Isolated 8.0 Amps Glass Passivated Super Fast Rectifier

文件：165.59 Kbytes 页数：2 Pages

TSC

台湾半导体

8.0 AMPS Isolated Ultra Fast Rectifier

文件：174.82 Kbytes 页数：3 Pages

TSC

台湾半导体

Glass Passivated Super Fast Rectifier Isolated 8.0 Amps

文件：197.89 Kbytes 页数：2 Pages

LUGUANG

鲁光电子

Dual Ultrafast Plastic Rectifier Series

FEATURES • Glass passivated chip junction • Ultrafast recovery time • Soft recovery characteristics • Low switching losses, high efficiency • High forward surge capability • Meets MSL level 1, per J-STD-020, LF maximum peak of 245 °C (for TO-263AB package) • Solder dip 260 °C, 40 s (for TO-

文件：69.4 Kbytes 页数：3 Pages

VishayVishay Siliconix

威世科技

High Voltage Ultrafast Rectifier

FEATURES • Glass passivated chip junction • Ultrafast recovery time • Soft recovery characteristics • Low switching losses, high efficiency • High forward surge capability • Meets MSL level 1, per J-STD-020, LF maximum peak of 245 °C (for TO-263AB package) • Solder dip 260 °C,

文件：144.25 Kbytes 页数：5 Pages

VishayVishay Siliconix

威世科技

ULTRAFAST SOFT RECOVERY RECTIFIER

FEATURES ♦ Plastic package has Underwriters Laboratories Flammability Classification 94V-0 ♦ Ideally suited for freewheeling diode power factor correction applications ♦ Soft recovery characteristics ♦ Excellent high temperature switching ♦ Planar technology ♦ Optimized to reduce switching l

文件：135.7 Kbytes 页数：2 Pages

GE

High Voltage Ultrafast Rectifier

FEATURES • Glass passivated chip junction • Ultrafast recovery time • Soft recovery characteristics • Low switching losses, high efficiency • High forward surge capability • Meets MSL level 1, per J-STD-020, LF maximum peak of 245 °C (for TO-263AB package) • Solder dip 260 °C,

文件：144.25 Kbytes 页数：5 Pages

VishayVishay Siliconix

威世科技

High Voltage Ultrafast Rectifier

• Power pack • Glass passivated chip junction • Ultrafast recovery time • Soft recovery characteristics • Low switching losses, high efficiency • High forward surge capability • Meets MSL level 1, per J-STD-020, LF maximum peak of 245 °C (for D2PAK (TO-263AB package)) • Solder dip 275 °C m

文件：142.81 Kbytes 页数：5 Pages

VishayVishay Siliconix

威世科技

High Voltage Ultrafast Rectifier

FEATURES • Glass passivated chip junction • Ultrafast recovery time • Soft recovery characteristics • Low switching losses, high efficiency • High forward surge capability • Meets MSL level 1, per J-STD-020, LF maximum peak of 245 °C (for TO-263AB package) • Solder dip 260 °C,

文件：144.25 Kbytes 页数：5 Pages

VishayVishay Siliconix

威世科技

High Voltage Ultrafast Rectifier

FEATURES • Glass passivated chip junction • Ultrafast recovery time • Soft recovery characteristics • Low switching losses, high efficiency • High forward surge capability • Meets MSL level 1, per J-STD-020, LF maximum peak of 245 °C (for TO-263AB package) • Solder dip 260 °C,

文件：144.25 Kbytes 页数：5 Pages

VishayVishay Siliconix

威世科技