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TMS320C6474数据手册集成电路(IC)的DSP(数字信号处理器)规格书PDF

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厂商型号

TMS320C6474

参数属性

TMS320C6474 封装/外壳为561-BFBGA,FCCSPBGA;包装为托盘;类别为集成电路(IC)的DSP(数字信号处理器);产品描述:IC DSP MULTICORE 561CSP

功能描述

多核数字信号处理器

封装外壳

561-BFBGA,FCCSPBGA

制造商

TI Texas Instruments

中文名称

德州仪器 美国德州仪器公司

数据手册

下载地址下载地址二

更新时间

2025-8-15 23:01:00

人工找货

TMS320C6474价格和库存,欢迎联系客服免费人工找货

TMS320C6474规格书详情

描述 Description

The TMS320C64x+ DSPs (including the TMS320C6474 device) are the highest-performance multicore DSP generation in the TMS320C6000™ DSP platform.
The C6474 device is based on the third-generation high-performance, advanced VelociTI™ very-long-instruction-word (VLIW) architecture developed by Texas Instruments (TI).
The C64x+™ devices are upward code-compatible from previous devices that are part of the C6000™ DSP platform.

特性 Features

• Key Features
• High-Performance Multicore DSP (C6474)
• Instruction Cycle Time: 0.83 ns (1.2-GHz Device); 1 ns (1-GHz Device); 1.18 ns (850-MHz Device)
• Clock Rate: 1 GHz to 1.2 GHz (1.2-GHz Device); 1 GHz (1-GHz Device); 850 MHz (850-MHz Device)
• Commercial Temperature and Extended Tmperature
• 3 TMS320C64x+™ DSP Cores; Six RSAs for CDMA Processing (2 per core)
• Enhanced VCP2/TCP2
• Frame Synchronization Interface
• 16-/32-Bit DDR2-667 Memory Controller
• EDMA3 Controller
• Antenna Interface
• Two 1x Serial RapidIO® Links, v1.2 Compliant
• One 1.8-V Inter-Integrated Circuit (I2C) Bus
• Two 1.8-V McBSPs
• 1000 Mbps Ethernet MAC (EMAC)
• Six 64-Bit General-Purpose Timers
• 16 General-Purpose I/O (GPIO) Pins
• Internal Semaphore Module non-UMTS Systems
• System PLL and PLL Controller/DDR PLL and PLL Controller, Dedicated to DDR2 Memory Controller

• High-Performance Multicore DSP (C6474)
• Instruction Cycle Time:
• 1.2-GHz Device: 1.0-ns to 0.83-ns
• 1-GHz Device: 1-ns
• 850-MHz Device: 1.18 ns

• Clock Rate:
• 1.2-GHz Device: 1-GHz to 1.2-GHz
• 1-GHz Device: 1-GHz
• 850-MHz Device: 850 MHz

• Eight 32-Bit Instructions/Cycle
• Commercial Temperature:
• 1.2-GHz Device: 0°C to 95°C
• 1-GHz Device: 0°C to 100°C
• 850-MHZ and 1-GHz Device: 0°C to 100°C

• Extended Temperature:
• 1.2-GHz Device: -40°C to 95°C
• 1-GHz Device: -40°C to 100°C


• 3 TMS320C64x+™ DSP Cores
• Dedicated SPLOOP Instructions
• Compact Instructions (16-Bit)
• Exception Handling

• TMS320C64x+ Megamodule L1/L2 Memory Architecture
• 256 K-Bit (32 K-Byte) L1P Program Cache [Direct Mapped]
• 256 K-Bit (32 K-Byte) L1D Data Cache [2-Way Set-Associative]
• 512 K-Bit (64 K-Byte) L3 ROM

• Enhanced VCP2
• Supports Over 694 7.95-Kbps AMR

• Enhanced Turbo Decoder Coprocessor (TCP2)
• Supports up to Eight 2-Mbps 3 GPP (6 Iterations)

