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QCC3040

采用 BGA 封装的超低功耗蓝牙音频 SoC; • Extremely low-power performance\n• Bluetooth 5.2 radio\n• Ultra-small form factor\n• Powerful tri-core processor architecture – supporting complex use cases• Dual core 32-bit processor application subsystem (up to 32Mhz)\n• Single core 120 configurable Mhz Qualcomm® Kalimba™ DSP audio subsystem (runs from ROM)\n\n• Qualcomm TrueWireless Mirroring technology for improved robustness and seamless user experience\n• Designed to support button activated digital assistants including Amazon Alexa Voice Service and Google Assistant\n• Support for Google Fast Pair\n• Software architecture compatible with Qualcomm® QCC302x Series\n• Embedded ROM + RAM\n• Integrated FLASH memory for application boot\n• High-performance audio combined with low-power consumption• Qualcomm® aptX™ audio for consistent, high quality streaming over Bluetooth\n• 8th generation Qualcomm® cVc™ Echo Cancelling and Noise Suppression with support for 1 mic and 2 mic configurations\n\n• Support for Qualcomm® Active Noise Cancellation (ANC) – feedforward, feedback and hybrid\n• 1-ch 99.3dBA Class-D\n• 1-ch 101dBA Class-AB\n;

Qualcomm® QCC3040 is optimized for use in earbuds and hearables, QCC3040 is a single-chip solution designed to elevate the truly wireless consumer experience and enable robust connectivity, all day wear* and comfort, integrated Active Noise Cancellation (ANC), Voice Assistant support, and Qualcomm TrueWireless™ Mirroring technology.\n\nQCC3040’s BGA package is designed to enable speed of manufacturing and help manufacturers get to market faster with next generation truly wireless earbuds.\n\n

QualcommQUALCOMM ATHEROS

高通美国高通公司

QL3040

60,000UsablePLDGatepASIC3FPGACombiningHighPerformanceandHighDensity

[QUICKLOGIC] ProductSummary ThepASIC3FPGAfamilyfeaturesupto60,000usablePLDgates.pASIC3FPGAsarefabricatedona0.35mmfour-layermetalprocessusingQuickLogic’spatentedViaLinktechnologytoprovideauniquecombinationofhighperformance,highdensity,lowcost,andextreme

ETC1List of Unclassifed Manufacturers

etc未分类制造商未分类制造商

REF3040

50ppm/CMax,50UAinSOT23-3CMOSVOLTAGEREFERENCE

TITexas Instruments

德州仪器美国德州仪器公司

REF3040

50ppm/CMax,50UAinSOT23-3CMOSVOLTAGEREFERENCE

BURR-BROWN

Burr-Brown (TI)

QCC-5127-0-124CSP-TR-00-0

高通
BGA

高通

供应商型号品牌批号封装库存备注价格
QUALCOMM/高通
24+
BGA
12000
原装正品现货假一赔百
询价
Qualcomm(高通)
24+
N/A
7848
原厂可订货,技术支持,直接渠道。可签保供合同
询价
Qualcomm(高通)
23+
NA
20094
正纳10年以上分销经验原装进口正品做服务做口碑有支持
询价
QUALCOMM/高通
21+
原厂原封
5000
全新原装 现货 价优
询价
QUALCOMM
23+
BGA
50000
全新原装正品现货,支持订货
询价
QUALCOMM/高通
23+
BGA
3000
一级代理原厂VIP渠道,专注军工、汽车、医疗、工业、
询价
QUALCOMM
20+
BGA
201
一级代理,专注军工、汽车、医疗、工业、新能源、电力
询价
QUALCOMM
23+
BGA
2660
原厂原装正品
询价
Qualcomm(高通)
2405+
Original
50000
只做原装优势现货库存,渠道可追溯
询价
QUALCOMM
2023+
BGA
8800
正品渠道现货 终端可提供BOM表配单。
询价
更多QCC3040供应商 更新时间2025-7-30 14:11:00