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TSSOP

ExposedPad (ePad) TSSOP, MSOP, SOIC and SSOP are leadframe based

FEATURES Cu wire interconnect for low cost Standard JEDEC package outlines Multi-die production capability Turnkey test services, including strip test options ExposedPad configuration for increased thermal efficiency Up to 60% improvement in Theta JA (compared to standard TSSOP or

文件:780.44 Kbytes 页数:3 Pages

amkor

安靠科技

TSSOP

Silver Wirebonding

KEY FEATURES Ag-Alloy wire is softer than Cu wire resulting in lower Al-Splash and lower risk of bond pad damage Ag-Alloy wire has a wide process window that improves manufacturability for devices with fragile bond pad structures

文件:411.98 Kbytes 页数:2 Pages

amkor

安靠科技

TSSOP

TSSOP (Thin Shrink Small Outline Package) and MSOP (Mini Small Outline Package) are leadframe based, plastic encapsulated packages

FEATURES Cu wire interconnect for lowest cost Standard JEDEC package outlines Multi-die production capability Turnkey test services, including strip test options Available in ExposedPad configuration (Ref: DS571) Green materials are standard – Pb-free and RoHS compliant Stealth dicin

文件:502.24 Kbytes 页数:2 Pages

amkor

安靠科技

TSSOP

Surface Mount TSSOP Resistor Networks

Absolute tolerances to ±0.1% Tight TC Tracking to ±5ppm/°C Ratio match tolerances to ±0.05% Ultra-stable tantalum nitride resistors Standard Sn/Pb and Pb-free terminations available

文件:562.48 Kbytes 页数:4 Pages

TTELEC

SN74HCS74QPWRQ1

丝印:TSSOP;Package:HCS74Q;SN74HCS74-Q1 Automotive Schmitt-Trigger Input Dual D-Type Positive-Edge-Triggered Flip-Flops With Clear and Preset

文件:1.42704 Mbytes 页数:25 Pages

TI

德州仪器

TSSOP-14PIN

TSSOP Package 14-Pin

(F) TSSOP Package 14-Pin

文件:19.11 Kbytes 页数:1 Pages

IRF

TSSOP20

Surface mounted, 20 pin package

Package information - TSSOP20 Surface mounted, 20 pin package

文件:122.79 Kbytes 页数:3 Pages

Zetex

TSSOP-20

Package Outline

Package Outline

文件:114.29 Kbytes 页数:1 Pages

GMT

致新科技

TSSOP-20

Mechanical Dimensions

[BCD SEMI] Mechanical Dimensions

文件:56.21 Kbytes 页数:2 Pages

ETCList of Unclassifed Manufacturers

未分类制造商

TSSOP-20-EP

Package Outline

Package Outline

文件:122.44 Kbytes 页数:1 Pages

GMT

致新科技

详细参数

  • 型号:

    TSSOP

  • 制造商:

    STATSCHIP

  • 制造商全称:

    STATSCHIP

  • 功能描述:

    Small Outline Packages

供应商型号品牌批号封装库存备注价格
LT
24+
TSSOP-56P
35
询价
LT
17+
SSOP
6200
100%原装正品现货
询价
CARSEM
24+
SOP
6232
公司原厂原装现货假一罚十!特价出售!强势库存!
询价
MicrochipTechnology
24+
原厂原装
6000
进口原装正品假一赔十,货期7-10天
询价
CHIPPAC
23+
SSOP-36
5000
原装正品,假一罚十
询价
0
原装现货价格有优势量大可以发货
询价
25+
TSSOP
2987
只售原装自家现货!诚信经营!欢迎来电!
询价
CARSEM
25+23+
SOP
49459
绝对原装正品现货,全新深圳原装进口现货
询价
国产
24+
SOP8P
1
大批量供应优势库存热卖
询价
FAIRCHILD
20+
TSSOP8
2960
诚信交易大量库存现货
询价
更多TSSOP供应商 更新时间2025-12-15 10:20:00