ULTRAFAST RECTIFIERS

Features: • Ultra-Fast Switching • High Current Capability • Low Reverse Leakage Current • High Surge Current Capability • Plastic Material has UL Flammability Classification 94V-O • This is a Pb − Free Device • All SMC parts are traceable to the wafer lot • Additional testing can be offer

文件：358.47 Kbytes 页数：6 Pages

SMC

桑德斯微电子

Surface Mount Ultrafast Plastic Rectifier

FEATURES • Glass passivated chip junction • Ideal for automated placement • Ultrafast reverse recovery time • Low switching losses, high efficiency • High forward surge capability • Meets MSL level 1, per J-STD-020, LF maximum peak of 260 °C • Solder dip 260 °C, 40 s • Component in accorda

文件：101.42 Kbytes 页数：4 Pages

VishayVishay Siliconix

威世威世科技公司

Surface Mount Ultrafast Plastic Rectifier

FEATURES • Glass passivated chip junction • Ideal for automated placement • Ultrafast reverse recovery time • Low switching losses, high efficiency • High forward surge capability • Meets MSL level 1, per J-STD-020, LF maximum peak of 260 °C • Solder dip 260 °C, 40 s • Component in accorda

文件：101.42 Kbytes 页数：4 Pages

VishayVishay Siliconix

威世威世科技公司

Surface Mount Ultrafast Plastic Rectifier

FEATURES • Glass passivated chip junction • Ideal for automated placement • Ultrafast reverse recovery time • Low switching losses, high efficiency • High forward surge capability • Meets MSL level 1, per J-STD-020, LF maximum peak of 260 °C • Solder dip 260 °C, 40 s • Component in accorda

文件：101.42 Kbytes 页数：4 Pages

VishayVishay Siliconix

威世威世科技公司

Surface Mount Ultrafast Plastic Rectifier

FEATURES • Glass passivated chip junction • Ideal for automated placement • Ultrafast reverse recovery time • Low switching losses, high efficiency • High forward surge capability • Meets MSL level 1, per J-STD-020, LF maximum peak of 260 °C • Solder dip 260 °C, 40 s • Component in accorda

文件：101.42 Kbytes 页数：4 Pages

VishayVishay Siliconix

威世威世科技公司

Surface Mount Ultrafast Plastic Rectifier

FEATURES • Glass passivated chip junction • Ideal for automated placement • Ultrafast reverse recovery time • Low switching losses, high efficiency • High forward surge capability • Meets MSL level 1, per J-STD-020, LF maximum peak of 260 °C • Solder dip 260 °C, 40 s • Component in accorda

文件：101.42 Kbytes 页数：4 Pages

VishayVishay Siliconix

威世威世科技公司

Surface Mount Ultrafast Plastic Rectifier

FEATURES • Glass passivated chip junction • Ideal for automated placement • Ultrafast reverse recovery time • Low switching losses, high efficiency • High forward surge capability • Meets MSL level 1, per J-STD-020, LF maximum peak of 260 °C • Solder dip 260 °C, 40 s • Component in accorda

文件：101.42 Kbytes 页数：4 Pages

VishayVishay Siliconix

威世威世科技公司

Surface Mount Ultrafast Plastic Rectifier

FEATURES • Glass passivated chip junction • Ideal for automated placement • Ultrafast reverse recovery time • Low switching losses, high efficiency • High forward surge capability • Meets MSL level 1, per J-STD-020, LF maximum peak of 260 °C • Solder dip 260 °C, 40 s • Component in accorda

文件：101.42 Kbytes 页数：4 Pages

VishayVishay Siliconix

威世威世科技公司

Surface Mount Ultrafast Plastic Rectifier

FEATURES • Glass passivated chip junction • Ideal for automated placement • Ultrafast reverse recovery time • Low switching losses, high efficiency • High forward surge capability • Meets MSL level 1, per J-STD-020, LF maximum peak of 260 °C • Solder dip 260 °C, 40 s • Component in accorda

文件：101.42 Kbytes 页数：4 Pages

VishayVishay Siliconix

威世威世科技公司

3A ULTRA FAST RECOVERY SURFACE MOUNT RECTIFIER

FEATURES ● LOW PROFILE PACKAGE ● PLASTIC PACKAGE HAS UNDERWRITERS LABORATORY 94V-0 ● IDEAL FOR SURFACE MOUNTED APPLICATION ● GLASS PASSIVATED CHIP JUNCTION ● BUILT-IN STRAIN RELIEF DESIGN ● ULTRA FAST RECOVERY TIME FOR HIGH EFFICIENT ● HIGH TEMPERATURE SOLDERING : 250°C/10 SECONDS AT TERMIN

文件：129.74 Kbytes 页数：2 Pages

FRONTIER