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QCC3050数据手册Qualcomm中文资料规格书

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厂商型号

QCC3050

功能描述

Extremely low-power Bluetooth Audio SoC in a BGA package with stacked Flash memory, designed for premium audio feature differentiation in truly wireless earbuds at price-challenged tiers.

制造商

Qualcomm QUALCOMM ATHEROS

中文名称

高通 美国高通公司

数据手册

下载地址下载地址二

更新时间

2025-8-6 20:00:00

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QCC3050规格书详情

描述 Description

Qualcomm® QCC3050 is an ultra-low power, single-chip solution, optimized for use in truly wireless earbuds and designed to support Qualcomm® Snapdragon Sound™ Technology. QCC3050 is designed specifically to help manufacturers to differentiate at a range of tiers by bringing our quad-core architecture and support for our premium audio technologies in the very fast-moving, price-sensitive truly wireless earbud category. 

特性 Features

• Extremely low-power performance
• Bluetooth 5.2 radio
• Ultra-small form factor
• Powerful quad-core processor architecture – designed to support complex use cases
• Dual core 32-bit processor application subsystem (up to 80Mhz)
• Dual core 120Mhz configurable Qualcomm® Kalimba™ DSP audio subsystem (runs from ROM)

• Qualcomm TrueWireless™ Mirroring technology for improved robustness and a superior user experience
• Designed to support wake word and button activated digital assistants including Amazon Alexa Voice Service and Google Assistant
• Support for Google Fast Pair
• Software architecture compatible with Qualcomm® QCC302x and QCC304x series
• Embedded ROM + RAM 
• Integrated FLASH memory for application boot
• High-performance audio combined with low-power consumption
• Qualcomm® aptX™ Adaptive audio for consistent, high quality streaming over Bluetooth at up to 96Khz audio resolution
• Qualcomm® aptX™ Voice for superior call quality on uplink and downlink
• 8th generation Qualcomm® cVc™ Echo Cancelling and Noise Suppression

• 1-ch 99.3dBA Class-D
• 1-ch 101dBA Class-AB
• Support for Qualcomm® Active Noise Cancellation (ANC) – feedforward, feedback and hybrid – and Qualcomm® Adaptive Active Noise Cancellation

供应商 型号 品牌 批号 封装 库存 备注 价格
QUALCOMM/高通
25+
BGA
996880
只做原装,欢迎来电资询
询价
QUALCOMM/高通
24+
BGA
12000
原装正品 有挂就有货
询价
AMP
23+
11200
原厂授权一级代理、全球订货优势渠道、可提供一站式BO
询价
Qualcomm
24+
3805
询价
QUALCOMM/高通
2402+
81WLNSP
8324
原装正品!实单价优!
询价
ON/安森美
24+
TO-264
13718
只做原装 公司现货库存
询价
QUALCOMM/高通
23+
BGA
98900
原厂原装正品现货!!
询价
QUALCOMM/高通
21+
WLNSP
8000
原装正品
询价
QUALCOMM
24+
N/A
780
原装原装原装
询价
QUALCOMM/高通
2025+
32721
询价