SKY77704数据手册Skyworks中文资料规格书

描述 Description

Please note: SKY77704-14 and SKY77704-15 are being discontinued and are not recommended for new designs.

The SKY77704 Power Amplifier Module (PAM) is a fully matched 10-pad surface mount moduledeveloped for Wideband Code Division Multiple Access (WCDMA) applications. This small and efficientmodule packs full 824–849 MHz bandwidth coverage into a single compact package. Because of highefficiencies attained throughout the entire power range, the SKY77704 delivers unsurpassed talk-timeadvantages. The SKY77704 meets the stringent spectral linearity requirements of High SpeedDownlink Packet Access (HSDPA), High Speed Uplink Packet Access (HSUPA), and Long TermEvolution (LTE) data transmission with high power added efficiency. A directional coupler is integratedinto the module thus eliminating the need for any external coupler.

The single Gallium Arsenide (GaAs) Microwave Monolithic Integrated Circuit (MMIC) contains all activecircuitry in the module. The MMIC contains on-board bias circuitry, as well as input and interstagematching circuits. Output match into a 50-ohm load is realized off-chip within the module package tooptimize efficiency and power performance.

The SKY77704 PAM is manufactured with Skyworks’ InGaP GaAs Heterojunction Bipolar Transistor(HBT) BiFET process that provides for all positive voltage DC supply operation while maintaining highefficiency and good linearity. Primary bias to the SKY77704 is supplied directly from any three-cellNi-Cd, a single-cell Li-Ion, or other suitable battery with an output in the 3.2 to 4.2 volt range. NoVREF voltage is required. Power down is accomplished by setting the voltage on VENABLE to zerovolts. No external supply side switch is needed as typical “off” leakage is a few microamperes withfull primary voltage supplied from the battery.

特性 Features

• Low voltage positive bias supply 3.2 V to 4.2 V
• Good linearity
• High efficiency- 40% @ 28.25 dBm
• Large dynamic range
• Small, low profile package- 3 x 3 x 0.9 mm- 10-pad configuration
• Power down control
• InGaP
• Supports low collector voltage operation
• Digital Enable
• No VREF required
• CMOS compatible control signals
• Integrated Directional Coupler