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TMS320C6474数据手册集成电路(IC)的DSP(数字信号处理器)规格书PDF
TMS320C6474规格书详情
描述 Description
The TMS320C64x+ DSPs (including the TMS320C6474 device) are the highest-performance multicore DSP generation in the TMS320C6000™ DSP platform.
The C6474 device is based on the third-generation high-performance, advanced VelociTI™ very-long-instruction-word (VLIW) architecture developed by Texas Instruments (TI).
The C64x+™ devices are upward code-compatible from previous devices that are part of the C6000™ DSP platform.
特性 Features
• Key Features
• High-Performance Multicore DSP (C6474)
• Instruction Cycle Time: 0.83 ns (1.2-GHz Device); 1 ns (1-GHz Device); 1.18 ns (850-MHz Device)
• Clock Rate: 1 GHz to 1.2 GHz (1.2-GHz Device); 1 GHz (1-GHz Device); 850 MHz (850-MHz Device)
• Commercial Temperature and Extended Tmperature
• 3 TMS320C64x+™ DSP Cores; Six RSAs for CDMA Processing (2 per core)
• Enhanced VCP2/TCP2
• Frame Synchronization Interface
• 16-/32-Bit DDR2-667 Memory Controller
• EDMA3 Controller
• Antenna Interface
• Two 1x Serial RapidIO® Links, v1.2 Compliant
• One 1.8-V Inter-Integrated Circuit (I2C) Bus
• Two 1.8-V McBSPs
• 1000 Mbps Ethernet MAC (EMAC)
• Six 64-Bit General-Purpose Timers
• 16 General-Purpose I/O (GPIO) Pins
• Internal Semaphore Module non-UMTS Systems
• System PLL and PLL Controller/DDR PLL and PLL Controller, Dedicated to DDR2 Memory Controller
• High-Performance Multicore DSP (C6474)
• Instruction Cycle Time:
• 1.2-GHz Device: 1.0-ns to 0.83-ns
• 1-GHz Device: 1-ns
• 850-MHz Device: 1.18 ns
• Clock Rate:
• 1.2-GHz Device: 1-GHz to 1.2-GHz
• 1-GHz Device: 1-GHz
• 850-MHz Device: 850 MHz
• Eight 32-Bit Instructions/Cycle
• Commercial Temperature:
• 1.2-GHz Device: 0°C to 95°C
• 1-GHz Device: 0°C to 100°C
• 850-MHZ and 1-GHz Device: 0°C to 100°C
• Extended Temperature:
• 1.2-GHz Device: -40°C to 95°C
• 1-GHz Device: -40°C to 100°C
• 3 TMS320C64x+™ DSP Cores
• Dedicated SPLOOP Instructions
• Compact Instructions (16-Bit)
• Exception Handling
• TMS320C64x+ Megamodule L1/L2 Memory Architecture
• 256 K-Bit (32 K-Byte) L1P Program Cache [Direct Mapped]
• 256 K-Bit (32 K-Byte) L1D Data Cache [2-Way Set-Associative]
• 512 K-Bit (64 K-Byte) L3 ROM
• Enhanced VCP2
• Supports Over 694 7.95-Kbps AMR
• Enhanced Turbo Decoder Coprocessor (TCP2)
• Supports up to Eight 2-Mbps 3 GPP (6 Iterations)
• Endianness: Little Endian, Big Endian
• Frame Synchronization Interface
• Time Alignment Between Internal Subsystems, External Devices/System
• OBSAI RP1 Compliant for Frame Burst Data
• Alternate Interfaces for non-RP1 and non-UMTS Systems
• 16-/32-Bit DDR2-667 Memory Controller
• EDMA3 Controller (64 Independent Channels)
• Antenna Interface
• 6 Configurable Links (Full Duplex)
• Supports OBSAI RP3 Protocol, v1.0: 768-Mbps, 1.536-, 3.072-Gbps Link Rates
• Supports CPRI Protocol V2.0:614.4-Mbps, 1.2288-, 2.4576-Gbps Link Rates
• Clock Input Independent or Shared with CPU (Selectable at Boot-Time)
• Two 1x Serial RapidIO® Links, v1.2 Compliant
• 1.25-, 2.5-, 3.125-Gbps Link Rates
• Message Passing and DirectIO Support
• Error Management Extensions and Congestion Control
• One 1.8-V Inter-Integrated Circuit (I2C) Bus
• Two 1.8-V McBSPs
• 1000 Mbps Ethernet MAC (EMAC)
• IEEE 802.3 Compliant
• Supports SGMII, v1.8 Compliant
• 8 Independent Transmit (TX) and 8 Independent Receive (RX) Channels
• Six 64-Bit General-Purpose Timers
• Configurable up to Twelve 32-Bit Timers
• Configurable in a Watchdog Timer mode
• 16 General-Purpose I/O (GPIO) Pins
• Internal Semaphore Module
• Software Method to Control Access to Shared Resources
• 32 General Purpose Semaphore Resources
• System PLL and PLL Controller
• DDR PLL and PLL Controller, Dedicated to DDR2 Memory Controller
• IEEE-1149.1 and IEEE-1149.6 (JTAG™) Boundary-Scan-Compatible
• 561-Pin Ball Grid Array (BGA) Packages (CUN, GUN, or ZUN Suffix), 0.8-mm Ball Pitch
• 0.065-µm/7-Level Cu Metal Process (CMOS)
• SmartReflex™ Class 0 Enabled - 0.9-V to 1.2-V Adaptive Core Voltage
• 1.8-V, 1.1-V I/Os
Note:Advance Information is presented in this document for the C6474 1.2-GHz extended temperature device.
技术参数
- 制造商编号
:TMS320C6474
- 生产厂家
:TI
- On-chip L2 cache/RAM
:3072 KB
- Total on-chip memory (KB)
:3200
- Operating systems
:DSP/BIOS
- DRAM
:DDR2SDRAM
- Ethernet MAC
:10/100/1000
- Serial I/O
:I2CRapidIOMcBSP
- I2C
:1
- Approx. price(US$)
:164.22|1ku
- Operating temperature range(C)
:-40 to 100-40 to 950 to 85
- Rating
:Catalog
供应商 | 型号 | 品牌 | 批号 | 封装 | 库存 | 备注 | 价格 |
---|---|---|---|---|---|---|---|
TI(德州仪器) |
24+ |
NA/ |
8735 |
原厂直销,现货供应,账期支持! |
询价 | ||
TI(德州仪器) |
24+ |
FCCSP561(23x23) |
7350 |
现货供应,当天可交货!免费送样,原厂技术支持!!! |
询价 | ||
TI |
2016+ |
BGA |
2000 |
只做原装,假一罚十,公司可开17%增值税发票! |
询价 | ||
TI |
23+ |
13+ |
1 |
全新原装假一赔十 |
询价 | ||
TI |
23+ |
FCBGA-561 |
420 |
原厂原装 |
询价 | ||
TI/德州仪器 |
24+ |
BGAQFP |
15050 |
原厂支持公司优势现货 |
询价 | ||
Texas Instruments |
20+ |
BGA-561 |
15988 |
TI全新DSP-可开原型号增税票 |
询价 | ||
TI |
21+ |
BGA |
10000 |
原装现货假一罚十 |
询价 | ||
TI |
24+ |
SMD |
1680 |
TI一级代理商专营进口原装现货假一赔十 |
询价 | ||
TI |
2017+ |
BGA |
6528 |
只做原装正品!假一赔十! |
询价 |