采用 BGA 封装的超低功耗蓝牙音频 SoC

Qualcomm® QCC3040 is optimized for use in earbuds and hearables, QCC3040 is a single-chip solution designed to elevate the truly wireless consumer experience and enable robust connectivity, all day wear* and comfort, integrated Active Noise Cancellation (ANC), Voice Assistant support, and Qualcomm T • Extremely low-power performance\n• Bluetooth 5.2 radio\n• Ultra-small form factor\n• Powerful tri-core processor architecture – supporting complex use cases• Dual core 32-bit processor application subsystem (up to 32Mhz)\n• Single core 120 configurable Mhz Qualcomm® Kalimba™ DSP audio subsystem (r;

Qualcomm

高通

60,000 Usable PLD Gate pASIC3 FPGA Combining High Performance and High Density

[QUICK LOGIC] Product Summary The pASIC 3 FPGA family features up to 60,000 usable PLD gates. pASIC 3 FPGAs are fabricated on a 0.35mm four-layer metal process using Quick Logic’s patented ViaLink technology to provide a unique combination of high performance, high density, low cost, and extreme

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ETCList of Unclassifed Manufacturers

未分类制造商

50ppm/C Max, 50UA in SOT23-3 CMOS VOLTAGE REFERENCE

文件：309.24 Kbytes 页数：13 Pages

TI

德州仪器

50ppm/C Max, 50UA in SOT23-3 CMOS VOLTAGE REFERENCE

文件：412.22 Kbytes 页数：14 Pages

BURR-BROWN