QCC3040数据手册Qualcomm中文资料规格书

描述 Description

Qualcomm® QCC3040 is optimized for use in earbuds and hearables, QCC3040 is a single-chip solution designed to elevate the truly wireless consumer experience and enable robust connectivity, all day wear* and comfort, integrated Active Noise Cancellation (ANC), Voice Assistant support, and Qualcomm TrueWireless™ Mirroring technology.

QCC3040’s BGA package is designed to enable speed of manufacturing and help manufacturers get to market faster with next generation truly wireless earbuds.

特性 Features

• Extremely low-power performance
• Bluetooth 5.2 radio
• Ultra-small form factor
• Powerful tri-core processor architecture – supporting complex use cases
• Dual core 32-bit processor application subsystem (up to 32Mhz)
• Single core 120 configurable Mhz Qualcomm® Kalimba™ DSP audio subsystem (runs from ROM)

• Qualcomm TrueWireless Mirroring technology for improved robustness and seamless user experience
• Designed to support button activated digital assistants including Amazon Alexa Voice Service and Google Assistant
• Support for Google Fast Pair
• Software architecture compatible with Qualcomm® QCC302x Series
• Embedded ROM + RAM
• Integrated FLASH memory for application boot
• High-performance audio combined with low-power consumption
• Qualcomm® aptX™ audio for consistent, high quality streaming over Bluetooth
• 8th generation Qualcomm® cVc™ Echo Cancelling and Noise Suppression with support for 1 mic and 2 mic configurations

• Support for Qualcomm® Active Noise Cancellation (ANC) – feedforward, feedback and hybrid
• 1-ch 99.3dBA Class-D
• 1-ch 101dBA Class-AB