509

包装：散装 类别：原型开发，制造品 无孔原型板 描述：PROTO BOARD COPPER CLAD 6\

509000000100

1.8 SBC with Intel® Celeron® Processor N3350, Micro HDMI, 1 GbE LAN, 2 USB 3.2 and 40-pin GPIO

Features ●Tiny1.8-inchembeddedboard ●Intel®Celeron®processorN3350onboard ●On-boardLPDDR4forupto4GBofmemory ●OneGbELANandoneM.2KeyE ●On-boardeMMCforupto64GB ●40-pinGPIO ●Supportsoperatingsystem:Linux,Android,Windows

509000001500

Fanless Industrial System with Intel® Core™ Processor i7 Processor and Front Access I/O

Features ●Intel®Core™i7processor(TigerLakeU),15W ●FlexibleI/Omoduleforadditionalexpansioncapabilities ●M.2KeyEsocketforwirelessconnection ●2DisplayPort++connectors ●SupportsTPM2.0 ●SupportsIntel®AMT ●1PCIex4slot ●Optionalmountingsolutions:DIN-rail,bo

509000001500

Fanless Industrial System with LGA1700 Socket 14th/13th/12th Gen Intel® Core™ i9/i7/i5/i3 or Celeron® Processor, Intel® H610E/Q670E, and Front-access I/O

Features ●Intelligentpowermanagement:IgnitionandUSBpoweron/offcontrol ●Fanlessembeddedsystem ●OptionalextensionsystemI/Omodule ●Optional5Gnetwork(Q670E) ●SupportsIntel®RAID(Q670E) ●EN61000-6-2certified ●Optionalmountingkits:DIN-rail,bookshelf,andwallmount

509000001500

2-slot Fanless Industrial System with LGA1151 Socket 7th/6th Gen Intel Core™ i7/i5/i3 or Celeron Processor, Intel® Q170, Front-access I/O, and PCIe & PCI Slots

Features ●LGA1151socket7th/6thgenIntel®Core™i7/i5/i3or Celeron®processor,upto65W(KabyLake/Skylake)* ●Intel®Q170chipset ●Supports2expansionslots ●Powerinput:24VDC(uMin=19V/uMax=30V) ●Compact&frontI/Odesign ●-10°Cto+60°Coperatingtemperaturerange ●Support

509000004800

Fanless Embedded System with Intel® Alder Lake-N Processor, 2 LAN/4 LAN, HDMI, DisplayPort, 2 COM, 4 USB, and 9 to 36 VDC

Features ●Intel®processorN97/i3-N305SoC(AlderLake-N) ●1DDR5SO-DIMM,upto16GB ●Operatingtemperaturerangefrom-40°Cto+60°C ●Availablein2-portor4-port2.5GbEconfigurations ●IntelligentpowermanagementforUSBpoweron/offcontrol ●SupportsHDMI(FHD)andDisplayPort++

50906A24000E

Fanless Industrial System with LGA1700 Socket 14th/13th/12th Gen Intel® Core™ i9/i7/i5/i3 or Celeron® Processor, Intel® H610E/Q670E, and Front-access I/O

Features ●Intelligentpowermanagement:IgnitionandUSBpoweron/offcontrol ●Fanlessembeddedsystem ●OptionalextensionsystemI/Omodule ●Optional5Gnetwork(Q670E) ●SupportsIntel®RAID(Q670E) ●EN61000-6-2certified ●Optionalmountingkits:DIN-rail,bookshelf,andwallmount

50906A24000E

2-slot Fanless Industrial System with LGA1151 Socket 7th/6th Gen Intel Core™ i7/i5/i3 or Celeron Processor, Intel® Q170, Front-access I/O, and PCIe & PCI Slots

Features ●LGA1151socket7th/6thgenIntel®Core™i7/i5/i3or Celeron®processor,upto65W(KabyLake/Skylake)* ●Intel®Q170chipset ●Supports2expansionslots ●Powerinput:24VDC(uMin=19V/uMax=30V) ●Compact&frontI/Odesign ●-10°Cto+60°Coperatingtemperaturerange ●Support

50916624000E

Embedded Chassis for Mini-ITX SBC

Features ●DesignedforMini-ITXSBC ●Two2.5”HDDdrivebays ●Optional250WAC-inpowersupply ●Supportswallmountkit ●Slimdesignwith1systemfan ●Easyandquickcustomization

50916624000E

Embedded Chassis with Expansion Slots for Mini-ITX SBC

Features ●DesignedforMini-ITXSBCwithexpansionslots ●One3.5or2.5HDDdrivebay ●2PCIeor1PCIex16slotssupported ●Slimdesignwith1systemfan ●250Wpowersupplysupported ●Easyandquickcustomization