general purpose switching transistor. This miniature ceramic package is ideal for designs where board space and device weight are important requirements. This device is available custom binned to customer specifications or scree

文件：83.68 Kbytes 页数：2 Pages

MICROPAC

BergStak® 0.8mm Mezzanine Connector FLEXIBLE SOLUTION FOR HIGH DENSITY APPLICATIONS

FEATURES § Housing and terminal profile guarantees support of up to 12Gb/s § Vertical versus vertical mating configuration § 40 to 200 position sizes in 20 position increments § 5mm to 20mm stack heights in 1mm increments § 0.8mm double-row contact pitch conserves printed circuit board spac

文件：506.19 Kbytes 页数：4 Pages

AMPHENOL

安费诺

BergStak® 0.8mm Mezzanine Connector FLEXIBLE SOLUTION FOR HIGH DENSITY APPLICATIONS

FEATURES § Housing and terminal profile guarantees support of up to 12Gb/s § Vertical versus vertical mating configuration § 40 to 200 position sizes in 20 position increments § 5mm to 20mm stack heights in 1mm increments § 0.8mm double-row contact pitch conserves printed circuit board spac

文件：506.19 Kbytes 页数：4 Pages

AMPHENOL

安费诺

BergStak® 0.8mm Mezzanine Connector FLEXIBLE SOLUTION FOR HIGH DENSITY APPLICATIONS

FEATURES § Housing and terminal profile guarantees support of up to 12Gb/s § Vertical versus vertical mating configuration § 40 to 200 position sizes in 20 position increments § 5mm to 20mm stack heights in 1mm increments § 0.8mm double-row contact pitch conserves printed circuit board spac

文件：506.19 Kbytes 页数：4 Pages

AMPHENOL

安费诺

BergStak® 0.8mm Mezzanine Connector FLEXIBLE SOLUTION FOR HIGH DENSITY APPLICATIONS

FEATURES § Housing and terminal profile guarantees support of up to 12Gb/s § Vertical versus vertical mating configuration § 40 to 200 position sizes in 20 position increments § 5mm to 20mm stack heights in 1mm increments § 0.8mm double-row contact pitch conserves printed circuit board spac

文件：506.19 Kbytes 页数：4 Pages

AMPHENOL

安费诺