SN74LVT573数据手册集成电路（IC）的锁存器规格书PDF

描述 Description

These octal latches are designed specifically for low-voltage (3.3-V) VCC operation, but with the capability to provide a TTL interface to a 5-V system environment.
The eight latches of the 'LVT573 are transparent D-type latches. While the latch-enable (LE) input is high, the Q outputs follow the data (D) inputs. When LE is taken low, the Q outputs are latched at the logic levels set up at the D inputs.
A buffered output-enableinput can be used to place the eight outputs in either a normal logic state (high or low logic levels) or a high-impedance state. In the high-impedance state, the outputs neither load nor drive the bus lines significantly. The high-impedance state and increased drive provide the capability to drive bus lines without need for interface or pullup components. does not affect the internal operations of the latches. Old data can be retained or new data can be entered while the outputs are in the high-impedance state.
Active bus-hold circuitry is provided to hold unused or floating data inputs at a valid logic level.
To ensure the high-impedance state during power up or power down,should be tied to VCC through a pullup resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver.
The SN74LVT573 is available in TI's shrink small-outline package (DB), which provides the same I/O pin count and functionality of standard small-outline packages in less than half the printed-circuit-board area.
The SN54LVT573 is characterized for operation over the full military temperature range of -55°C to 125°C. The SN74LVT573 is characterized for operation from -40°C to 85°C.

特性 Features

• State-of-the-Art Advanced BiCMOS Technology (ABT) Design for3.3-V Operation and Low Static Power Dissipation
• Support Mixed-Mode Signal Operation (5-V Input and OutputVoltages With 3.3-V VCC)
• Support Unregulated Battery Operation Down to 2.7 V
• Typical VOLP (Output Ground Bounce)CC = 3.3 V, TA = 25°C
• ESD Protection Exceeds 2000 V Per MIL-STD-883C, Method 3015;Exceeds 200 V Using Machine Model (C = 200 pF, R = 0)
• Latch-Up Performance Exceeds 500 mA Per JEDEC Standard JESD-17
• Bus-Hold Data Inputs Eliminate the Need for External PullupResistors
• Support Live Insertion
• Package Options Include Plastic Small-Outline (DW), ShrinkSmall-Outline (DB), and Thin Shrink Small-Outline (PW) Packages,Ceramic Chip Carriers (FK), Ceramic Flat (W) Packages, and Ceramic(J) DIPs