丝印：060T；Package：CFP15B；60 V, 2 x 2 A dual common cathode low leakage current Trench MEGA Schottky barrier rectifier

1. General description Trench Maximum Efficiency General Application (MEGA) dual Schottky barrier rectifier in common cathode configuration encapsulated in a CFP15B (SOT1289B) power and flat lead Surface- Mounted Device (SMD) plastic package. 2. Features and benefits • Reverse voltage: VR ≤

文件：266.75 Kbytes 页数：14 Pages

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丝印：060TM05E；Package：CFP15B；60 V, 5 A low leakage current Trench MEGA Schottky barrier rectifier

1. General description Trench Maximum Efficiency General Application (MEGA) Schottky barrier rectifier encapsulated in a CFP15B (SOT1289B) power and flat lead Surface-Mounted Device (SMD) plastic package. 2. Features and benefits • Average forward current: IF(AV) ≤ 5 A • Reverse voltage: VR

文件：265.32 Kbytes 页数：12 Pages

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丝印：060T；Package：CFP15B；60 V, 5 A low leakage current Trench MEGA Schottky barrier rectifier

1. General description Trench Maximum Efficiency General Application (MEGA) Schottky barrier rectifier encapsulated in a CFP15B (SOT1289B) power and flat lead Surface-Mounted Device (SMD) plastic package. 2. Features and benefits • Average forward current: IF(AV) ≤ 5 A • Reverse voltage: VR

文件：260.1 Kbytes 页数：12 Pages

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丝印：060TL06C；Package：CFP15B；60 V, 2 x 3 A dual common cathode low leakage current Trench MEGA Schottky barrier rectifier

1. General description Trench Maximum Efficiency General Application (MEGA) dual Schottky barrier rectifier in common cathode configuration encapsulated in a CFP15B (SOT1289B) power and flat lead Surface- Mounted Device (SMD) plastic package. 2. Features and benefits • Reverse voltage: VR ≤

文件：265.3 Kbytes 页数：13 Pages

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丝印：060T；Package：CFP15B；60 V, 2 x 3 A dual common cathode low leakage current Trench MEGA Schottky barrier rectifier

1. General description Trench Maximum Efficiency General Application (MEGA) dual Schottky barrier rectifier in common cathode configuration encapsulated in a CFP15B (SOT1289B) power and flat lead Surface- Mounted Device (SMD) plastic package. 2. Features and benefits • Reverse voltage: VR ≤

文件：267.67 Kbytes 页数：14 Pages

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丝印：060TL08C；Package：CFP15B；60 V, 2 x 4 A dual common cathode low leakage current Trench MEGA Schottky barrier rectifier

1. General description Trench Maximum Efficiency General Application (MEGA) dual Schottky barrier rectifier in common cathode configuration encapsulated in a CFP15B (SOT1289B) power and flat lead Surface- Mounted Device (SMD) plastic package. 2. Features and benefits • Reverse voltage: VR ≤

文件：265.89 Kbytes 页数：13 Pages

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丝印：060T；Package：CFP15B；60 V, 2 x 4 A dual common cathode low leakage current Trench MEGA Schottky barrier rectifier

1. General description Trench Maximum Efficiency General Application (MEGA) dual Schottky barrier rectifier in common cathode configuration encapsulated in a CFP15B (SOT1289B) power and flat lead Surface- Mounted Device (SMD) plastic package. 2. Features and benefits • Reverse voltage: VR ≤

文件：268.27 Kbytes 页数：14 Pages

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丝印：060TL10C；Package：CFP15B；60 V, 2 x 5 A dual common cathode low leakage current Trench MEGA Schottky barrier rectifier

1. General description Trench Maximum Efficiency General Application (MEGA) dual Schottky barrier rectifier in common cathode configuration encapsulated in a CFP15B (SOT1289B) power and flat lead Surface- Mounted Device (SMD) plastic package. 2. Features and benefits • Reverse voltage: VR ≤

文件：266.68 Kbytes 页数：13 Pages

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丝印：060T；Package：CFP15B；60 V, 2 x 5 A dual common cathode low leakage current Trench MEGA Schottky barrier rectifier

1. General description Trench Maximum Efficiency General Application (MEGA) dual Schottky barrier rectifier in common cathode configuration encapsulated in a CFP15B (SOT1289B) power and flat lead Surface- Mounted Device (SMD) plastic package. 2. Features and benefits • Reverse voltage: VR ≤

文件：269.07 Kbytes 页数：14 Pages

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丝印：060VU03E；Package：CFP15B；60 V, 3 A low VF Schottky barrier rectifier

1. General description Planar Low VF Schottky barrier rectifier encapsulated in a CFP15B (SOT1289B) power and flat lead Surface-Mounted Device (SMD) plastic package. 2. Features and benefits • Very low forward voltage • High power capability due to clip-bonding technology • Small and thin

文件：255.93 Kbytes 页数：11 Pages

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