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PMEG045V150EPE

丝印:045V150E;Package:CFP15B;45 V, 15 A low VF Schottky barrier rectifier

1. General description Planar Low VF Schottky barrier rectifier encapsulated in a CFP15B (SOT1289B) power and flat lead Surface-Mounted Device (SMD) plastic package. 2. Features and benefits • Very low forward voltage • High power capability due to clip-bond technology • Small and thin SMD

文件:264.82 Kbytes 页数:11 Pages

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PMEG045V150EPE-Q

丝印:045V;Package:CFP15B;45 V, 15 A low VF Schottky barrier rectifier

1. General description Planar Low VF Schottky barrier rectifier encapsulated in a CFP15B (SOT1289B) power and flat lead Surface-Mounted Device (SMD) plastic package. 2. Features and benefits • Very low forward voltage • High power capability due to clip-bond technology • Small and thin SMD

文件:264.41 Kbytes 页数:11 Pages

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PMEG050T150EIPD

丝印:050T;Package:CFP15;50 V, 15 A low VF Trench MEGA Schottky barrier rectifier

1. General description Trench Maximum Efficiency General Application (MEGA) Schottky barrier rectifier encapsulated in a CFP15 (SOT1289) power and flat lead Surface-Mounted Device (SMD) plastic package. 2. Features and benefits • Average forward current: IF(AV) ≤ 15 A • Reverse voltage: VR

文件:249.73 Kbytes 页数:11 Pages

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PMEG050V030EPE

丝印:050VU03E;Package:CFP15B;50 V, 3 A low VF Schottky barrier rectifier

1. General description Planar Low VF Schottky barrier rectifier encapsulated in a CFP15B (SOT1289B) power and flat lead Surface-Mounted Device (SMD) plastic package. 2. Features and benefits • Very low forward voltage • High power capability due to clip-bonding technology • Small and thin

文件:256.54 Kbytes 页数:11 Pages

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安世

PMEG050V030EPE-Q

丝印:050V;Package:CFP15B;50 V, 3 A low VF Schottky barrier rectifier

1. General description Planar Low VF Schottky barrier rectifier encapsulated in a CFP15B (SOT1289B) power and flat lead Surface-Mounted Device (SMD) plastic package. 2. Features and benefits • Very low forward voltage • High power capability due to clip-bonding technology • Small and thin

文件:256.16 Kbytes 页数:11 Pages

NEXPERIA

安世

PMEG050V150EPE

丝印:050V150E;Package:CFP15B;50 V, 15 A low VF Schottky barrier rectifier

1. General description Planar Low VF Schottky barrier rectifier encapsulated in a CFP15B (SOT1289B) power and flat lead Surface-Mounted Device (SMD) plastic package. 2. Features and benefits • Very low forward voltage • High power capability due to clip-bond technology • Small and thin SMD

文件:268.69 Kbytes 页数:11 Pages

NEXPERIA

安世

PMEG050V150EPE-Q

丝印:050V;Package:CFP15B;50 V, 15 A low VF Schottky barrier rectifier

1. General description Planar Low VF Schottky barrier rectifier encapsulated in a CFP15B (SOT1289B) power and flat lead Surface-Mounted Device (SMD) plastic package. 2. Features and benefits • Very low forward voltage • High power capability due to clip-bond technology • Small and thin SMD

文件:268.67 Kbytes 页数:11 Pages

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安世

PMEG060T030ELPE

丝印:060TM03E;Package:CFP15B;60 V, 3 A low leakage current Trench MEGA Schottky barrier rectifier

1. General description Trench Maximum Efficiency General Application (MEGA) Schottky barrier rectifier encapsulated in a CFP15B (SOT1289B) power and flat lead Surface-Mounted Device (SMD) plastic package. 2. Features and benefits • Average forward current: IF(AV) ≤ 3 A • Reverse voltage: VR

文件:264.76 Kbytes 页数:12 Pages

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PMEG060T030ELPE-Q

丝印:060T;Package:CFP15B;60 V, 3 A low leakage current Trench MEGA Schottky barrier rectifier

1. General description Trench Maximum Efficiency General Application (MEGA) Schottky barrier rectifier encapsulated in a CFP15B (SOT1289B) power and flat lead Surface-Mounted Device (SMD) plastic package. 2. Features and benefits • Average forward current: IF(AV) ≤ 3 A • Reverse voltage: VR

文件:259.56 Kbytes 页数:12 Pages

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PMEG060T040CLPE

丝印:060TL04C;Package:CFP15B;60 V, 2 x 2 A dual common cathode low leakage current Trench MEGA Schottky barrier rectifier

1. General description Trench Maximum Efficiency General Application (MEGA) dual Schottky barrier rectifier in common cathode configuration encapsulated in a CFP15B (SOT1289B) power and flat lead Surface- Mounted Device (SMD) plastic package. 2. Features and benefits • Reverse voltage: VR ≤

文件:266.51 Kbytes 页数:14 Pages

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技术参数

  • ESD:

    Y

  • Vds(V):

    100

  • Vgs(±V):

    20

  • Id(A):

    0.17

  • Vgs(th)(typ V):

    2

  • Rds(on)(mΩ typ) @Vgs=10V:

  • Rds(on)(mΩ typ) @Vgs=4.5V:

    4.3Ω

  • Package:

    SOT-23

供应商型号品牌批号封装库存备注价格
KEMET
三年内
1983
只做原装正品
询价
恩XP
24+
SOD-323
5000
全现原装公司现货
询价
恩XP
23+
SOD128
3200
询价
恩XP
24+
9000
询价
24+/25+
1
原装正品现货库存价优
询价
恩XP
19+
SOD1608
16200
原装正品,现货特价
询价
NEXPERIA
22+21+
SOD323
30000
全新进口原装现货QQ:505546343手机13032182425曹小姐
询价
5
全新原装 货期两周
询价
EVOXRIFA
24+
12
原装现货,可开13%税票
询价
恩XP
25+
SOT666
2568
原装优势!绝对公司现货
询价
更多PME供应商 更新时间2025-11-27 15:08:00