QCC3007数据手册Qualcomm中文资料规格书

描述 Description

The QCC3007 flexible System-on-Chip (SoC) support increased OEM customization and are engineered to offer a rich set of audio features which have not typically been associated with mid to low tier Bluetooth wireless audio devices.

The QCC3007 supports Bluetooth headset applications. Coupled with the audio development kit (ADK) and tools, this device helps to provide a flexible, cost effective platform for designing high quality Bluetooth audio products.

A single-chip dual-mode Bluetooth 5 system, QCC3007 SoC features 8th generation Qu....

特性 Features

• Dual-mode Bluetooth 5 qualified radio
• Variants designed to address both headsets/headphones and speaker applications
• Low-power Qualcomm® Kalimba™ DSP with on-chip ROM and RAM, stereo codec, battery charger, switch mode and linear regulators and LED drivers in a single chip solution
• Customizable application code
• Access to technologies such as Link Layer and Dual Mode topologies (LLT/DMT), Qualcomm® aptX™, cVc noise cancellation technology
• A rich set of features, use cases and programmability at more cost-effective price points
• Pin compatible with CSRA64xxx family of products
• Integrated Qualcomm TrueWireless Stereo technology
• Qualcomm® meloD™ Expansion audio processing: 3D stereo widening
• SBC and AAC codecs
• Promotes reduced development time with support of application image and source code, IDE and configuration
• Updated Generic Application Interface Architecture (GAIA) protocol v3