丝印：TDA；Package：FCBGA；TDA3x SoC for Advanced Driver Assistance Systems (ADAS) 15mm Package (ABF) Silicon Revision 2.0

文件：4.04024 Mbytes 页数：271 Pages

TI

德州仪器

丝印：TDA；Package：FCBGA；TDA3x SoC for Advanced Driver Assistance Systems (ADAS) 15mm Package (ABF) Silicon Revision 2.0

文件：3.96085 Mbytes 页数：271 Pages

TI

德州仪器

丝印：TDA；Package：FCBGA；TDA3x SoC for Advanced Driver Assistance Systems (ADAS) 15mm Package (ABF) Silicon Revision 2.0

文件：4.04024 Mbytes 页数：271 Pages

TI

德州仪器

Ultra-miniature Surface Mount Half-pitch DIP Switches

Features/Benefits • Bifurcated contact for increased electrical reliability • Process sealed for surface mount soldering and washable processing • RoHS complian

文件：242.96 Kbytes 页数：3 Pages

CK-COMPONENTS

力特

PROXIMITY DETECTORS

Description These monolithic integrated circuits are designed for metallic body detection by sensing variations in high frequency Eddy current losses. Using an externally-tuned circuit, they act as oscillators. The output signal level is altered by an approaching metallic object. The output

文件：125.3 Kbytes 页数：6 Pages

STMICROELECTRONICS

意法半导体

PROXIMITY DETECTORS

Description These monolithic integrated circuits are designed for metallic body detection by sensing variations in high frequency Eddy current losses. Using an externally-tuned circuit, they act as oscillators. The output signal level is altered by an approaching metallic object. The output

文件：125.3 Kbytes 页数：6 Pages

STMICROELECTRONICS

意法半导体

PROXIMITY DETECTORS

Description These monolithic integrated circuits are designed for metallic body detection by sensing variations in high frequency Eddy current losses. Using an externally-tuned circuit, they act as oscillators. The output signal level is altered by an approaching metallic object. The output

文件：125.3 Kbytes 页数：6 Pages

STMICROELECTRONICS

意法半导体

Ultra-miniature Surface Mount Half-pitch DIP Switches

Features/Benefits • Bifurcated contact for increased electrical reliability • Tin-lead plated terminals for reliable solder coverage • Process sealed for surface mount soldering and washable processing • RoHS compliant - options available Typical Applications • Hand-held electronic devices

文件：126.3 Kbytes 页数：1 Pages

ITT

Ultra-miniature Surface Mount Half-pitch DIP Switches

Features/Benefits • Bifurcated contact for increased electrical reliability • Tin-lead plated terminals for reliable solder coverage • Process sealed for surface mount soldering and washable processing • RoHS compliant - options available Typical Applications • Hand-held electronic devices

文件：126.3 Kbytes 页数：1 Pages

ITT

Ultra-miniature Surface Mount Half-pitch DIP Switches

Features/Benefits • Bifurcated contact for increased electrical reliability • Tin-lead plated terminals for reliable solder coverage • Process sealed for surface mount soldering and washable processing • RoHS compliant - options available Typical Applications • Hand-held electronic devices

文件：126.3 Kbytes 页数：1 Pages

ITT