SKY77656-11数据手册Skyworks中文资料规格书

描述 Description

The SKY77656-11 is a hybrid, multimode multiband (MMMB) Power Amplifier Module (PAM) that supports 2.5G and 3G / 4G handsets and operates efficiently in GSM, EGPRS, EDGE, WCDMA, and LTE modes. The PAM consists of a GSM 800/EGSM 900 PA block, a DCS1800/PCS1900 PA block, separate WCDMA blocks operating in low and high bands, a logic control block for multiple power control levels, and band enable functions in both cellular and UMTS. RF I/O ports are internally matched to 50 \u001E to minimize the number of external components. Extremely low leakage current maximizes handset standby time. The InGaP/GaAs die and passive components are mounted on a multi-layer laminate substrate and the assembly encapsulated in plastic overmold.

GSM/EDGE: The SKY77656-11 uses a new compact architecture supporting the GSM850, EGSM900, DCS1800 and PCS1900 bands. The PAM also supports 2.5G Class 12 Enhanced General Packet Radio Service (EGPRS) multi-slot operation and EDGE linear modulation.

WCDMA: The SKY77656-11 uses an enhanced architecture to: support WCDMA, High-Speed Downlink Packet Access (HSDPA), High-Speed Uplink Packet Access (HSUPA), and LTE modulations; cover multiple bands for 3GPP, including bands 1, 2, 3, 4, 5, 8; operate at different power modes. The module is fully controllable via MIPI interface.

TD-SCDMA / TDD LTE: The SKY77656-11 uses an enhanced architecture that supports TD-SCDMA bands 34/39 and TDD LTE band 39.

LTE: The SKY77656-11 meets spectral linearity requirements of LTE modulation with QPSK/16QAM up to 20 MHz bandwidth, including various resource block allocations, with good power-added efficiency. The SKY77656-11 supports LTE Downlink Carrier Aggregation harmonic cases with low harmonic levels.

特性 Features

• Hybrid architecture: separate GSM and 3G / 4G paths
• 50 ohm input and output impedances, integrated DC blocking on all ports
• Separate single-ended GSM and WCDMA inputs and outputs
• Two-wire MIPI® RFFE Control (SCLK, SDATA)
• VCC stages for 2.5G can attach to battery or buck DC/DC
• Small, low profile package:
• 4.3 mm x 6.95 mm x 0.75 mm
• 40-pad configuration

应用 Application

• Smartphones
• 4G LTE