TMS320DM6437数据手册集成电路（IC）的DSP（数字信号处理器）规格书PDF

描述 Description

The TMS320C64x+™ DSPs (including the TMS320DM6437 device) are thehighest-performance fixed-point DSP generation in the TMS320C6000™ DSPplatform. The DM6437 device is based on the third-generation high-performance,advanced VelociTI™ very-long-instruction-word (VLIW) architecture developed byTexas Instruments (TI), making these DSPs an excellent choice for digital mediaapplications. The C64x+™ devices are upward code-compatible from previousdevices that are part of the C6000™ DSP platform. The C64x™ DSPs support addedfunctionality and have an expanded instruction set from previous devices.
Any reference to the C64x DSP or C64x CPU also applies, unless otherwisenoted, to the C64x+ DSP and C64x+ CPU, respectively.
With performance of up to 4800 million instructions per second (MIPS) at aclock rate of 600 MHz, the C64x+ core offers solutions to high-performance DSPprogramming challenges. The DSP core possesses the operational flexibility ofhigh-speed controllers and the numerical capability of array processors. TheC64x+ DSP core processor has 64 general-purpose registers of 32-bit word lengthand eight highly independent functional units-two multipliers for a 32-bitresult and six arithmetic logic units (ALUs). The eight functional units includeinstructions to accelerate the performance in video and imaging applications.The DSP core can produce four 16-bit multiply-accumulates (MACs) per cycle for atotal of 2400 million MACs per second (MMACS), or eight 8-bit MACs per cycle fora total of 4800 MMACS. For more details on the C64x+ DSP, see theTMS320C64x/C64x+ DSP CPU and Instruction Set Reference Guide (literature numberSPRU732).
The DM6437 also has application-specific hardware logic, on-chip memory, andadditional on-chip peripherals similar to the other C6000 DSP platform devices.The DM6437 core uses a two-level cache-based architecture. The Level 1 programmemory/cache (L1P) consists of a 256K-bit memory space that can be configured asmapped memory or direct mapped cache, and the Level 1 data (L1D) consists of a640K-bit memory space-384K-bit of which is mapped memory and 256K-bit of whichcan be configured as mapped memory or 2-way set-associative cache. The Level 2memory/cache (L2) consists of a 1M-bit memory space that is shared betweenprogram and data space. L2 memory can be configured as mapped memory, cache, orcombinations of the two.
The peripheral set includes: 2 configurable video ports; a 10/100 Mb/sEthernet MAC (EMAC) with a management data input/output (MDIO) module; a 4-bittransmit, 4-bit receive VLYNQ interface; an inter-integrated circuit (I2C) Businterface; two multichannel buffered serial ports (McBSPs); a multichannel audioserial port (McASP0) with 4 serializers; 2 64-bit general-purpose timers eachconfigurable as 2 independent 32-bit timers; 1 64-bit watchdog timer; auser-configurable 16-bit host-port interface (HPI); up to 111-pins ofgeneral-purpose input/output (GPIO) with programmable interrupt/event generationmodes, multiplexed with other peripherals; 2 UARTs with hardware handshakingsupport on 1 UART; 3 pulse width modulator (PWM) peripherals; 1 high-endcontroller area network (CAN) controller [HECC]; 1 peripheral componentinterconnect (PCI) [33 MHz]; and 2 glueless external memory interfaces: anasynchronous external memory interface (EMIFA) for slower memories/peripherals,and a higher speed synchronous memory interface for DDR2.
The DM6437 device includes a Video Processing Subsystem (VPSS) with twoconfigurable video/imaging peripherals: 1 Video Processing Front-End (VPFE)input used for video capture, 1 Video Processing Back-End (VPBE) output.
