Surface Mount Package Polarity: Cathode Bar

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DIODES

美台半导体

The SOD123-FL package is part of the FLAT series of compact surface mount packages which allow communication equipment to be miniaturized.

FEATURES Cu connector structure to reduce inductance and resistance Enhanced thermal properties Turnkey with test and packing services Green materials: Pb-free plating & halogen-free mold compound Applications The FLAT package series is suitable for small and medium size high‑efficienc

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AMKOR

安靠科技

SILICON BIDIRECTIONAL TRIGGER DIODES

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YFWDIODE

佑风微

Bare copper leadframe with no plating

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AMKOR

安靠科技

Silicon Bidirectional Trigger Diodes

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YFWDIODE

佑风微