• Endianness: Little Endian, Big Endian
• Frame Synchronization Interface
• Time Alignment Between Internal Subsystems, External Devices/System
• OBSAI RP1 Compliant for Frame Burst Data
• Alternate Interfaces for non-RP1 and non-UMTS Systems

• 16-/32-Bit DDR2-667 Memory Controller
• EDMA3 Controller (64 Independent Channels)
• Antenna Interface
• 6 Configurable Links (Full Duplex)
• Supports OBSAI RP3 Protocol, v1.0: 768-Mbps, 1.536-, 3.072-Gbps Link Rates
• Supports CPRI Protocol V2.0:614.4-Mbps, 1.2288-, 2.4576-Gbps Link Rates
• Clock Input Independent or Shared with CPU (Selectable at Boot-Time)

• Two 1x Serial RapidIO® Links, v1.2 Compliant
• 1.25-, 2.5-, 3.125-Gbps Link Rates
• Message Passing and DirectIO Support
• Error Management Extensions and Congestion Control

• One 1.8-V Inter-Integrated Circuit (I2C) Bus
• Two 1.8-V McBSPs
• 1000 Mbps Ethernet MAC (EMAC)
• IEEE 802.3 Compliant
• Supports SGMII, v1.8 Compliant
• 8 Independent Transmit (TX) and 8 Independent Receive (RX) Channels

• Six 64-Bit General-Purpose Timers
• Configurable up to Twelve 32-Bit Timers
• Configurable in a Watchdog Timer mode

• 16 General-Purpose I/O (GPIO) Pins
• Internal Semaphore Module
• Software Method to Control Access to Shared Resources
• 32 General Purpose Semaphore Resources

• System PLL and PLL Controller
• DDR PLL and PLL Controller, Dedicated to DDR2 Memory Controller
• IEEE-1149.1 and IEEE-1149.6 (JTAG™) Boundary-Scan-Compatible
• 561-Pin Ball Grid Array (BGA) Packages (CUN, GUN, or ZUN Suffix), 0.8-mm Ball Pitch
• 0.065-µm/7-Level Cu Metal Process (CMOS)
• SmartReflex™ Class 0 Enabled - 0.9-V to 1.2-V Adaptive Core Voltage
• 1.8-V, 1.1-V I/Os
Note:Advance Information is presented in this document for the C6474 1.2-GHz extended temperature device.

技术参数

  • 制造商编号

    :TMS320C6474

  • 生产厂家

    :TI

  • On-chip L2 cache/RAM

    :3072 KB

  • Total on-chip memory (KB)

    :3200

  • Operating systems

    :DSP/BIOS

  • DRAM

    :DDR2SDRAM

  • Ethernet MAC

    :10/100/1000

  • Serial I/O

    :I2CRapidIOMcBSP

  • I2C

    :1

  • Approx. price(US$)

    :164.22|1ku

  • Operating temperature range(C)

    :-40 to 100-40 to 950 to 85

  • Rating

    :Catalog

供应商 型号 品牌 批号 封装 库存 备注 价格
TI(德州仪器)
24+
NA/
8735
原厂直销,现货供应,账期支持!
询价
TI(德州仪器)
24+
FCCSP561(23x23)
7350
现货供应,当天可交货!免费送样,原厂技术支持!!!
询价
TI
2016+
BGA
2000
只做原装,假一罚十,公司可开17%增值税发票!
询价
TI
23+
13+
1
全新原装假一赔十
询价
TI
23+
FCBGA-561
420
原厂原装
询价
TI/德州仪器
24+
BGAQFP
15050
原厂支持公司优势现货
询价
Texas Instruments
20+
BGA-561
15988
TI全新DSP-可开原型号增税票
询价
TI
21+
BGA
10000
原装现货假一罚十
询价
TI
24+
SMD
1680
TI一级代理商专营进口原装现货假一赔十
询价
TI
2017+
BGA
6528
只做原装正品!假一赔十!
询价