The Video Processing Front-End (VPFE) is comprised of a CCD Controller(CCDC), a Preview Engine (Previewer), Histogram Module, Auto-Exposure/WhiteBalance/Focus Module (H3A), and Resizer. The CCDC is capable of interfacing tocommon video decoders, CMOS sensors, and Charge Coupled Devices (CCDs). ThePreviewer is a real-time image processing engine that takes raw imager data froma CMOS sensor or CCD and converts from an RGB Bayer Pattern to YUV422. TheHistogram and H3A modules provide statistical information on the raw color datafor use by the DM6437. The Resizer accepts image data for separate horizontaland vertical resizing from 1/4x to 4x in increments of 256/N, where N is between64 and 1024.
The Video Processing Back-End (VPBE) is comprised of an On-Screen DisplayEngine (OSD) and a Video Encoder (VENC). The OSD engine is capable of handling 2separate video windows and 2 separate OSD windows. Other configurations include2 video windows, 1 OSD window, and 1 attribute window allowing up to 8 levels ofalpha blending. The VENC provides four analog DACs that run at 54 MHz, providinga means for composite NTSC/PAL video, S-Video, and/or Component video output.The VENC also provides up to 24 bits of digital output to interface to RGB888devices. The digital output is capable of 8/16-bit BT.656 output and/or CCIR.601with separate horizontal and vertical syncs.
The Ethernet Media Access Controller (EMAC) provides an efficient interfacebetween the DM6437 and the network. The DM6437 EMAC support both 10Base-T and100Base-TX, or 10 Mbits/second (Mbps) and 100 Mbps in either half- orfull-duplex mode, with hardware flow control and quality of service (QOS)support.
The Management Data Input/Output (MDIO) module continuously polls all 32 MDIOaddresses in order to enumerate all PHY devices in the system.
The I2C and VLYNQ ports allow DM6437 to easily control peripheral devicesand/or communicate with host processors.
The high-end controller area network (CAN) controller [HECC] module providesa network protocol in a harsh environment to communicate serially with othercontrollers, typically in automotive applications.
The rich peripheral set provides the ability to control external peripheraldevices and communicate with external processors. For details on each of theperipherals, see the related sections later in this document and the associatedperipheral reference guides.
The DM6437 has a complete set of development tools. These include Ccompilers, a DSP assembly optimizer to simplify programming and scheduling, anda Windows™ debugger interface for visibility into source code

特性 Features

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• High-Performance Digital Media Processor (DM6437)
- 2.5-, 2-, 1.67, 1.51-, 1.43-ns Instruction Cycle Time
• 400-, 500-, 600-, 660-, 700-MHz C64x+™ Clock Rate
• Eight 32-Bit C64x+ Instructions/Cycle
• 3200, 4000, 4800, 5280, 5600 MIPS
• Fully Software-Compatible With C64x
• Commercial and Automotive (Q or S suffix) Grades
• Low-Power Device (L suffix)
• VelociTI.2™ Extensions to VelociTI™ Advanced Very-Long-Instruction-Word VLIW) TMS320C64x+™ DSP Core
• Eight Highly Independent Functional Units With VelociTI.2 Extensions:
• Six ALUs (32-/40-Bit), Each Supports Single 32-Bit, Dual 16-Bit, or Quad 8-Bit Arithmetic per Clock Cycle
• Two Multipliers Support Four 16 × 16-Bit Multiplies (32-Bit Results) per Clock Cycle or Eight 8 × 8-Bit Multiplies (16-Bit Results) per Clock Cycle
• Load-Store Architecture With Non-Aligned Support
