MLCC with FLEXITERM®

GENERAL DESCRIPTION With increased requirements from the automotive industry for additional component robustness, AVX recognized the need to produce a MLCC with enhanced mechanical strength. It was noted that many components may be subject to severe flexing and vibration when used in various un

文件：808.36 Kbytes 页数：5 Pages

KSS

京瓷

MLCC with FLEXITERM®

GENERAL DESCRIPTION With increased requirements from the automotive industry for additional component robustness, AVX recognized the need to produce a MLCC with enhanced mechanical strength. It was noted that many components may be subject to severe flexing and vibration when used in various un

文件：808.36 Kbytes 页数：5 Pages

KSS

京瓷

MLCC with FLEXITERM®

GENERAL DESCRIPTION With increased requirements from the automotive industry for additional component robustness, AVX recognized the need to produce a MLCC with enhanced mechanical strength. It was noted that many components may be subject to severe flexing and vibration when used in various un

文件：808.36 Kbytes 页数：5 Pages

KSS

京瓷

Airfast RF Power GaN Transistor

This 27 dBm RF power GaN transistor is designed for cellular base station applications covering the frequency range of 2496 to 2690 MHz. Features • High terminal impedances for optimal broadband performance • Designed for low complexity linearization systems • Universal broadband driver •

文件：209.82 Kbytes 页数：13 Pages

恩XP

Airfast RF Power GaN Transistor

Features • High terminal impedances for optimal broadband performance • Designed for low complexity linearization systems • Universal broadband driver • Optimized for massive MIMO active antenna systems for 5G base stations

文件：209.78 Kbytes 页数：13 Pages

恩XP

XTR111 Demonstration Fixture Users Guide

2 Hardware Features This section describes the hardware features found on the XTR111EVM. 2.1 XTR111EVM The XTR111EVM is used for the basic functional evaluation of the XTR111. The EVM provides the following features: • Easy handling of the small DFN package. The DFN device is already soldered

文件：1.19791 Mbytes 页数：14 Pages

TI

德州仪器

Multilayer Ceramic Chip Capacitor

文件：399.04 Kbytes 页数：46 Pages

AVX

Multilayer Ceramic Chip Capacitor

文件：399.04 Kbytes 页数：46 Pages

AVX

Multilayer Ceramic Chip Capacitor

文件：399.04 Kbytes 页数：46 Pages

AVX

Multilayer Ceramic Chip Capacitor

文件：399.04 Kbytes 页数：46 Pages

AVX