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QCC3086数据手册Qualcomm中文资料规格书

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厂商型号

QCC3086

功能描述

The Qualcomm® QCC3086 is a single chip Bluetooth audio SoC platform designed specifically for USB dongles, optimized for gaming, video and enterprise applications.

制造商

Qualcomm QUALCOMM ATHEROS

中文名称

高通 美国高通公司

数据手册

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更新时间

2025-8-6 20:10:00

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QCC3086规格书详情

描述 Description

QCC3086 is a single chip Bluetooth audio SoC platform designed to enable a rich set of features in a USB dongle form factor, bringing Snapdragon Sound™ Technology Suite to any source device. This solution broadens our Qualcomm S3 Gen 2 Sound Platform portfolio, delivering a dual-mode device qualified to Bluetooth 5.4, leveraging Classic Bluetooth and LE Audio, along with the features of Snapdragon Sound to source devices.

The QCC3086 combines Snapdragon Sound and LE Audio to deliver ultra-low latency of less than 20ms for lag-free wireless audio with voice back-channel for in-game chat. When delivering game audio only, the latency is further reduced. The QCC3086 also brings Snapdragon Sound support with Qualcomm® aptX™ Adaptive and aptX Voice, designed to enable music streaming at up to 24bit 96kHz and hands-free calling with Super Wide Band Voice.

Alternatively, OEMs can utilize the platform to add Auracast™ broadcast audio functionality to dongles and adapters for use with source devices such phones, laptops, TVs and a wide range of other audio equipment. Built for the emerging Bluetooth® LE Audio standard, the QCC3086 is designed to support Auracast™ Broadcast Audio and LE Audio Unicast for music and voice.

特性 Features

• Extremely low-power performance
• Designed to support both classic Bluetooth and LE Audio use cases in a source device
• Bluetooth 5.4 radio
• Ultra-small form factor
• Powerful tri-core processor architecture
• Dual core 32-bit processor application subsystem (up to 80MHz)
• Single core 240Mhz configurable Qualcomm® Kalimba™ DSP audio subsystem (run from ROM)

• Designed to support USB HID DFU and call control
• Support for charger case and other audio source form factors
• Designed to support Snapdragon Sound with latency lower than 20ms including a voice back-channel. When delivering game audio only, the latency is further reduced.
• Software architecture compatible with Qualcomm® QCC518x
• Embedded ROM + RAM and external Q-SPI Flash
• Designed to support LE Audio Unicast, Broadcast and Auracast
• Designed for Snapdragon Sound:
• Support for aptX Voice superior for call quality on uplink and downlink
• Support for aptX Adaptive at resolutions of up to 24bit/96kHz high resolution audio
• Support for Qualcomm® Bluetooth High Speed Link for robustness and stability

• Backwards compatibility to stream classic aptX or aptX HD.

供应商 型号 品牌 批号 封装 库存 备注 价格
QUALCOMM/高通
25+
BGA
880000
明嘉莱只做原装正品现货
询价
QUALCOMM/高通
25+
BGA
996880
只做原装,欢迎来电资询
询价
QUALCOMM/高通
22+
BGA
100000
代理渠道/只做原装/可含税
询价
QUALCOMM/高通
24+
BGA
12000
原装正品 有挂就有货
询价
QUALCOMM/高通
2450+
BGA
8850
只做原装正品假一赔十为客户做到零风险!!
询价
AMP
23+
11200
原厂授权一级代理、全球订货优势渠道、可提供一站式BO
询价
QUALCOMM/高通
24+
VFBGA
79839
代理高通蓝牙芯片原装现货
询价
Qualcomm
24+
3805
询价
QUALCOMM/高通
2402+
81WLNSP
8324
原装正品!实单价优!
询价
ON/安森美
24+
TO-264
13718
只做原装 公司现货库存
询价