• 64 32-Bit General-Purpose Registers
• Instruction Packing Reduces Code Size
• All Instructions Conditional
• Additional C64x+™ Enhancements
• Protected Mode Operation
• Exceptions Support for Error Detection and Program Redirection
• Hardware Support for Modulo Loop Auto-Focus Module Operation
• C64x+ Instruction Set Features
• Byte-Addressable (8-/16-/32-/64-Bit Data)
• 8-Bit Overflow Protection
• Bit-Field Extract, Set, Clear
• Normalization, Saturation, Bit-Counting
• VelociTI.2 Increased Orthogonality
• C64x+ Extensions
• Compact 16-bit Instructions
• Additional Instructions to Support Complex Multiplies
• C64x+ L1/L2 Memory Architecture
• 256K-Bit (32K-Byte) L1P Program RAM/Cache [Flexible Allocation]
• 640K-Bit (80K-Byte) L1D Data RAM/Cache [Flexible Allocation]
• 1M-Bit (128K-Byte) L2 Unified Mapped RAM/Cache [Flexible Allocation]
• Supports Little Endian Mode Only
• Video Processing Subsystem (VPSS)
• Front End Provides:
• CCD and CMOS Imager Interface
• BT.601/BT.656 Digital YCbCr 4:2:2 (8-/16-Bit) Interface
• Preview Engine for Real-Time Image Processing
• Glueless Interface to Common Video Decoders
• Histogram Module
• Auto-Exposure, Auto-White Balance and Auto-Focus Module
• Resize Engine
• Resize Images From 1/4× to 4×
• Separate Horizontal/Vertical Control
• Back End Provides:
• Hardware On-Screen Display (OSD)
• Four 54-MHz DACs for a Combination of
• Composite NTSC/PAL Video
• Luma/Chroma Separate Video (S-video)
• Component (YPbPr or RGB) Video (Progressive)
• Digital Output
• 8-/16-bit YUV or up to 24-Bit RGB
• HD Resolution
• Up to 2 Video Windows
• External Memory Interfaces (EMIFs)
• 32-Bit DDR2 SDRAM Memory Controller With 256M-Byte Address Space (1.8-V I/O)
• Supports up to 333-MHz (data rate) Bus and Interfaces With DDR2-400SDRAM
• Asynchronous 8-Bit Wide EMIF (EMIFA) With up to 64M-Byte Address Reach
• Flash Memory Interfaces
• NOR (8-Bit-Wide Data)
• NAND (8-Bit-Wide Data)
• Enhanced Direct-Memory-Access (EDMA) Controller (64 Independent Channels)
• Two 64-Bit General-Purpose Timers (Each Configurable as Two 32-Bit Timers)
• One 64-Bit Watch Dog Timer
• Two UARTs (One with RTS and CTS Flow Control)
• Master/Slave Inter-Integrated Circuit (I2C Bus×)
• Two Multichannel Buffered Serial Ports (McBSPs)
• I2S and TDM
• AC97 Audio Codec Interface
• SPI
• Standard Voice Codec Interface (AIC12)
• Telecom Interfaces - ST-Bus, H-100
• 128 Channel Mode
• Multichannel Audio Serial Port (McASP0)
• Four Serializers and SPDIF (DIT) Mode
• 16-Bit Host-Port Interface (HPI)
• High-End CAN Controller (HECC)
• 32-Bit 33-MHz, 3.3-V Peripheral Component Interconnect (PCI) Master/Slave Interface
• 10/100 Mb/s Ethernet MAC (EMAC)
• IEEE 802.3 Compliant
• Supports Media Independent Interface (MII)
• Management Data I/O (MDIO) Module
• VLYNQ™ Interface (FPGA Interface)
• Three Pulse Width Modulator (PWM) Outputs
• On-Chip ROM Bootloader
• Individual Power-Savings Modes
• Flexible PLL Clock Generators
• IEEE-1149.1 (JTAG™) Boundary-Scan-Compatible
• Up to 111 General-Purpose I/O (GPIO) Pins (Multiplexed With Other Device Functions)
• Packages:
• 361-Pin Pb-Free PBGA Package (ZWT Suffix), 0.8-mm Ball Pitch
• 376-Pin Plastic BGA Package (ZDU Suffix), 1.0-mm Ball Pitch
• 0.09-µm/6-Level Cu Metal Process (CMOS)
• 3.3-V and 1.8-V I/O, 1.2-V Internal (-7/-6/-5/-4/-L/-Q6/-5Q/-4Q)
• 3.3-V and 1.8-V I/O, 1.05-V Internal (-7/-6/-5/-4/-L/-Q5)
• Applications
• Digital Media
• Networked Media Encode/Decode
• Video Imaging