Bare copper leadframe with no plating

文件：446.35 Kbytes 页数：2 Pages

AMKOR

安靠科技

The SOD123-FL package is part of the FLAT series of compact surface mount packages which allow communication equipment to be miniaturized.

FEATURES Cu connector structure to reduce inductance and resistance Enhanced thermal properties Turnkey with test and packing services Green materials: Pb-free plating & halogen-free mold compound Applications The FLAT package series is suitable for small and medium size high‑efficienc

文件：573.11 Kbytes 页数：2 Pages

AMKOR

安靠科技

Packaging Information

文件：173.8 Kbytes 页数：2 Pages

TOREX

特瑞仕

Automotive P-Channel 12 V (D-S) 175 째C MOSFET

文件：219.67 Kbytes 页数：8 Pages

VISHAYVishay Siliconix

威世威世科技公司

Automotive P-Channel 12 V (D-S) 175 째C MOSFET

文件：222.22 Kbytes 页数：8 Pages

VISHAYVishay Siliconix

威世威世科技公司