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ACDBQC0230R-HF

SMDSchottkyBarrierDiode

Features -Lowreversecurrent. -Designedformountingonsmallsurface. -Extremelythin/leadlesspackage. -Majoritycarrierconduction. -AEC-Q101Qualified.

COMCHIPComchip Technology

典琦典琦科技股份有限公司

ACDBUC0230-HF

SMDSchottkyBarrierDiode

COMCHIPComchip Technology

典琦典琦科技股份有限公司

ALN0230

InternallyMatchedLNAModule

ASB

Advanced Semiconductor Business Inc.

ALN0230

InternallyMatchedLNAModule

ASB

Advanced Semiconductor Business Inc.

AR0230

FullHDDigitalImageSensor

ONSEMION Semiconductor

安森美半导体安森美半导体公司

AR0230CS

1/2.7-Inch2.1Mp/FullHDDigitalImageSensor

ONSEMION Semiconductor

安森美半导体安森美半导体公司

AR0230CS

1/2.7?릋nch2.1Mp/FullHDDigitalImageSensor

ONSEMION Semiconductor

安森美半导体安森美半导体公司

ASB0230

SMDSchottkyBarrierDiode

Features IO=200mA VR=30V -Designedformountingonsmallsurface. -Extremelythinpackage. -Lowdrop-downvoltage. -Majoritycarrierconduction -Lead-freedevice MechanicalData -Case:0603(1608)1005(2512)standardpackage,moldedplastic. -Terminals:Goldplated,sold

ANACHIP

易亨易亨电子股份有限公司

B0230D

N-ChannelMOSFETusesadvancedtrenchtechnology

DOINGTERSHENZHEN DOINGTER SEMICONDUCTOR CO., LTD.

杜因特深圳市杜因特半导体有限公司

CDBER0230L

SMDSchottkyBarrierDiode

Io=200mA VR=30Volts Features Lowforwardvoltage. Designedformountingonsmallsurface. Extremelythin/leadlesspackage. Majoritycarrierconduction. Mechanicaldata Case:0503(1308)standardpackage,moldedplastic. Terminals:Goldplated,solderableperMIL-S

COMCHIPComchip Technology

典琦典琦科技股份有限公司

CDBER0230L-HF

SMDSchottkyBarrierDiode

Io=200mA VR=30Volts RoHSDevice HalogenFree Features -Lowforwardvoltage. -Designedformountingonsmallsurface. -Extremelythin/leadlesspackage. -Majoritycarrierconduction. Mechanicaldata -Case:0503/SOD-723Fstandardpackage,moldedplastic. -Terminals:Goldplated

COMCHIPComchip Technology

典琦典琦科技股份有限公司

CDBER0230R

SMDSchottkyBarrierDiode

Io=200mA VR=30Volts Features Lowreversecurrent. Designedformountingonsmallsurface. Extremelythin/leadlesspackage. Majoritycarrierconduction. Mechanicaldata Case:0503(1308)standardpackage,moldedplastic. Terminals:Goldplated,solderableperMIL-S

COMCHIPComchip Technology

典琦典琦科技股份有限公司

CDBER0230R-HF

SMDSchottkyBarrierDiode

Io=200mA VR=30Volts RoHSDevice HalogenFree Features -Lowforwardvoltage. -Designedformountingonsmallsurface. -Extremelythin/leadlesspackage. -Majoritycarrierconduction. Mechanicaldata -Case:0503/SOD-723Fstandardpackage,moldedplastic. -Terminals:Goldplated

COMCHIPComchip Technology

典琦典琦科技股份有限公司

CDBERT0230R

SMDSchottkyBarrierDiode

Io=200mA VR=30Volts Features Lowreversecurrent. Designedformountingonsmallsurface. Extremelythin/leadlesspackage. Majoritycarrierconduction. Mechanicaldata Case:0503(1308)standardpackage,moldedplastic. Terminals:Goldplated,solderableperMIL-S

COMCHIPComchip Technology

典琦典琦科技股份有限公司

CDBF0230

SMDSchottkyBarrierDiode

Io=200mA VR=30Volts Features Designedformountingonsmallsurface. Extremelythin/leadlesspackage. Lowdrop-downvoltage. Majoritycarrierconduction. Mechanicaldata Case:1005(2512)Standardpackage,moldedplastic. Terminals:Goldplated,solderableperMIL

COMCHIPComchip Technology

典琦典琦科技股份有限公司

CDBF0230-HF

SMDSchottkyBarrierDiode

Io=200mA RoHSDevice HalogenFree VR=30Volts Features -Designedformountingonsmallsurface. -Extremelythin/leadlesspackage. -Majoritycarrierconduction. -Lowdrop-downvoltage. Mechanicaldata -Case:1005/SOD-323Fstandardpackage,moldedplastic. -Terminals:Goldplat

COMCHIPComchip Technology

典琦典琦科技股份有限公司

CDBF0230L

SMDSchottkyBarrierDiode

Io=200mA VR=30Volts Features LowforwardVoltage Designedformountingonsmallsurface. Extremelythin/leadlesspackage. Majoritycarrierconduction. Mechanicaldata Case:SOD-323F(2512)Standardpackage,moldedplastic. Terminals:Goldplated,solderableperMI

COMCHIPComchip Technology

典琦典琦科技股份有限公司

CDBF0230L-HF

SMDSchottkyBarrierDiode

Io=200mA VR=30Volts Features Halogenfree. Lowforwardvoltage. Designedformountingonsmallsurface. Extremelythin/leadlesspackage. Majoritycarrierconduction. Mechanicaldata Case:1005(2512)standardpackagemoldedplastic. Terminals:Goldplated,sol

COMCHIPComchip Technology

典琦典琦科技股份有限公司

CDBF0230R

SMDSchottkyBarrierDiode

Io=200mA VR=30Volts Features LowforwardVoltage Designedformountingonsmallsurface. Extremelythin/leadlesspackage. Majoritycarrierconduction. Mechanicaldata Case:SOD-323F(2512)Standardpackage,moldedplastic. Terminals:Goldplated,solderableperMI

COMCHIPComchip Technology

典琦典琦科技股份有限公司

CDBF0230R-HF

SMDSchottkyBarrierDiode

Io=200mA VR=30Volts Features Halogenfree. Lowreversecurrent. Designedformountingonsmallsurface. Extremelythin/leadlesspackage. Majoritycarrierconduction. Mechanicaldata Case:1005(2512)standardpackage,moldedplastic. Terminals:Goldplated,solde

COMCHIPComchip Technology

典琦典琦科技股份有限公司

供应商型号品牌批号封装库存备注价格
杰顺通
reel
11200
原厂授权一级代理、全球订货优势渠道、可提供一站式BO
询价
JTCONN
2308+
278827
一级代理,原装正品,公司现货!
询价
现MIURATA
BNX003-01SM02-34
3200
全新原装现货 样品可售
询价
JST
D/C00+
1000
询价
T&B
23+
NA
601
专做原装正品,假一罚百!
询价
PDI
2018+
1580
询价
PDI
2022+
1580
原厂原装,假一罚十
询价
JST
22+
NEW IN ORIGINAL
8700
原装现货
询价
JST
2218+
NEW IN ORIGINAL
5491
一级代理/分销渠道价格优势 十年芯程一路只做原装正品
询价
JST
2218+
NEW IN ORIGINAL
5491
询价
更多SM0230-S供应商 更新时间2024-4-30 17:38:00