QCC3071中文资料An ultra-low power, single-chip audio platform, optimized for use in truly wireless earbuds at a range of tiers.数据手册Qualcomm规格书

描述 Description

Qualcomm® QCC3071 is designed for the future of wireless sound, with support for LE Audio use cases and CD-Lossless (16-bit 44.1kHz) audio with Snapdragon Sound™ technology - our optimized chain of superior audio, connectivity, and mobile innovations.

This dual-mode platform brings LE Audio use cases for audio sharing, gaming and stereo recording supported alongside traditional Bluetooth tech, for the best listening experiences in a wide range of environments.

特性 Features

• Extremely low-power performance
• Designed to support Bluetooth LE Audio use cases
• Bluetooth 5.3 radio
• Ultra-small form factor
• Powerful tri-core processor architecture – supporting complex use cases
• Dual core 32-bit processor application subsystem (up to 80MHz)
• Single core 240 Mhz configurable Qualcomm® Kalimba™ DSP audio subsystem (runs from ROM)

• Qualcomm TrueWireless™ Mirroring technology for improved robustness and a superior user experience
• Designed to support wake-word and/or button activated digital assistants including Amazon Alexa Voice Service and Google Assistant
• Support for Google Fast Pair
• Software architecture compatible with Qualcomm® QCC302x, Qualcomm® QCC304x, Qualcomm® QCC304x and Qualcomm® QCC305x series
• Embedded ROM + RAM and external Q-SPI Flash
• Connectivity to external SRAM or 2nd Flash Device
• On-chip memory for audio buffering
• High-performance audio combined with low-power consumption
• Support for aptX Voice superior for call quality on uplink and downlink
• Support for 24bit/96kHz high resolution audio
• Support for aptX Audio including aptX Adaptive

• cVc
• Support for Qualcomm Adaptive ANC - feedforward, feedback, hybrid and adaptive