SKY77651-11数据手册Skyworks中文资料规格书

描述 Description

Please note: SKY77651-11 is being discontinued and is not recommended for new designs. Skyworks SKY77651-11 SkyLiTE™ is a multimode multiband (MMMB) Power Amplifier Module (PAM) that supports 3G / 4G handsets and operates efficiently in CDMA, WCDMA, and LTE modes. The module is fully programmable through a Mobile Industry Processor Interface (MIPI®).

The PAM consists of a WCDMA / LTE block for low band, a Multi-Function Control (MFC) block, and RF input/output ports internally matched to 50 \u001E to reduce the number of external components. A CMOS integrated circuit uses standard MIPI controls to provide the internal MFC interface and operation. Extremely low leakage current maximizes handset standby time.

The InGaP die and the silicon die and passive components are mounted on a multi-layer laminate substrate. The assembly is encapsulated in a 4.0 mm x 2.8 mm x 0.75 mm, 24-pad MCM, SMT package which allows for a highly manufacturable, low cost solution.

3G: The SKY77651-11 supports CDMA, WCDMA, High-Speed Downlink Packet Access (HSDPA), High Speed Uplink Packet Access (HSUPA), and High Speed Packet Access (HSPA+) modulations. Varying the input power level provides output power control. VCC is adjusted using a DCDC converter to maximize efficiency for each power level and modulation type.

4G: The SKY77651-11 supports 1.4, 3, 5, 10, 15, 20 MHz channel bandwidths. Similar to 3G operation, output power is controlled by varying the input power and VCC is adjusted using a DCDC converter to maximize efficiency for each power level.

3G / 4G Modulation scheme includes:WCDMA Voice Release 99HSDPA categoriesHSUPAHSPA+CDMA2000 1x RC1, 1x RC3CDMA2000 EVDOLTE 1.4, 3, 5, 10, 15, 20 MHz Channel BW

特性 Features

• Paired with SKY77652 (Mid-band / High Band)
• Seven outputs
• Industry-leading PAE for 3G/4G
• Optimized for APT DCDC operation
• Fully programmable Mobile Industry Processor Interface (MIPI) control
• MIPI programmable bias modes optimize efficiency / linearity trade-off for 3G and 4G; minimizes DG09 for 3G.
• Small, low profile package: 4.0 mm x 2.8 mm x 0.75 mm, 24-pad configuration

应用 Application

• Smartphones

• 4G LTE