| 型号 | 下载 订购 | 功能描述 | 制造商 上传企业 | LOGO |
|---|---|---|---|---|
TSSOP | ExposedPad (ePad) TSSOP, MSOP, SOIC and SSOP are leadframe based FEATURES Cu wire interconnect for low cost Standard JEDEC package outlines Multi-die production capability Turnkey test services, including strip test options ExposedPad configuration for increased thermal efficiency Up to 60% improvement in Theta JA (compared to standard TSSOP or 文件:780.44 Kbytes 页数:3 Pages | AMKOR 安靠科技 | AMKOR | |
TSSOP | Silver Wirebonding KEY FEATURES Ag-Alloy wire is softer than Cu wire resulting in lower Al-Splash and lower risk of bond pad damage Ag-Alloy wire has a wide process window that improves manufacturability for devices with fragile bond pad structures 文件:411.98 Kbytes 页数:2 Pages | AMKOR 安靠科技 | AMKOR | |
TSSOP | TSSOP (Thin Shrink Small Outline Package) and MSOP (Mini Small Outline Package) are leadframe based, plastic encapsulated packages FEATURES Cu wire interconnect for lowest cost Standard JEDEC package outlines Multi-die production capability Turnkey test services, including strip test options Available in ExposedPad configuration (Ref: DS571) Green materials are standard – Pb-free and RoHS compliant Stealth dicin 文件:502.24 Kbytes 页数:2 Pages | AMKOR 安靠科技 | AMKOR | |
TSSOP | Surface Mount TSSOP Resistor Networks Absolute tolerances to ±0.1% Tight TC Tracking to ±5ppm/°C Ratio match tolerances to ±0.05% Ultra-stable tantalum nitride resistors Standard Sn/Pb and Pb-free terminations available 文件:562.48 Kbytes 页数:4 Pages | TTELEC | TTELEC | |
丝印:TSSOP;Package:HCS74Q;SN74HCS74-Q1 Automotive Schmitt-Trigger Input Dual D-Type Positive-Edge-Triggered Flip-Flops With Clear and Preset 文件:1.42704 Mbytes 页数:25 Pages | TI 德州仪器 | TI | ||
TSSOP Package 14-Pin (F) TSSOP Package 14-Pin 文件:19.11 Kbytes 页数:1 Pages | IRF | IRF | ||
Surface mounted, 20 pin package Package information - TSSOP20 Surface mounted, 20 pin package 文件:122.79 Kbytes 页数:3 Pages | ZETEX | ZETEX | ||
Package Outline Package Outline 文件:114.29 Kbytes 页数:1 Pages | GMT 致新科技 | GMT | ||
Mechanical Dimensions [BCD SEMI] Mechanical Dimensions 文件:56.21 Kbytes 页数:2 Pages | ETCList of Unclassifed Manufacturers 未分类制造商 | ETC | ||
Package Outline Package Outline 文件:122.44 Kbytes 页数:1 Pages | GMT 致新科技 | GMT |
详细参数
- 型号:
TSSOP
- 制造商:
STATSCHIP
- 制造商全称:
STATSCHIP
- 功能描述:
Small Outline Packages
| 供应商 | 型号 | 品牌 | 批号 | 封装 | 库存 | 备注 | 价格 |
|---|---|---|---|---|---|---|---|
LT |
24+ |
TSSOP-56P |
35 |
询价 | |||
LT |
17+ |
SSOP |
6200 |
100%原装正品现货 |
询价 | ||
CARSEM |
24+ |
SOP |
6232 |
公司原厂原装现货假一罚十!特价出售!强势库存! |
询价 | ||
MicrochipTechnology |
24+ |
原厂原装 |
6000 |
进口原装正品假一赔十,货期7-10天 |
询价 | ||
CHIPPAC |
23+ |
SSOP-36 |
5000 |
原装正品,假一罚十 |
询价 | ||
0 |
原装现货价格有优势量大可以发货 |
询价 | |||||
25+ |
TSSOP |
2987 |
只售原装自家现货!诚信经营!欢迎来电! |
询价 | |||
CARSEM |
25+23+ |
SOP |
49459 |
绝对原装正品现货,全新深圳原装进口现货 |
询价 | ||
国产 |
24+ |
SOP8P |
1 |
大批量供应优势库存热卖 |
询价 | ||
FAIRCHILD |
20+ |
TSSOP8 |
2960 |
诚信交易大量库存现货 |
询价 |
相关规格书
更多- TSSOP20EV
- TSSP4P38
- TSSP58038
- TSSP6038TR
- TSSP77038TR
- TSSP77P38TR
- TSSP-HA
- TSSR-2H-10
- TST
- TST02PA00
- TST03PF00
- TST04PA00
- TST06PA00
- TST06RA00
- TST09RD01T
- TST-105-01-L-D
- TST-107-04-G-D-RA
- TST11DGRA1D04
- TST12AH00
- TST24PA00
- TST36AH00
- TST4
- TST6
- TST8
- TSTA7300
- TSTS7100
- TSTS7500
- TSU101ILT
- TSU101RILT
- TSU102IST
- TSU104IQ4T
- TSU5511YZPR
- TSU6111ARSVR
- TSU6712YFPRB
- TSU8111YFPR
- TSUS4300
- TSUS5200
- TSUS5202
- TSUS5400
- TSUS5402
- TSV250-130F-2
- TSV321IDT
- TSV321RILT
- TSV324IDT
- TSV324IYDT
相关库存
更多- TSSP4038
- TSSP57038TT1
- TSSP58P38
- TSSP6038TT
- TSSP77038TT
- TSSP77P38TT
- TSSR-1H-10
- TSSS2600
- TST02AH00
- TST02RA00
- TST04AH00
- TST06AH00
- TST06PF00
- TST09PF00
- TST-10
- TST-107-01-G-D
- TST11DGPC1D04
- TST11DGVRA1D
- TST24AH00
- TST3
- TST36PA00
- TST-50
- TST-750
- TSTA7100
- TS-TFT3.5Z
- TSTS7300
- TSU101ICT
- TSU101RICT
- TSU102IQ2T
- TSU104IPT
- TSU2000
- TSU5611YZPR
- TSU6111RSVR
- TSU6721YFFR
- TSUC-40
- TSUS4400
- TSUS5201
- TSUS5400
- TSUS5401
- TSV250-130-2
- TSV250-130F-B-0.5-2
- TSV321RAILT
- TSV321RIYLT
- TSV324IPT
- TSV324IYPT

