QCC3024数据手册Qualcomm中文资料规格书
QCC3024规格书详情
描述 Description
The Qualcomm® QCC3024 is an entry-level flash programmable, dual mode Bluetooth v5.0 Audio SoC, based on an extremely low power architecture.
The QCC3024 is available in a VFBGA package and is designed to help customers reduce development time and cost when developing Bluetooth Stereo Headsets.
特性 Features
Bluetooth
Bluetooth Version
• Bluetooth 5.0
Bluetooth Technology
• Bluetooth Low Energy sensor hub
• Dual-mode Bluetooth
Bluetooth Speed
• 2 Mbps
Voice Services
Digital Assistant Activation
• Button press
General Audio
Audio Technology
• Qualcomm® Broadcast Audio technology
• Qualcomm® cVc™ audio technology
Audio Playback Support
• Stereo playback
Qualcomm® cVc™ audio technology
• Up to 2-mic HS cVc
CPU
CPU Clock Speed
• Up to 32MHz
CPU Features
• Programmable Apps CPU
CPU Bit Architecture
• 32-bit
DSP
DSP RAM
• 80kB (P) + 256kB (D)
DSP Technology
• 1x Qualcomm® Kalimba™ DSP
• Configurable DSP
DSP Clock Speed
• 1x 120 MHz DSP
Power Consumption
Amperage
• <6 mA
Package
Package Type
• VFBGA
Pins
• 90 pins
Pitch
• 0.5mm
Package Size
• 5.5 x 5.5 x 1 mm
供应商 | 型号 | 品牌 | 批号 | 封装 | 库存 | 备注 | 价格 |
---|---|---|---|---|---|---|---|
QUALCOMM/高通 |
24+ |
NA/ |
24000 |
优势代理渠道,原装正品,可全系列订货开增值税票 |
询价 | ||
QUALCOMM/高通 |
25+ |
BGA |
880000 |
明嘉莱只做原装正品现货 |
询价 | ||
QUALCOMM/高通 |
25+ |
BGA |
996880 |
只做原装,欢迎来电资询 |
询价 | ||
QUAL |
1952+ |
VFBGA |
4087 |
一级代理,专注军工、汽车、医疗、工业、新能源、电力 |
询价 | ||
Qualcomm(高通) |
23+ |
NA |
20094 |
正纳10年以上分销经验原装进口正品做服务做口碑有支持 |
询价 | ||
QUALCOMM/高通 |
24+ |
BGA |
12000 |
原装正品 有挂就有货 |
询价 | ||
QUALCOMM/高通 |
24+ |
BGA |
12000 |
原装正品实单低 |
询价 | ||
QUALCOMM/高通 |
2450+ |
BGA |
6885 |
只做原装正品假一赔十为客户做到零风险!! |
询价 | ||
Qualcomm |
24+ |
BGA |
39500 |
进口原装现货 支持实单价优 |
询价 | ||
QUALCOMM/高通 |
23+ |
11200 |
原厂授权一级代理、全球订货优势渠道、可提供一站式BO |
询价 |