丝印：16EM；Package：SOT-23；TLV8811,TLV8812 425 nA Precision Nanopower Op Amps for Cost-Optimized Systems

1 Features 1• For Cost-Optimized Systems • Nanopower Supply Current: 425 nA/channel • Offset Voltage: 500 μV (max) • TcVos: 1 μV/°C • Gain-Bandwidth: 6 kHz • Unity-Gain Stable • Low Input Bias Current : 100 fA • Wide Supply Range: 1.7 V to 5.5 V • Rail-to-Rail Output • No Output Reversal

文件：986.74 Kbytes 页数：28 Pages

TI

德州仪器

丝印：16EM；Package：SOT-23；TLV8811,TLV8812 425 nA Precision Nanopower Op Amps for Cost-Optimized Systems

1 Features 1• For Cost-Optimized Systems • Nanopower Supply Current: 425 nA/channel • Offset Voltage: 500 μV (max) • TcVos: 1 μV/°C • Gain-Bandwidth: 6 kHz • Unity-Gain Stable • Low Input Bias Current : 100 fA • Wide Supply Range: 1.7 V to 5.5 V • Rail-to-Rail Output • No Output Reversal

文件：986.74 Kbytes 页数：28 Pages

TI

德州仪器

丝印：16EM；Package：SOT-23；TLV8811,TLV8812 425 nA Precision Nanopower Op Amps for Cost-Optimized Systems

1 Features 1• For Cost-Optimized Systems • Nanopower Supply Current: 425 nA/channel • Offset Voltage: 500 μV (max) • TcVos: 1 μV/°C • Gain-Bandwidth: 6 kHz • Unity-Gain Stable • Low Input Bias Current : 100 fA • Wide Supply Range: 1.7 V to 5.5 V • Rail-to-Rail Output • No Output Reversal

文件：986.74 Kbytes 页数：28 Pages

TI

德州仪器

丝印：16EM；Package：SOT-23；TLV8811,TLV8812 425 nA Precision Nanopower Op Amps for Cost-Optimized Systems

1 Features 1• For Cost-Optimized Systems • Nanopower Supply Current: 425 nA/channel • Offset Voltage: 500 μV (max) • TcVos: 1 μV/°C • Gain-Bandwidth: 6 kHz • Unity-Gain Stable • Low Input Bias Current : 100 fA • Wide Supply Range: 1.7 V to 5.5 V • Rail-to-Rail Output • No Output Reversal

文件：986.74 Kbytes 页数：28 Pages

TI

德州仪器

The Perfect Power Efficient Integrated Storage Solution For Space-constrained Mobile, IoT, and Embedded Applications

Kingston offers a range of JEDEC standard eMCP components. eMCP integrates Embedded MultiMedia Card (e•MMC) storage and Low-Power Double Data Rate (LPDDR) DRAM into a Multi-Chip Package (MCP) with one small footprint. This solution provides greater integration, reducing overall size. eMCP is an

文件：357.23 Kbytes 页数：2 Pages

KINGSTON

金士顿

The Perfect Power Efficient Integrated Storage Solution For Space-constrained Mobile, IoT, and Embedded Applications

Kingston offers a range of JEDEC standard eMCP components. eMCP integrates Embedded MultiMedia Card (e•MMC) storage and Low-Power Double Data Rate (LPDDR) DRAM into a Multi-Chip Package (MCP) with one small footprint. This solution provides greater integration, reducing overall size. eMCP is an

文件：357.23 Kbytes 页数：2 Pages

KINGSTON

金士顿

The Perfect Power Efficient Integrated Storage Solution For Space-constrained Mobile, IoT, and Embedded Applications

Kingston offers a range of JEDEC standard eMCP components. eMCP integrates Embedded MultiMedia Card (e•MMC) storage and Low-Power Double Data Rate (LPDDR) DRAM into a Multi-Chip Package (MCP) with one small footprint. This solution provides greater integration, reducing overall size. eMCP is an

文件：357.23 Kbytes 页数：2 Pages

KINGSTON

金士顿

The Perfect Power Efficient Integrated Storage Solution For Space-constrained Mobile, IoT, and Embedded Applications

Kingston offers a range of JEDEC standard eMCP components. eMCP integrates Embedded MultiMedia Card (e•MMC) storage and Low-Power Double Data Rate (LPDDR) DRAM into a Multi-Chip Package (MCP) with one small footprint. This solution provides greater integration, reducing overall size. eMCP is an

文件：357.23 Kbytes 页数：2 Pages

KINGSTON

金士顿