SN74LVTH162241中文资料具有总线保持、TTL 兼容型 CMOS 输入和三态输出的 16 通道、2.7V 至 3.6V 缓冲器数据手册TI规格书

描述 Description

These 16-bit buffers/drivers are designed specifically for low-voltage (3.3-V) VCC operation, but with the capability to provide a TTL interface to a 5-V system environment. The devices can be used as four 4-bit buffers, two 8-bit buffers, or one 16-bit buffer. The devices provide noninverting outputs and complementary output-enable (OE and OE) inputs. The outputs, which are designed to source or sink up to 12 mA, include equivalent 22- series resistors to reduce overshoot and undershoot. When VCC is between 0 and 1.5 V, the devices are in the high-impedance state during power up or power down. However, to ensure the high-impedance state above 1.5 V, OE should be tied to VCC through a pullup resistor and OE should be tied to GND through a pulldown resistor; the minimum value of the resistor is determined by the current-sinking/current-sourcing capability of the driver. Active bus-hold circuitry is provided to hold unused or floating data inputs at a valid logic level. These devices are fully specified for hot-insertion applications using Ioff and power-up 3-state. The Ioff circuitry disables the outputs, preventing damaging current backflow through the devices when they are powered down. The power-up 3-state circuitry places the outputs in the high-impedance state during power up and power down, which prevents driver conflict. The SN54LVTH162241 is characterized for operation over the full military temperature range of -55°C to 125°C. The SN74LVTH162241 is characterized for operation from -40°C to 85°C.

特性 Features

• Members of the Texas Instruments Widebus™ Family
• Output Ports Have Equivalent 22- Series Resistors, So No External Resistors Are Required
• Support Unregulated Battery Operation Down to 2.7 V
• Ioff and Power-Up 3-State Support Hot Insertion
• Distributed VCC and GND Pin Configuration Minimizes High-Speed Switching Noise
• Latch-Up Performance Exceeds 500 mA Per JESD 17
• Package Options Include Plastic Shrink Small-Outline (DL) and Thin Shrink Small-Outline (DGG) Packages and 380-mil Fine-Pitch Ceramic Flat (WD) Package Using 25-mil Center-to-Center Spacings
Widebus is a trademark of Texas Instruments.